JP2001298112A5 - - Google Patents

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Publication number
JP2001298112A5
JP2001298112A5 JP2000110527A JP2000110527A JP2001298112A5 JP 2001298112 A5 JP2001298112 A5 JP 2001298112A5 JP 2000110527 A JP2000110527 A JP 2000110527A JP 2000110527 A JP2000110527 A JP 2000110527A JP 2001298112 A5 JP2001298112 A5 JP 2001298112A5
Authority
JP
Japan
Prior art keywords
chip
interposer
electronic component
mounting surface
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000110527A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001298112A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000110527A priority Critical patent/JP2001298112A/ja
Priority claimed from JP2000110527A external-priority patent/JP2001298112A/ja
Publication of JP2001298112A publication Critical patent/JP2001298112A/ja
Publication of JP2001298112A5 publication Critical patent/JP2001298112A5/ja
Pending legal-status Critical Current

Links

JP2000110527A 2000-04-12 2000-04-12 電子部品と、この電子部品の実装構造 Pending JP2001298112A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000110527A JP2001298112A (ja) 2000-04-12 2000-04-12 電子部品と、この電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000110527A JP2001298112A (ja) 2000-04-12 2000-04-12 電子部品と、この電子部品の実装構造

Publications (2)

Publication Number Publication Date
JP2001298112A JP2001298112A (ja) 2001-10-26
JP2001298112A5 true JP2001298112A5 (https=) 2005-04-21

Family

ID=18623021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000110527A Pending JP2001298112A (ja) 2000-04-12 2000-04-12 電子部品と、この電子部品の実装構造

Country Status (1)

Country Link
JP (1) JP2001298112A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8525333B2 (en) 2008-03-17 2013-09-03 Renesas Electronics Corporation Electronic device and manufacturing method therefor

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