JP2005183849A - 半導体装置及びその製造方法、並びに電子機器 - Google Patents
半導体装置及びその製造方法、並びに電子機器 Download PDFInfo
- Publication number
- JP2005183849A JP2005183849A JP2003425987A JP2003425987A JP2005183849A JP 2005183849 A JP2005183849 A JP 2005183849A JP 2003425987 A JP2003425987 A JP 2003425987A JP 2003425987 A JP2003425987 A JP 2003425987A JP 2005183849 A JP2005183849 A JP 2005183849A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- terminal
- chip
- semiconductor device
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title description 8
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 claims description 7
- 238000010494 dissociation reaction Methods 0.000 abstract description 8
- 230000005593 dissociations Effects 0.000 abstract description 8
- 230000035939 shock Effects 0.000 description 12
- 230000035882 stress Effects 0.000 description 8
- 230000010365 information processing Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000007688 edging Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13012—Shape in top view
- H01L2224/13014—Shape in top view being circular or elliptic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13012—Shape in top view
- H01L2224/13015—Shape in top view comprising protrusions or indentations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
【解決手段】 第1端子31を複数設けられた基板3と、上記複数の第1端子31のうち少なくとも2つの第1端子31に跨って電気的に接続される第2端子21を有するチップ2とを備える。
【選択図】 図1
Description
このような構成を採用することによって、例えば、チップのエッジ領域に位置する第2端子の下端とチップの中央領域に位置する第3端子の下端とを略同一とすることができるため、回路基板に対するチップの実装を容易に行うことができる。
このような構成を採用することによって、チップの位置に応じて任意に第2端子の形状を設定することができる。
このような特徴を有する本発明に係る電子機器によれば、チップの接続端子と回路基板のランドとの解離がより抑止された半導体装置を備えるため、信頼性が向上された電子機器となる。
図1は、本実施形態に係る半導体装置1の側面図である。この図に示すように、本実施形態に係る半導体装置1は、チップ2と回路基板3とを備えており、チップ2が回路基板3上に実装された構造を有している。
次に、図6及び図7を参照して本発明の第2実施形態について説明する。なお、図6において、(a)は側面図、(b)は平面図である。また、本第2実施形態において、上記第1実施形態と同様の部分については、その説明を省略あるいは簡略化する。
Claims (9)
- 第1端子を複数設けられた基板と、
前記複数の第1端子のうち少なくとも2つの第1端子に跨って電気的に接続される第2端子を有するチップとを備えたことを特徴とする半導体装置。 - 前記第2端子は前記チップの所定面のエッジ領域に設けられていることを特徴とする請求項1記載の半導体装置。
- 前記第2端子は前記チップの矩形状の所定面の四隅のそれぞれに設けられていることを特徴とする請求項1記載の半導体装置。
- 前記第2端子は前記チップの所定面に複数設けられるとともに、前記所定面には前記第2端子よりも小さい第3端子が複数設けられ、
前記複数の第2端子及び前記複数の第3端子の前記所定面に対する高さは互いに略同じであることを特徴とする請求項1〜3のいずれかに記載の半導体装置。 - 前記第2端子は複数設けられ、該複数の第2端子のそれぞれは互いに異なる形状を有することを特徴とする請求項1〜4のいずれかに記載の半導体装置。
- 前記複数の第1端子の大きさは互いに略同じであることを特徴とする請求項1〜5のいずれかに記載の半導体装置。
- 基板上に第1端子を複数設ける工程と、
チップ上に前記複数の第1端子のうち少なくとも2つの第1端子に跨って電気的に接続可能な第2端子を設ける工程と、
前記第1端子と前記第2端子とを電気的に接続する工程とを有することを特徴とする半導体装置の製造方法。 - 基板上に第1端子を複数設ける工程と、
チップ上に前記複数の第1端子のそれぞれに電気的に接続可能な第3端子を複数設ける工程と、
前記第1端子と前記第3端子とを電気的に接続する工程と、
前記複数の第3端子同士の間を導電性材料で補完して少なくとも2つの第1端子に跨って電気的に接続される第2端子を形成する工程とを有することを特徴とする半導体装置の製造方法。 - 請求項1〜請求項6のいずれかに記載の半導体装置を備えることを特徴とする電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003425987A JP2005183849A (ja) | 2003-12-24 | 2003-12-24 | 半導体装置及びその製造方法、並びに電子機器 |
EP04029700A EP1548825A3 (en) | 2003-12-24 | 2004-12-15 | Semiconductor device, manufacturing method thereof and electronic equipment |
CNB2004100817235A CN1303684C (zh) | 2003-12-24 | 2004-12-21 | 半导体装置及其制造方法、以及电子设备 |
US11/023,094 US20050140024A1 (en) | 2003-12-24 | 2004-12-22 | Semiconductor device, manufacturing method thereof and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003425987A JP2005183849A (ja) | 2003-12-24 | 2003-12-24 | 半導体装置及びその製造方法、並びに電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005183849A true JP2005183849A (ja) | 2005-07-07 |
Family
ID=34544956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003425987A Withdrawn JP2005183849A (ja) | 2003-12-24 | 2003-12-24 | 半導体装置及びその製造方法、並びに電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050140024A1 (ja) |
EP (1) | EP1548825A3 (ja) |
JP (1) | JP2005183849A (ja) |
CN (1) | CN1303684C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007073629A (ja) * | 2005-09-05 | 2007-03-22 | Renesas Technology Corp | 半導体素子の構造 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5796169A (en) * | 1996-11-19 | 1998-08-18 | International Business Machines Corporation | Structurally reinforced ball grid array semiconductor package and systems |
JPH1174637A (ja) * | 1997-08-29 | 1999-03-16 | Canon Inc | 電子回路基板 |
US6927491B1 (en) * | 1998-12-04 | 2005-08-09 | Nec Corporation | Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board |
JP3343730B2 (ja) * | 1999-08-27 | 2002-11-11 | 埼玉日本電気株式会社 | 実装基板及び電気部品の実装方法 |
JP4341187B2 (ja) * | 2001-02-13 | 2009-10-07 | 日本電気株式会社 | 半導体装置 |
-
2003
- 2003-12-24 JP JP2003425987A patent/JP2005183849A/ja not_active Withdrawn
-
2004
- 2004-12-15 EP EP04029700A patent/EP1548825A3/en not_active Withdrawn
- 2004-12-21 CN CNB2004100817235A patent/CN1303684C/zh not_active Expired - Fee Related
- 2004-12-22 US US11/023,094 patent/US20050140024A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007073629A (ja) * | 2005-09-05 | 2007-03-22 | Renesas Technology Corp | 半導体素子の構造 |
Also Published As
Publication number | Publication date |
---|---|
US20050140024A1 (en) | 2005-06-30 |
CN1303684C (zh) | 2007-03-07 |
EP1548825A3 (en) | 2007-07-04 |
CN1638100A (zh) | 2005-07-13 |
EP1548825A2 (en) | 2005-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7663232B2 (en) | Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems | |
US9899249B2 (en) | Fabrication method of coreless packaging substrate | |
US20050040510A1 (en) | Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument | |
TWI506707B (zh) | 具有導線架插入件的積體電路封裝系統及其製造方法 | |
JP2002083897A (ja) | 半導体装置及びその製造方法、回路基板並びに電子機器 | |
US10121043B2 (en) | Printed circuit board assembly with image sensor mounted thereon | |
JP2005079581A (ja) | テープ基板、及びテープ基板を用いた半導体チップパッケージ、及び半導体チップパッケージを用いたlcd装置 | |
JP2010278133A (ja) | 回路基板 | |
JP2006294976A (ja) | 半導体装置およびその製造方法 | |
JP4269173B2 (ja) | 半導体装置及びその製造方法 | |
JP4556671B2 (ja) | 半導体パッケージ及びフレキシブルサーキット基板 | |
JP4968424B2 (ja) | 半導体装置 | |
JP2005183849A (ja) | 半導体装置及びその製造方法、並びに電子機器 | |
JP4577686B2 (ja) | 半導体装置及びその製造方法 | |
JP4364181B2 (ja) | 半導体装置の製造方法 | |
JP4692719B2 (ja) | 配線基板、半導体装置及びその製造方法 | |
JP5017991B2 (ja) | プリント配線板、電子装置 | |
US20090057916A1 (en) | Semiconductor package and apparatus using the same | |
JP2008141200A (ja) | 半導体モジュール及びその製造方法 | |
US20100096751A1 (en) | Semiconductor device | |
JP2013149744A (ja) | 半導体装置 | |
JP2007059811A (ja) | 電子機器 | |
JP4591816B6 (ja) | 半導体装置 | |
JP4720992B2 (ja) | 半導体装置 | |
JP2009176931A (ja) | 半導体装置および電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060208 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20060208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20060209 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20060223 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060501 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060516 |
|
A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060718 |