JP2003080453A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003080453A5 JP2003080453A5 JP2002245389A JP2002245389A JP2003080453A5 JP 2003080453 A5 JP2003080453 A5 JP 2003080453A5 JP 2002245389 A JP2002245389 A JP 2002245389A JP 2002245389 A JP2002245389 A JP 2002245389A JP 2003080453 A5 JP2003080453 A5 JP 2003080453A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- surface plate
- wafer
- polishing
- gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 description 54
- 235000012431 wafers Nutrition 0.000 description 44
- 230000033001 locomotion Effects 0.000 description 40
- 230000007246 mechanism Effects 0.000 description 21
- 239000004744 fabric Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002245389A JP3933544B2 (ja) | 2002-08-26 | 2002-08-26 | ワークの両面研磨方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002245389A JP3933544B2 (ja) | 2002-08-26 | 2002-08-26 | ワークの両面研磨方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP832697A Division JPH10202511A (ja) | 1997-01-21 | 1997-01-21 | 両面研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003080453A JP2003080453A (ja) | 2003-03-18 |
| JP2003080453A5 true JP2003080453A5 (enExample) | 2004-12-16 |
| JP3933544B2 JP3933544B2 (ja) | 2007-06-20 |
Family
ID=19196532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002245389A Expired - Lifetime JP3933544B2 (ja) | 2002-08-26 | 2002-08-26 | ワークの両面研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3933544B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107855900B (zh) * | 2017-12-27 | 2024-01-16 | 中原工学院 | 一种两工位聚晶金刚石复合片类抛光机 |
-
2002
- 2002-08-26 JP JP2002245389A patent/JP3933544B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6080048A (en) | Polishing machine | |
| JP2984263B1 (ja) | 研磨方法および研磨装置 | |
| JPH11254308A5 (enExample) | ||
| KR20040019918A (ko) | 연마기 | |
| JP3955154B2 (ja) | 両面研磨装置 | |
| JP4308344B2 (ja) | 両面研磨装置 | |
| JPH10202511A (ja) | 両面研磨装置 | |
| JP2004148425A (ja) | 両面研磨装置 | |
| JP2000158333A (ja) | 平面研磨加工方法および装置 | |
| JP3933544B2 (ja) | ワークの両面研磨方法 | |
| JP2003080453A5 (enExample) | ||
| JPH11254302A (ja) | 両面研磨装置 | |
| JP4037532B2 (ja) | 両面研磨装置 | |
| JP4051122B2 (ja) | 両面研磨装置 | |
| JP2001179600A (ja) | ドレッサ | |
| JP2000042913A (ja) | 両面研磨装置のワーク給排システム | |
| JP4425240B2 (ja) | 遊星ギヤ機構を用いた移動装置及び平面研磨機 | |
| JP4250594B2 (ja) | 遊星ギヤ機構を用いた移動装置及び平面研磨機 | |
| JP2004114240A (ja) | 片面平面研磨機 | |
| JPH11300602A (ja) | 両面研磨装置 | |
| JP3310924B2 (ja) | 両頭平面研削装置 | |
| JP2000033559A (ja) | 両面研磨装置 | |
| JP2006082145A (ja) | オスカータイプ両面研磨機 | |
| JP2001062686A (ja) | インデックス式エッジポリッシャー | |
| JP3942956B2 (ja) | 傾斜形平面研磨装置 |