DE60101458D1 - Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren - Google Patents

Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren

Info

Publication number
DE60101458D1
DE60101458D1 DE60101458T DE60101458T DE60101458D1 DE 60101458 D1 DE60101458 D1 DE 60101458D1 DE 60101458 T DE60101458 T DE 60101458T DE 60101458 T DE60101458 T DE 60101458T DE 60101458 D1 DE60101458 D1 DE 60101458D1
Authority
DE
Germany
Prior art keywords
semiconductor substrate
movable plate
substrate holder
mechanical polishing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60101458T
Other languages
English (en)
Other versions
DE60101458T2 (de
Inventor
Mark Hollatz
Peter Lahnor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of DE60101458D1 publication Critical patent/DE60101458D1/de
Publication of DE60101458T2 publication Critical patent/DE60101458T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60101458T 2001-05-25 2001-05-25 Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren Expired - Lifetime DE60101458T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01112711A EP1260315B1 (de) 2001-05-25 2001-05-25 Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren

Publications (2)

Publication Number Publication Date
DE60101458D1 true DE60101458D1 (de) 2004-01-22
DE60101458T2 DE60101458T2 (de) 2004-10-28

Family

ID=8177546

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60101458T Expired - Lifetime DE60101458T2 (de) 2001-05-25 2001-05-25 Halbleitersubstrathalter mit bewegbarer Platte für das chemisch-mechanische Polierverfahren

Country Status (4)

Country Link
US (1) US6695687B2 (de)
EP (1) EP1260315B1 (de)
JP (1) JP3641464B2 (de)
DE (1) DE60101458T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6758726B2 (en) * 2002-06-28 2004-07-06 Lam Research Corporation Partial-membrane carrier head
JP2004154874A (ja) * 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
AU2003248610A1 (en) * 2003-07-14 2005-01-28 Systems On Silicon Manufacturing Co. Pte. Ltd. Perforated plate for wafer chuck
JP5318324B2 (ja) * 2005-12-06 2013-10-16 東京応化工業株式会社 サポートプレートの貼り合わせ方法
US7607647B2 (en) * 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
WO2012001913A1 (ja) * 2010-06-30 2012-01-05 コニカミノルタオプト株式会社 情報記録媒体用ガラス基板の製造方法および吸着具
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
US20130075568A1 (en) * 2011-09-22 2013-03-28 BOT Research, LLC Holder for semiconductor wafers and flat substrates
JP5807580B2 (ja) * 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置
JP6044955B2 (ja) * 2012-12-04 2016-12-14 不二越機械工業株式会社 ウェーハ研磨ヘッドおよびウェーハ研磨装置
US20150185104A1 (en) * 2014-01-02 2015-07-02 George P. Widas, III System for Calibrating a Tribometer Test Foot
JP7058209B2 (ja) * 2018-11-21 2022-04-21 株式会社荏原製作所 基板ホルダに基板を保持させる方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
JPH0413567A (ja) * 1990-04-27 1992-01-17 Mitsubishi Materials Corp 研磨装置
JP3370112B2 (ja) * 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
TW400567B (en) 1995-04-10 2000-08-01 Matsushita Electric Ind Co Ltd The polishing device and its polishing method for the substrate
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
US5762539A (en) * 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
JP2965536B2 (ja) 1996-12-17 1999-10-18 松下電器産業株式会社 被研磨基板の保持装置
DE69813374T2 (de) * 1997-05-28 2003-10-23 Tokyo Seimitsu Co Ltd Halbleiterscheibe Poliervorrichtung mit Halterring
JPH11226865A (ja) 1997-12-11 1999-08-24 Speedfam Co Ltd キャリア及びｃｍｐ装置
JPH11262857A (ja) * 1998-03-18 1999-09-28 Rohm Co Ltd 半導体ウェハの研磨装置

Also Published As

Publication number Publication date
US20020177394A1 (en) 2002-11-28
DE60101458T2 (de) 2004-10-28
JP2002359214A (ja) 2002-12-13
US6695687B2 (en) 2004-02-24
EP1260315B1 (de) 2003-12-10
JP3641464B2 (ja) 2005-04-20
EP1260315A1 (de) 2002-11-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: QIMONDA AG, 81739 MUENCHEN, DE