TW372902B - Polishing machine - Google Patents

Polishing machine

Info

Publication number
TW372902B
TW372902B TW087111546A TW87111546A TW372902B TW 372902 B TW372902 B TW 372902B TW 087111546 A TW087111546 A TW 087111546A TW 87111546 A TW87111546 A TW 87111546A TW 372902 B TW372902 B TW 372902B
Authority
TW
Taiwan
Prior art keywords
work piece
polishing
polishing machine
polishes
carrier
Prior art date
Application number
TW087111546A
Other languages
English (en)
Chinese (zh)
Inventor
Fuminari Kotabiri
Yoshio Nakamura
Yasuhide Denda
Haruo Sumizawa
Atsushi Kajikura
Kanda Satoki
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Application granted granted Critical
Publication of TW372902B publication Critical patent/TW372902B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW087111546A 1998-03-06 1998-07-15 Polishing machine TW372902B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5533898A JPH11254308A (ja) 1998-03-06 1998-03-06 両面研磨装置

Publications (1)

Publication Number Publication Date
TW372902B true TW372902B (en) 1999-11-01

Family

ID=12995743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087111546A TW372902B (en) 1998-03-06 1998-07-15 Polishing machine

Country Status (6)

Country Link
US (1) US6080048A (enExample)
EP (1) EP0940221B1 (enExample)
JP (1) JPH11254308A (enExample)
DE (1) DE69820021T2 (enExample)
MY (1) MY119729A (enExample)
TW (1) TW372902B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682832B (zh) * 2015-06-12 2020-01-21 日商信越半導體股份有限公司 工件的加工裝置
TWI893615B (zh) * 2024-01-16 2025-08-11 玖鉦機械工業有限公司 智慧型精密研磨機

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254308A (ja) * 1998-03-06 1999-09-21 Fujikoshi Mach Corp 両面研磨装置
DE19961106C2 (de) * 1999-12-17 2003-01-30 Siemens Ag Haltevorrichtung zum mechanischen Bearbeiten einer ebenen Platte, Verwendung der Haltevorrichtung und ebene Platte
KR100737879B1 (ko) * 2000-04-24 2007-07-10 주식회사 사무코 반도체 웨이퍼의 제조방법
JP3791302B2 (ja) * 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ 両面研磨装置を用いた半導体ウェーハの研磨方法
JP4227326B2 (ja) * 2001-11-28 2009-02-18 Ｄｏｗａホールディングス株式会社 焼結希土類磁石合金からなるリング状薄板の製法
DE10159832A1 (de) * 2001-12-06 2003-06-26 Wacker Siltronic Halbleitermat Halbleiterscheibe aus Silicium und Verfahren zu deren Herstellung
DE10159833C1 (de) * 2001-12-06 2003-06-18 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben
DE10159848B4 (de) * 2001-12-06 2004-07-15 Siltronic Ag Vorrichtung zur beidseitigen Bearbeitung von Werkstücken
US7364495B2 (en) * 2002-03-28 2008-04-29 Etsu Handotai Co., Ltd. Wafer double-side polishing apparatus and double-side polishing method
JP4207153B2 (ja) 2002-07-31 2009-01-14 旭硝子株式会社 基板の研磨方法及びその装置
JP2004106173A (ja) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp 両面研磨装置
DE10250823B4 (de) * 2002-10-31 2005-02-03 Siltronic Ag Läuferscheibe und Verfahren zur gleichzeitig beidseitigen Bearbeitung von Werkstücken
US20050164605A1 (en) * 2003-12-18 2005-07-28 Carl Zeiss Smt Ag Device and method for surface working
DE102005034119B3 (de) * 2005-07-21 2006-12-07 Siltronic Ag Verfahren zum Bearbeiten einer Halbleiterscheibe, die in einer Aussparung einer Läuferscheibe geführt wird
US8389099B1 (en) 2007-06-01 2013-03-05 Rubicon Technology, Inc. Asymmetrical wafer configurations and method for creating the same
US8348720B1 (en) 2007-06-19 2013-01-08 Rubicon Technology, Inc. Ultra-flat, high throughput wafer lapping process
DE102009038942B4 (de) 2008-10-22 2022-06-23 Peter Wolters Gmbh Vorrichtung zur beidseitigen Bearbeitung von flachen Werkstücken sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung mehrerer Halbleiterscheiben
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
DE102011082857B4 (de) * 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke
CN103962940B (zh) * 2014-05-22 2017-02-15 昆山富通电子有限公司 一种注塑件双面研磨装置
CN105666312B (zh) * 2016-01-21 2017-08-01 苏州新美光纳米科技有限公司 晶片快速抛光装置及方法
CN108422305A (zh) * 2018-02-08 2018-08-21 江西联创电子有限公司 抛光设备
DE102019208704A1 (de) * 2019-06-14 2020-12-17 Siltronic Ag Einrichtung und Verfahren zum Polieren von Halbleiterscheiben
CN114147616B (zh) * 2021-12-10 2023-10-20 大连德迈仕精密科技股份有限公司 一种汽车燃油泵轴抛光装置及抛光方法
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法
CN117001508A (zh) * 2023-08-31 2023-11-07 深圳市永霖科技有限公司 一种用于手机镜头板抛光的抛光台及抛光系统
CN117601006B (zh) * 2023-12-06 2025-06-17 中铁三局集团建筑安装工程有限公司 一种空心箱型密集单晶炉基础群施工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2410752A (en) * 1945-10-26 1946-11-05 G G Campbell Lapping machine
CH577873A5 (enExample) * 1975-02-25 1976-07-30 Schenker Emil Storen Und Masch
US4205489A (en) * 1976-12-10 1980-06-03 Balabanov Anatoly S Apparatus for finishing workpieces on surface-lapping machines
DE4101353A1 (de) * 1989-11-29 1992-10-22 Telefunken Systemtechnik Sensorbestueckte doppelexzentrische zweischeibenlaeppmaschine
US5121572A (en) * 1990-11-06 1992-06-16 Timesavers, Inc. Opposed disc deburring system
JPH0592363A (ja) * 1991-02-20 1993-04-16 Hitachi Ltd 基板の両面同時研磨加工方法と加工装置及びそれを用いた磁気デイスク基板の研磨加工方法と磁気デイスクの製造方法並びに磁気デイスク
JP3734878B2 (ja) * 1996-04-25 2006-01-11 不二越機械工業株式会社 ウェーハの研磨装置
JPH11254308A (ja) * 1998-03-06 1999-09-21 Fujikoshi Mach Corp 両面研磨装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682832B (zh) * 2015-06-12 2020-01-21 日商信越半導體股份有限公司 工件的加工裝置
TWI893615B (zh) * 2024-01-16 2025-08-11 玖鉦機械工業有限公司 智慧型精密研磨機

Also Published As

Publication number Publication date
JPH11254308A (ja) 1999-09-21
US6080048A (en) 2000-06-27
MY119729A (en) 2005-07-29
DE69820021D1 (de) 2004-01-08
EP0940221A3 (en) 2002-06-12
DE69820021T2 (de) 2004-09-09
EP0940221A2 (en) 1999-09-08
EP0940221B1 (en) 2003-11-26

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