JPH11505672A - 支持体に接着される基板を有する半導体本体 - Google Patents
支持体に接着される基板を有する半導体本体Info
- Publication number
- JPH11505672A JPH11505672A JP9532388A JP53238897A JPH11505672A JP H11505672 A JPH11505672 A JP H11505672A JP 9532388 A JP9532388 A JP 9532388A JP 53238897 A JP53238897 A JP 53238897A JP H11505672 A JPH11505672 A JP H11505672A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- support
- layers
- spacer element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.平坦面を有する基板を具え、該基板の平坦面上に層構体が多数の層で形成さ れ、該層構体を形成した側にて前記基板がスペーサ素子を含む接着層によって或 る平坦な支持体に固着されるようにした半導体デバイスにおいて、前記スペーサ 素子が前記基板の平坦面上に固着れ、且つ該平坦面から測った前記全てのスペー サ素子が等しい高さを有するようにしたことを特徴とする半導体デバイス。 2.前記スペーサ素子が、前記層構体を形成する多数の層から成る積層体によっ て構成されるようにしたことを特徴とする請求の範囲1に記載の半導体デバイス 。 3.前記積層体が、前記層構体を形成する全ての層によって構成されるようにし たことを特徴とする請求の範囲2に記載の半導体デバイス。 4.前記スペーサ素子のパターンが、前記積層体の多数の層の一部だけで形成さ れるようにしたことを特徴とする請求の範囲2又は3に記載の半導体デバイス。 5.前記スペーサ素子の各々が或る回路素子を形成するようにしたことを特徴と する請求の範囲4に記載の半導体デバイス。 5.前記回路素子をコイルとしたことを特徴とする請求の範囲5に記載の半導体 デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96200673 | 1996-03-12 | ||
NL96200673.0 | 1996-03-12 | ||
PCT/IB1997/000157 WO1997034321A2 (en) | 1996-03-12 | 1997-02-25 | Semiconductor body with a substrate glued to a support body |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH11505672A true JPH11505672A (ja) | 1999-05-21 |
JP4633868B2 JP4633868B2 (ja) | 2011-02-16 |
Family
ID=8223773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53238897A Expired - Fee Related JP4633868B2 (ja) | 1996-03-12 | 1997-02-25 | 支持体に接着される基板を有する半導体本体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5828122A (ja) |
EP (1) | EP0826238B1 (ja) |
JP (1) | JP4633868B2 (ja) |
KR (1) | KR100513412B1 (ja) |
DE (1) | DE69707077T2 (ja) |
WO (1) | WO1997034321A2 (ja) |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918910A (ja) * | 1982-07-23 | 1984-01-31 | Canon Inc | 光学フイルタ− |
JPS62217633A (ja) * | 1986-03-19 | 1987-09-25 | Fujitsu Ltd | 平板接着方法 |
JPH01146322A (ja) * | 1987-12-03 | 1989-06-08 | Nissan Motor Co Ltd | 固体結合体の製造方法 |
JPH0329829U (ja) * | 1989-07-28 | 1991-03-25 | ||
JPH0394188A (ja) * | 1989-09-06 | 1991-04-18 | Hitachi Medical Corp | 多素子放射線検出器 |
JPH04116624A (ja) * | 1990-09-07 | 1992-04-17 | Seiko Instr Inc | 半導体単結晶基板液晶パネル装置 |
JPH04245853A (ja) * | 1991-01-31 | 1992-09-02 | Canon Inc | 画像読取装置 |
JPH04264524A (ja) * | 1991-02-20 | 1992-09-21 | Sharp Corp | 表示装置 |
JPH04356961A (ja) * | 1991-06-03 | 1992-12-10 | Fujitsu Ltd | 半導体基板及びその製造方法 |
JPH0548829A (ja) * | 1991-08-09 | 1993-02-26 | Fuji Xerox Co Ltd | 画像読取装置 |
JPH0563899A (ja) * | 1991-08-30 | 1993-03-12 | Canon Inc | 画像読取装置 |
JPH05183157A (ja) * | 1992-01-07 | 1993-07-23 | Fujitsu Ltd | 両面ゲート電界効果トランジスタ及びその製造方法 |
JPH05183135A (ja) * | 1991-10-14 | 1993-07-23 | Sony Corp | Ccd撮像装置 |
JPH05313201A (ja) * | 1992-05-14 | 1993-11-26 | Seiko Instr Inc | 半導体薄膜素子その応用装置および半導体薄膜素子の製造方法 |
JPH06289424A (ja) * | 1993-04-02 | 1994-10-18 | Sanyo Electric Co Ltd | 透過型表示装置 |
JPH0714982A (ja) * | 1993-06-21 | 1995-01-17 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
JPH07311391A (ja) * | 1994-05-17 | 1995-11-28 | Sony Corp | 液晶表示装置の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3038261A1 (de) * | 1980-10-10 | 1982-04-29 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Baueinheit mit piezoelektrischen resonatoren |
US4506238A (en) * | 1981-12-14 | 1985-03-19 | Toko, Inc. | Hybrid circuit device |
US4626478A (en) * | 1984-03-22 | 1986-12-02 | Unitrode Corporation | Electronic circuit device components having integral spacers providing uniform thickness bonding film |
US4635356A (en) * | 1984-12-28 | 1987-01-13 | Kabushiki Kaisha Toshiba | Method of manufacturing a circuit module |
EP0577779A4 (en) * | 1991-03-27 | 1994-05-25 | Integrated System Assemblies | Multichip integrated circuit module and method of fabrication |
DE69507284T2 (de) * | 1994-11-22 | 1999-07-01 | Philips Electronics Nv | Halbleiter mit einem träger auf dem ein substrat mit einem halbleiter-element mittels einer klebeschicht und ein leiterbahn-muster befestigt sind |
US5564181A (en) * | 1995-04-18 | 1996-10-15 | Draper Laboratory, Inc. | Method of fabricating a laminated substrate assembly chips-first multichip module |
-
1997
- 1997-02-25 EP EP97902534A patent/EP0826238B1/en not_active Expired - Lifetime
- 1997-02-25 JP JP53238897A patent/JP4633868B2/ja not_active Expired - Fee Related
- 1997-02-25 WO PCT/IB1997/000157 patent/WO1997034321A2/en active IP Right Grant
- 1997-02-25 DE DE69707077T patent/DE69707077T2/de not_active Expired - Lifetime
- 1997-02-25 KR KR1019970708042A patent/KR100513412B1/ko not_active IP Right Cessation
- 1997-03-12 US US08/815,253 patent/US5828122A/en not_active Expired - Lifetime
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918910A (ja) * | 1982-07-23 | 1984-01-31 | Canon Inc | 光学フイルタ− |
JPS62217633A (ja) * | 1986-03-19 | 1987-09-25 | Fujitsu Ltd | 平板接着方法 |
JPH01146322A (ja) * | 1987-12-03 | 1989-06-08 | Nissan Motor Co Ltd | 固体結合体の製造方法 |
JPH0329829U (ja) * | 1989-07-28 | 1991-03-25 | ||
JPH0394188A (ja) * | 1989-09-06 | 1991-04-18 | Hitachi Medical Corp | 多素子放射線検出器 |
JPH04116624A (ja) * | 1990-09-07 | 1992-04-17 | Seiko Instr Inc | 半導体単結晶基板液晶パネル装置 |
JPH04245853A (ja) * | 1991-01-31 | 1992-09-02 | Canon Inc | 画像読取装置 |
JPH04264524A (ja) * | 1991-02-20 | 1992-09-21 | Sharp Corp | 表示装置 |
JPH04356961A (ja) * | 1991-06-03 | 1992-12-10 | Fujitsu Ltd | 半導体基板及びその製造方法 |
JPH0548829A (ja) * | 1991-08-09 | 1993-02-26 | Fuji Xerox Co Ltd | 画像読取装置 |
JPH0563899A (ja) * | 1991-08-30 | 1993-03-12 | Canon Inc | 画像読取装置 |
JPH05183135A (ja) * | 1991-10-14 | 1993-07-23 | Sony Corp | Ccd撮像装置 |
JPH05183157A (ja) * | 1992-01-07 | 1993-07-23 | Fujitsu Ltd | 両面ゲート電界効果トランジスタ及びその製造方法 |
JPH05313201A (ja) * | 1992-05-14 | 1993-11-26 | Seiko Instr Inc | 半導体薄膜素子その応用装置および半導体薄膜素子の製造方法 |
JPH06289424A (ja) * | 1993-04-02 | 1994-10-18 | Sanyo Electric Co Ltd | 透過型表示装置 |
JPH0714982A (ja) * | 1993-06-21 | 1995-01-17 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
JPH07311391A (ja) * | 1994-05-17 | 1995-11-28 | Sony Corp | 液晶表示装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0826238B1 (en) | 2001-10-04 |
DE69707077D1 (de) | 2001-11-08 |
US5828122A (en) | 1998-10-27 |
KR19990014701A (ko) | 1999-02-25 |
KR100513412B1 (ko) | 2005-12-06 |
JP4633868B2 (ja) | 2011-02-16 |
DE69707077T2 (de) | 2002-06-06 |
WO1997034321A2 (en) | 1997-09-18 |
WO1997034321A3 (en) | 1997-10-23 |
EP0826238A2 (en) | 1998-03-04 |
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