DE69820021T2 - Poliermaschine - Google Patents

Poliermaschine Download PDF

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Publication number
DE69820021T2
DE69820021T2 DE69820021T DE69820021T DE69820021T2 DE 69820021 T2 DE69820021 T2 DE 69820021T2 DE 69820021 T DE69820021 T DE 69820021T DE 69820021 T DE69820021 T DE 69820021T DE 69820021 T2 DE69820021 T2 DE 69820021T2
Authority
DE
Germany
Prior art keywords
polishing
carrier
polishing plate
plate
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69820021T
Other languages
German (de)
English (en)
Other versions
DE69820021D1 (de
Inventor
Fuminari Matsushiro-machi Kotagiri
Yoshio Matsushiro-machi Nakamura
Yasuhide Matsushiro-machi Denda
Haruo Matsushiro-machi Sumizawa
Atsushi Matsushiro-machi Kajikura
Satoki Matsushiro-machi Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Kikai Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Kikai Kogyo KK filed Critical Fujikoshi Kikai Kogyo KK
Publication of DE69820021D1 publication Critical patent/DE69820021D1/de
Application granted granted Critical
Publication of DE69820021T2 publication Critical patent/DE69820021T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
DE69820021T 1998-03-06 1998-07-20 Poliermaschine Expired - Lifetime DE69820021T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5533898 1998-03-06
JP5533898A JPH11254308A (ja) 1998-03-06 1998-03-06 両面研磨装置

Publications (2)

Publication Number Publication Date
DE69820021D1 DE69820021D1 (de) 2004-01-08
DE69820021T2 true DE69820021T2 (de) 2004-09-09

Family

ID=12995743

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69820021T Expired - Lifetime DE69820021T2 (de) 1998-03-06 1998-07-20 Poliermaschine

Country Status (6)

Country Link
US (1) US6080048A (enExample)
EP (1) EP0940221B1 (enExample)
JP (1) JPH11254308A (enExample)
DE (1) DE69820021T2 (enExample)
MY (1) MY119729A (enExample)
TW (1) TW372902B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011082857B4 (de) * 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254308A (ja) * 1998-03-06 1999-09-21 Fujikoshi Mach Corp 両面研磨装置
DE19961106C2 (de) * 1999-12-17 2003-01-30 Siemens Ag Haltevorrichtung zum mechanischen Bearbeiten einer ebenen Platte, Verwendung der Haltevorrichtung und ebene Platte
KR100737879B1 (ko) * 2000-04-24 2007-07-10 주식회사 사무코 반도체 웨이퍼의 제조방법
JP3791302B2 (ja) * 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ 両面研磨装置を用いた半導体ウェーハの研磨方法
JP4227326B2 (ja) * 2001-11-28 2009-02-18 Ｄｏｗａホールディングス株式会社 焼結希土類磁石合金からなるリング状薄板の製法
DE10159832A1 (de) * 2001-12-06 2003-06-26 Wacker Siltronic Halbleitermat Halbleiterscheibe aus Silicium und Verfahren zu deren Herstellung
DE10159833C1 (de) * 2001-12-06 2003-06-18 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben
DE10159848B4 (de) * 2001-12-06 2004-07-15 Siltronic Ag Vorrichtung zur beidseitigen Bearbeitung von Werkstücken
US7364495B2 (en) * 2002-03-28 2008-04-29 Etsu Handotai Co., Ltd. Wafer double-side polishing apparatus and double-side polishing method
JP4207153B2 (ja) 2002-07-31 2009-01-14 旭硝子株式会社 基板の研磨方法及びその装置
JP2004106173A (ja) * 2002-08-29 2004-04-08 Fujikoshi Mach Corp 両面研磨装置
DE10250823B4 (de) * 2002-10-31 2005-02-03 Siltronic Ag Läuferscheibe und Verfahren zur gleichzeitig beidseitigen Bearbeitung von Werkstücken
US20050164605A1 (en) * 2003-12-18 2005-07-28 Carl Zeiss Smt Ag Device and method for surface working
DE102005034119B3 (de) * 2005-07-21 2006-12-07 Siltronic Ag Verfahren zum Bearbeiten einer Halbleiterscheibe, die in einer Aussparung einer Läuferscheibe geführt wird
US8389099B1 (en) 2007-06-01 2013-03-05 Rubicon Technology, Inc. Asymmetrical wafer configurations and method for creating the same
US8348720B1 (en) 2007-06-19 2013-01-08 Rubicon Technology, Inc. Ultra-flat, high throughput wafer lapping process
DE102009038942B4 (de) 2008-10-22 2022-06-23 Peter Wolters Gmbh Vorrichtung zur beidseitigen Bearbeitung von flachen Werkstücken sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung mehrerer Halbleiterscheiben
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法
CN103962940B (zh) * 2014-05-22 2017-02-15 昆山富通电子有限公司 一种注塑件双面研磨装置
JP6304132B2 (ja) * 2015-06-12 2018-04-04 信越半導体株式会社 ワークの加工装置
CN105666312B (zh) * 2016-01-21 2017-08-01 苏州新美光纳米科技有限公司 晶片快速抛光装置及方法
CN108422305A (zh) * 2018-02-08 2018-08-21 江西联创电子有限公司 抛光设备
DE102019208704A1 (de) * 2019-06-14 2020-12-17 Siltronic Ag Einrichtung und Verfahren zum Polieren von Halbleiterscheiben
CN114147616B (zh) * 2021-12-10 2023-10-20 大连德迈仕精密科技股份有限公司 一种汽车燃油泵轴抛光装置及抛光方法
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法
CN117001508A (zh) * 2023-08-31 2023-11-07 深圳市永霖科技有限公司 一种用于手机镜头板抛光的抛光台及抛光系统
CN117601006B (zh) * 2023-12-06 2025-06-17 中铁三局集团建筑安装工程有限公司 一种空心箱型密集单晶炉基础群施工方法
TWI893615B (zh) * 2024-01-16 2025-08-11 玖鉦機械工業有限公司 智慧型精密研磨機

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2410752A (en) * 1945-10-26 1946-11-05 G G Campbell Lapping machine
CH577873A5 (enExample) * 1975-02-25 1976-07-30 Schenker Emil Storen Und Masch
US4205489A (en) * 1976-12-10 1980-06-03 Balabanov Anatoly S Apparatus for finishing workpieces on surface-lapping machines
DE4101353A1 (de) * 1989-11-29 1992-10-22 Telefunken Systemtechnik Sensorbestueckte doppelexzentrische zweischeibenlaeppmaschine
US5121572A (en) * 1990-11-06 1992-06-16 Timesavers, Inc. Opposed disc deburring system
JPH0592363A (ja) * 1991-02-20 1993-04-16 Hitachi Ltd 基板の両面同時研磨加工方法と加工装置及びそれを用いた磁気デイスク基板の研磨加工方法と磁気デイスクの製造方法並びに磁気デイスク
JP3734878B2 (ja) * 1996-04-25 2006-01-11 不二越機械工業株式会社 ウェーハの研磨装置
JPH11254308A (ja) * 1998-03-06 1999-09-21 Fujikoshi Mach Corp 両面研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011082857B4 (de) * 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke

Also Published As

Publication number Publication date
JPH11254308A (ja) 1999-09-21
US6080048A (en) 2000-06-27
MY119729A (en) 2005-07-29
DE69820021D1 (de) 2004-01-08
EP0940221A3 (en) 2002-06-12
EP0940221A2 (en) 1999-09-08
TW372902B (en) 1999-11-01
EP0940221B1 (en) 2003-11-26

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8364 No opposition during term of opposition