JPH11510626A - コンポーネントを含むモジュールとコイルを有するデータキャリア、及びこのようなデータキャリアの製造方法 - Google Patents
コンポーネントを含むモジュールとコイルを有するデータキャリア、及びこのようなデータキャリアの製造方法Info
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- JPH11510626A JPH11510626A JP9507395A JP50739597A JPH11510626A JP H11510626 A JPH11510626 A JP H11510626A JP 9507395 A JP9507395 A JP 9507395A JP 50739597 A JP50739597 A JP 50739597A JP H11510626 A JPH11510626 A JP H11510626A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01079—Gold [Au]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.モジュール及びコイルを組み込むデータキャリア本体を具え、該データキャ リア本体は本体表面により限界され、該本体表面に開口し前記モジュールを収納 するくぼみを有し、前記コイルは前記モジュールから離れて位置し、コイルター ンと少なくとも2つのコイル接続接点とを有し、前記モジュールは、前記本体表 面にほぼ平行に延在するとともに前記本体表面に面する第1のキャリア主表面と 該第1のキャリア主表面にほぼ平行な第2のキャリア主表面とにより限界された 板状キャリアと、データキャリア本体内に組み込まれるコンポーネントであって 、前記板状キャリアに接続され、前記第2のキャリア主表面から突出するととも に前記本体表面に対し横断方向に延在するコンポーネントレベルゾーン内に配置 される少なくとも一つのコンポーネントと、前記板状キャリアに接続され且つ第 2のキャリア主表面の区域に配置された少なくとも2つのキャリア接続接点とを 具え、少なくともコンポーネントに隣接する区域において前記コイルのコイルタ ーンが前記コンポーネントレベルゾーンの外部に位置するとともに前記本体表面 に対し横断方向に延在する巻線レベルゾーン内に配置され、前記コイル接続接点 も前記コイルターンと一緒に前記巻線レベルゾーン内に配置され、且つ各コイル 接続接点は第2のキャリア主表面に対し横断方向においてモジュール接続接点に 対向するとともに該モジュール接続接点に導電的に接続され、且つ前記モジュー ル接続接点は前記コンポーネントのレベルを越えて突出し前記コンポーネントレ ベルゾーンを貫通して前記巻線レベルゾーン内に配置された前記コイル接続接点 まで延在するデータキャリアにおいて、 前記データキャリア本体が少なくとも2つの箔から積層処理により形成され 、該データキャリア本体にくぼみが材料除去処理により形成され、前記本体表面 から遠くはなれた該くぼみの底部分に、該底部分から前記コイル接続接点まで延 在する少なくとも2つの通路が、好ましくは前記材料除去処理と同一の処理によ り形成され、該通路を経て前記モジュール接続接点が前記コイル接続接点に導電 的に接続されていることを特徴とするデータキャリア。 2.前記くぼみ及びコイル接続接点への通路はフライス処理により形成されてい ることを特徴とする請求項1記載のデータキャリア。 3.導電性接着剤が前記通路内に導入され、該接着剤により前記モジュール接続 接点と前記コイル接続接点が互いに導電的に接続されていることを特徴とする請 求項1又は2記載のデータキャリア。 4.前記コイルのコイルターン及びコイル接続接点がスクリーン印刷プロセスに より形成されたトラックで構成されていることを特徴とする請求項1〜3の何れ かに記載のデータキャリア。 5.前記コイルのコイルターン及びコイル接続接点が導電性銀ペーストを用いて スクリーン印刷プロセスにより形成されたトラックで構成されていることを特徴 とする請求項1〜3の何れかに記載のデータキャリア。 6.前記第1のキャリア主表面の区域に配置された他のモジュール接続接点がモ ジュールのキャリアに接続され且つこれらの接点がデータキャリアの外部から係 合しうる対応接点と協働することを特徴とする請求項1〜5の何れかに記載のデ ータキャリア。 7.チップカードとして構成されていることを特徴とする請求項1〜6の何れか に記載のデータキャリア。 8.本体主表面で限界されたデータキャリア本体を製造し、該データキャリア本 体の製造中にコイルターンと少なくとも2つのコイル接続接点を有するコイルを データキャリア本体内に組み込み、前記コイルターンは、コンポーネントに隣接 する区域において、コンポーネントのコンポーネントレベルゾーンの外部に位置 するとともに前記本体表面に対し横断方向に延在する巻線レベルゾーン内に配置 するとともに前記コイル接続接点もコイルターンと一緒に巻線レベルゾーン内に 配置し、更に前記データキャリア本体内に、前記本体表面にほぼ平行に延在する とともに前記本体表面に対面する第1のキャリア主表面と該第1のキャリア主表 面にほぼ平行な第2のキャリア主表面とにより限界された板状キャリアと、デー タキャリア本体内に組み込まれるコンポーネントであって、前記板状キャリアに 接続され、前記第2のキャリア主表面から突出するとともに前記本体表面に対し 横断方向に延在するコンポーネントレベルゾーン内に配置される少なくとも一つ のコンポーネントと、前記板状キャリアに接続され且 つ第2のキャリア主表面の区域に配置された少なくとも2つのキャリア接続接点 とを具えるモジュールを、第1のキャリア主表面が前記本体表面に隣接し、第2 のキャリア主表面が前記本体表面から遠くなるとともに、前記コンポーネントが 前記本体表面に対し横断方向に延在するコンポーネントレベルゾーン内に配置さ れ、各モジュール接続接点と各コイル接続接点が第2のキャリア主表面に対し横 断方向において互いに対向し、導電的に接続されるように組み込み、この組み込 みのために、前記モジュールとしてコンポーネントのレベルを越えて突出し前記 コンポーネントレベルゾーンを貫通して前記巻線レベルゾーン内に配置された前 記コイル接続接点まで延在し、前記コイル接続接点に接続されて導電接続を形成 するモジュール接続接点を有するものを使用し、且つ前記本体表面に開口するく ぼみを前記データキャリア本体に形成するデータキャリアの製造方法において、 前記データキャリア本体の製造中に、前記コイルターン及びコイル接続接点 をキャリア箔の上に形成し、次に前記コイルのコイルターン及びコイル接続接点 が形成された前記キャリア箔を少なくとも1つの他の箔と積み重ね、前記コイル のコイルターン及びコイル接続接点を前記キャリア箔とカバー箔との間に介挿し 、次に積み重ねた箔を積層処理により積層してデータキャリア本体を形成し、次 に製造したデータキャリア本体にくぼみを材料除去処理により形成するとともに 、前記本体表面から遠く離れて位置するこのくぼみの底部分に、この底部分から コイル接続接点まで延在する少なくとも2つの通路を、好ましくは前記材料除去 処理と同一の処理により形成し、モジュール接続接点を前記通路を経てコイル接 続接点に接続して導電接続を形成することを特徴とするデータキャリアの製造方 法。 9.前記くぼみ及びコイル接続接点までの通路を形成するための材料除去はフラ イス処理により実行することを特徴とする請求項8記載の方法。 10.モジュールを前記くぼみ内に装着する前に、コイルが良好な動作状態にある か試験する試験装置を前記くぼみ及び通路を経てコイル接続接点に動作的に接続 することを特徴とする請求項8又は9記載の方法。 11.前記モジュールを前記くぼみ内に装着する前に、導電性接着剤を前記通路内 に導入することを特徴とする請求項8〜9の何れかに記載の方法。 12.前記モジュールを前記くぼみ内に装着する前に、ホットメルト接着剤をモジ ュールのキャリアの第2のキャリア主表面の周縁部に塗布し、モジュールをくぼ み内に装着した後に加熱装置の加熱ダイをモジュールのキャリアの第1のキャリ ア主表面の上に置くことを特徴とする請求項8〜11の何れかに記載の方法。 13.前記キャリア箔としてポリカーボネイト箔を使用し、その上に前記コイルの コイルターン及びコイル接続接点を形成することを特徴とする請求項8〜12の 何れかに記載の方法。 14.箔の積み重ね中に前記コイルのコイルターン及びコイル接続接点と直接接触 するカバー箔としてポリ塩化ビニル箔を使用することを特徴とする請求項8〜1 3の何れかに記載の方法。 15.前記コイルのコイルターン及びコイル接続接点は前記キャリア箔上に導電接 続材料をスクリーン印刷処理により堆積することにより形成することを特徴とす る請求項8〜14の何れかに記載の方法。 16.前記コイルのコイルターン及びコイル接続接点は前記キャリア箔上に導電性 銀ペーストをスクリーン印刷処理により堆積することにより形成することを特徴 とする請求項15記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0042295U AT1470U1 (de) | 1995-08-01 | 1995-08-01 | Laminierte karte und verfahren zu ihrer herstellung |
AT422/95 | 1995-08-01 | ||
PCT/IB1996/000694 WO1997005571A1 (de) | 1995-08-01 | 1996-07-15 | Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers sowie modul hierfür |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11510626A true JPH11510626A (ja) | 1999-09-14 |
JP3712266B2 JP3712266B2 (ja) | 2005-11-02 |
Family
ID=45476713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50739597A Expired - Lifetime JP3712266B2 (ja) | 1995-08-01 | 1996-07-15 | コンポーネントを含むモジュールとコイルを有するデータキャリア、及びこのようなデータキャリアの製造方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US5969415A (ja) |
EP (1) | EP0842493B1 (ja) |
JP (1) | JP3712266B2 (ja) |
KR (1) | KR100487175B1 (ja) |
CN (1) | CN1187711C (ja) |
AT (2) | AT1470U1 (ja) |
AU (1) | AU6238596A (ja) |
DE (1) | DE59611496D1 (ja) |
WO (1) | WO1997005571A1 (ja) |
Cited By (1)
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JP2001331775A (ja) * | 2000-05-22 | 2001-11-30 | Dainippon Printing Co Ltd | 接触・非接触共用icカードの製造方法及び製造装置 |
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US20030007963A1 (en) | 1998-12-07 | 2003-01-09 | Van Bree Johannes B. M. M. | Treatment of pompe's disease |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
DE19621289C2 (de) * | 1996-05-25 | 1999-08-26 | Wendisch | Verfahren zur Herstellung einer Chipkarte und Chipträger dafür |
WO1998015916A1 (de) * | 1996-10-09 | 1998-04-16 | Pav Card Gmbh | Verfahren und verbindungsanordnung zum herstellen einer chipkarte |
DE19642378C2 (de) * | 1996-10-14 | 2000-06-08 | Fraunhofer Ges Forschung | Kontaktlose Chipkarte |
FR2761497B1 (fr) * | 1997-03-27 | 1999-06-18 | Gemplus Card Int | Procede de fabrication d'une carte a puce ou analogue |
DE19720226C5 (de) * | 1997-05-14 | 2007-11-22 | Künnecke Verwaltungs GmbH & Co. Holding KG | Verfahren und Vorrichtung zur Herstellung von Chipkarten |
FR2764414B1 (fr) * | 1997-06-10 | 1999-08-06 | Gemplus Card Int | Procede de fabrication de carte a puce sans contact |
DE69934715T2 (de) * | 1998-11-30 | 2007-10-18 | Hitachi, Ltd. | Verfahren zur montage einer elektronischen schaltung |
GB2353340B (en) * | 1999-08-20 | 2003-11-05 | Vincent Roy Garvey | Trailer safety |
US6461891B1 (en) * | 1999-09-13 | 2002-10-08 | Intel Corporation | Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple |
JP2001188891A (ja) * | 2000-01-05 | 2001-07-10 | Shinko Electric Ind Co Ltd | 非接触型icカード |
DE60144452D1 (de) * | 2000-02-22 | 2011-05-26 | Toray Eng Co Ltd | Verfahren zur Herstellung einer kontaktlosen ID Karte |
US7064422B2 (en) * | 2004-03-26 | 2006-06-20 | Intel Corporation | Electronic assembly with integrated IO and power contacts |
JP2008511891A (ja) * | 2004-08-31 | 2008-04-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 異なる動作モードのための異なるチップコンタクトを有するチップ |
US20140042230A1 (en) * | 2012-08-09 | 2014-02-13 | Infineon Technologies Ag | Chip card module with separate antenna and chip card inlay using same |
EP2736001A1 (fr) * | 2012-11-27 | 2014-05-28 | Gemalto SA | Module électronique à interface de communication tridimensionnelle |
FR3001332B1 (fr) * | 2013-01-21 | 2016-05-13 | Oberthur Technologies | Procede de fabrication d'un corps de carte a puce |
Family Cites Families (16)
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JPS63149191A (ja) * | 1986-12-15 | 1988-06-21 | 日立マクセル株式会社 | Icカ−ド |
US5067008A (en) * | 1989-08-11 | 1991-11-19 | Hitachi Maxell, Ltd. | Ic package and ic card incorporating the same thereinto |
FR2659767A1 (fr) * | 1990-03-13 | 1991-09-20 | Nsi Nx Systemes Informatiques | Circuit de caracterisation de microcircuits, lecteur enregistreur de carte a microcircuits, et carte a microcircuits associee. |
DE4040770C2 (de) * | 1990-12-19 | 1999-11-11 | Gao Ges Automation Org | Datenträger mit integriertem Schaltkreis |
JP2816028B2 (ja) * | 1991-02-18 | 1998-10-27 | 株式会社東芝 | 半導体装置の製造方法 |
JP2672924B2 (ja) * | 1992-07-30 | 1997-11-05 | 三菱電機株式会社 | 非接触icカードとその製造方法及びテスト方法 |
GB9222460D0 (en) * | 1992-10-26 | 1992-12-09 | Hughes Microelectronics Europa | Radio frequency baggage tag |
JPH07117385A (ja) * | 1993-09-01 | 1995-05-09 | Toshiba Corp | 薄型icカードおよび薄型icカードの製造方法 |
DE4337921C2 (de) * | 1993-11-06 | 1998-09-03 | Ods Gmbh & Co Kg | Kontaktlose Chipkarte mit Antennenspule |
DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
DE4403753C1 (de) * | 1994-02-08 | 1995-07-20 | Angewandte Digital Elektronik | Kombinierte Chipkarte |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
FR2721732B1 (fr) * | 1994-06-22 | 1996-08-30 | Solaic Sa | Carte à mémoire sans contact dont le circuit électronique comporte un module. |
DE4431605C2 (de) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten |
DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
-
1995
- 1995-08-01 AT AT0042295U patent/AT1470U1/de not_active IP Right Cessation
-
1996
- 1996-07-15 US US09/011,120 patent/US5969415A/en not_active Expired - Lifetime
- 1996-07-15 CN CNB961973439A patent/CN1187711C/zh not_active Expired - Lifetime
- 1996-07-15 AT AT96921036T patent/ATE435471T1/de active
- 1996-07-15 WO PCT/IB1996/000694 patent/WO1997005571A1/de active IP Right Grant
- 1996-07-15 DE DE59611496T patent/DE59611496D1/de not_active Expired - Lifetime
- 1996-07-15 AU AU62385/96A patent/AU6238596A/en not_active Abandoned
- 1996-07-15 JP JP50739597A patent/JP3712266B2/ja not_active Expired - Lifetime
- 1996-07-15 EP EP96921036A patent/EP0842493B1/de not_active Expired - Lifetime
- 1996-07-15 KR KR10-1998-0700656A patent/KR100487175B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001331775A (ja) * | 2000-05-22 | 2001-11-30 | Dainippon Printing Co Ltd | 接触・非接触共用icカードの製造方法及び製造装置 |
JP4516179B2 (ja) * | 2000-05-22 | 2010-08-04 | 大日本印刷株式会社 | 接触・非接触共用icカードの製造方法及び製造装置 |
Also Published As
Publication number | Publication date |
---|---|
KR19990035992A (ko) | 1999-05-25 |
CN1239564A (zh) | 1999-12-22 |
EP0842493A1 (de) | 1998-05-20 |
US5969415A (en) | 1999-10-19 |
WO1997005571A1 (de) | 1997-02-13 |
EP0842493B1 (de) | 2009-07-01 |
AT1470U1 (de) | 1997-05-26 |
AU6238596A (en) | 1997-02-26 |
JP3712266B2 (ja) | 2005-11-02 |
CN1187711C (zh) | 2005-02-02 |
ATE435471T1 (de) | 2009-07-15 |
DE59611496D1 (de) | 2009-08-13 |
KR100487175B1 (ko) | 2005-09-02 |
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