JP2005150283A5 - - Google Patents

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Publication number
JP2005150283A5
JP2005150283A5 JP2003383617A JP2003383617A JP2005150283A5 JP 2005150283 A5 JP2005150283 A5 JP 2005150283A5 JP 2003383617 A JP2003383617 A JP 2003383617A JP 2003383617 A JP2003383617 A JP 2003383617A JP 2005150283 A5 JP2005150283 A5 JP 2005150283A5
Authority
JP
Japan
Prior art keywords
bga package
pad
pads
circuit component
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003383617A
Other languages
English (en)
Japanese (ja)
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JP2005150283A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003383617A priority Critical patent/JP2005150283A/ja
Priority claimed from JP2003383617A external-priority patent/JP2005150283A/ja
Publication of JP2005150283A publication Critical patent/JP2005150283A/ja
Publication of JP2005150283A5 publication Critical patent/JP2005150283A5/ja
Pending legal-status Critical Current

Links

JP2003383617A 2003-11-13 2003-11-13 Ｂｇａパッケージ Pending JP2005150283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003383617A JP2005150283A (ja) 2003-11-13 2003-11-13 Ｂｇａパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003383617A JP2005150283A (ja) 2003-11-13 2003-11-13 Ｂｇａパッケージ

Publications (2)

Publication Number Publication Date
JP2005150283A JP2005150283A (ja) 2005-06-09
JP2005150283A5 true JP2005150283A5 (https=) 2006-11-24

Family

ID=34692286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003383617A Pending JP2005150283A (ja) 2003-11-13 2003-11-13 Ｂｇａパッケージ

Country Status (1)

Country Link
JP (1) JP2005150283A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4817110B2 (ja) * 2005-12-26 2011-11-16 株式会社村田製作所 多層回路基板及びｉｃパッケージ
JP2007250928A (ja) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp 多層プリント配線板
JP5994958B2 (ja) 2014-09-30 2016-09-21 株式会社村田製作所 半導体パッケージおよびその実装構造
CN110622267A (zh) 2017-05-15 2019-12-27 阿维科斯公司 多层电容器和包括其的电路板
DE112020002865T8 (de) * 2019-06-14 2022-03-17 Canon Kabushiki Kaisha Halbleitermodul-herstellungsverfahren, herstellungsverfahren für ein elektronisches gerät, halbleitermodul und elektronisches gerät
JP7592402B2 (ja) * 2019-06-14 2024-12-02 キヤノン株式会社 半導体モジュールの製造方法、電子機器の製造方法、半導体モジュール、及び電子機器
US11538638B2 (en) * 2020-07-01 2022-12-27 International Business Machines Corporation Co-axial grid array capacitor assembly
US12387877B2 (en) 2021-07-08 2025-08-12 KYOCERA AVX Components Corporation Multilayer ceramic capacitor
CN117941273A (zh) * 2021-08-20 2024-04-26 株式会社村田制作所 高频模块
JP2026510132A (ja) 2022-10-31 2026-04-01 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 多層コンデンサ

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