JPH11254308A - 両面研磨装置 - Google Patents

両面研磨装置

Info

Publication number
JPH11254308A
JPH11254308A JP5533898A JP5533898A JPH11254308A JP H11254308 A JPH11254308 A JP H11254308A JP 5533898 A JP5533898 A JP 5533898A JP 5533898 A JP5533898 A JP 5533898A JP H11254308 A JPH11254308 A JP H11254308A
Authority
JP
Japan
Prior art keywords
carrier
holder
polishing apparatus
hole
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5533898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11254308A5 (enExample
Inventor
Yoshio Nakamura
由夫 中村
Atsushi Kajikura
惇 鍛治倉
Tomoki Kanda
智樹 神田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Priority to JP5533898A priority Critical patent/JPH11254308A/ja
Priority to US09/114,823 priority patent/US6080048A/en
Priority to TW087111546A priority patent/TW372902B/zh
Priority to MYPI98003228A priority patent/MY119729A/en
Priority to DE69820021T priority patent/DE69820021T2/de
Priority to EP98305766A priority patent/EP0940221B1/en
Publication of JPH11254308A publication Critical patent/JPH11254308A/ja
Publication of JPH11254308A5 publication Critical patent/JPH11254308A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP5533898A 1998-03-06 1998-03-06 両面研磨装置 Pending JPH11254308A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP5533898A JPH11254308A (ja) 1998-03-06 1998-03-06 両面研磨装置
US09/114,823 US6080048A (en) 1998-03-06 1998-07-14 Polishing machine
TW087111546A TW372902B (en) 1998-03-06 1998-07-15 Polishing machine
MYPI98003228A MY119729A (en) 1998-03-06 1998-07-15 Polishing machine
DE69820021T DE69820021T2 (de) 1998-03-06 1998-07-20 Poliermaschine
EP98305766A EP0940221B1 (en) 1998-03-06 1998-07-20 Polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5533898A JPH11254308A (ja) 1998-03-06 1998-03-06 両面研磨装置

Publications (2)

Publication Number Publication Date
JPH11254308A true JPH11254308A (ja) 1999-09-21
JPH11254308A5 JPH11254308A5 (enExample) 2005-09-02

Family

ID=12995743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5533898A Pending JPH11254308A (ja) 1998-03-06 1998-03-06 両面研磨装置

Country Status (6)

Country Link
US (1) US6080048A (enExample)
EP (1) EP0940221B1 (enExample)
JP (1) JPH11254308A (enExample)
DE (1) DE69820021T2 (enExample)
MY (1) MY119729A (enExample)
TW (1) TW372902B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115022B2 (en) 2002-07-31 2006-10-03 Asahi Glass Company, Limited Method and apparatus for polishing a substrate
KR101124034B1 (ko) 2008-10-22 2012-03-23 페터 볼터스 게엠베하 평평한 공작물의 양면 처리 장치 및 복수 개의 반도체 웨이퍼 양면의 재료를 동시에 제거 처리하는 재료 제거 방법
CN112207698A (zh) * 2019-06-14 2021-01-12 硅电子股份公司 用于抛光半导体晶圆的设备和方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254308A (ja) * 1998-03-06 1999-09-21 Fujikoshi Mach Corp 両面研磨装置
DE19961106C2 (de) * 1999-12-17 2003-01-30 Siemens Ag Haltevorrichtung zum mechanischen Bearbeiten einer ebenen Platte, Verwendung der Haltevorrichtung und ebene Platte
US7589023B2 (en) * 2000-04-24 2009-09-15 Sumitomo Mitsubishi Silicon Corporation Method of manufacturing semiconductor wafer
JP3791302B2 (ja) * 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ 両面研磨装置を用いた半導体ウェーハの研磨方法
JP4227326B2 (ja) * 2001-11-28 2009-02-18 Ｄｏｗａホールディングス株式会社 焼結希土類磁石合金からなるリング状薄板の製法
DE10159832A1 (de) * 2001-12-06 2003-06-26 Wacker Siltronic Halbleitermat Halbleiterscheibe aus Silicium und Verfahren zu deren Herstellung
DE10159848B4 (de) * 2001-12-06 2004-07-15 Siltronic Ag Vorrichtung zur beidseitigen Bearbeitung von Werkstücken
DE10159833C1 (de) * 2001-12-06 2003-06-18 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben
EP1489649A1 (en) * 2002-03-28 2004-12-22 Shin-Etsu Handotai Co., Ltd Double side polishing device for wafer and double side polishing method
JP2004106173A (ja) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp 両面研磨装置
DE10250823B4 (de) * 2002-10-31 2005-02-03 Siltronic Ag Läuferscheibe und Verfahren zur gleichzeitig beidseitigen Bearbeitung von Werkstücken
WO2005058544A1 (en) * 2003-12-18 2005-06-30 Carl Zeiss Smt Ag Device and method for surface working
DE102005034119B3 (de) * 2005-07-21 2006-12-07 Siltronic Ag Verfahren zum Bearbeiten einer Halbleiterscheibe, die in einer Aussparung einer Läuferscheibe geführt wird
US8389099B1 (en) 2007-06-01 2013-03-05 Rubicon Technology, Inc. Asymmetrical wafer configurations and method for creating the same
US8348720B1 (en) 2007-06-19 2013-01-08 Rubicon Technology, Inc. Ultra-flat, high throughput wafer lapping process
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
DE102011082857B4 (de) * 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke
CN103962940B (zh) * 2014-05-22 2017-02-15 昆山富通电子有限公司 一种注塑件双面研磨装置
JP6304132B2 (ja) * 2015-06-12 2018-04-04 信越半導体株式会社 ワークの加工装置
CN105666312B (zh) * 2016-01-21 2017-08-01 苏州新美光纳米科技有限公司 晶片快速抛光装置及方法
CN108422305A (zh) * 2018-02-08 2018-08-21 江西联创电子有限公司 抛光设备
CN114147616B (zh) * 2021-12-10 2023-10-20 大连德迈仕精密科技股份有限公司 一种汽车燃油泵轴抛光装置及抛光方法
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法
CN117001508A (zh) * 2023-08-31 2023-11-07 深圳市永霖科技有限公司 一种用于手机镜头板抛光的抛光台及抛光系统
CN117601006B (zh) * 2023-12-06 2025-06-17 中铁三局集团建筑安装工程有限公司 一种空心箱型密集单晶炉基础群施工方法
TWI893615B (zh) * 2024-01-16 2025-08-11 玖鉦機械工業有限公司 智慧型精密研磨機

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2410752A (en) * 1945-10-26 1946-11-05 G G Campbell Lapping machine
CH577873A5 (enExample) * 1975-02-25 1976-07-30 Schenker Emil Storen Und Masch
US4205489A (en) * 1976-12-10 1980-06-03 Balabanov Anatoly S Apparatus for finishing workpieces on surface-lapping machines
DE4101353A1 (de) * 1989-11-29 1992-10-22 Telefunken Systemtechnik Sensorbestueckte doppelexzentrische zweischeibenlaeppmaschine
US5121572A (en) * 1990-11-06 1992-06-16 Timesavers, Inc. Opposed disc deburring system
JPH0592363A (ja) * 1991-02-20 1993-04-16 Hitachi Ltd 基板の両面同時研磨加工方法と加工装置及びそれを用いた磁気デイスク基板の研磨加工方法と磁気デイスクの製造方法並びに磁気デイスク
JP3734878B2 (ja) * 1996-04-25 2006-01-11 不二越機械工業株式会社 ウェーハの研磨装置
JPH11254308A (ja) * 1998-03-06 1999-09-21 Fujikoshi Mach Corp 両面研磨装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115022B2 (en) 2002-07-31 2006-10-03 Asahi Glass Company, Limited Method and apparatus for polishing a substrate
KR101124034B1 (ko) 2008-10-22 2012-03-23 페터 볼터스 게엠베하 평평한 공작물의 양면 처리 장치 및 복수 개의 반도체 웨이퍼 양면의 재료를 동시에 제거 처리하는 재료 제거 방법
CN112207698A (zh) * 2019-06-14 2021-01-12 硅电子股份公司 用于抛光半导体晶圆的设备和方法

Also Published As

Publication number Publication date
US6080048A (en) 2000-06-27
EP0940221B1 (en) 2003-11-26
TW372902B (en) 1999-11-01
EP0940221A3 (en) 2002-06-12
EP0940221A2 (en) 1999-09-08
MY119729A (en) 2005-07-29
DE69820021T2 (de) 2004-09-09
DE69820021D1 (de) 2004-01-08

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