JPH10270592A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JPH10270592A
JPH10270592A JP9088902A JP8890297A JPH10270592A JP H10270592 A JPH10270592 A JP H10270592A JP 9088902 A JP9088902 A JP 9088902A JP 8890297 A JP8890297 A JP 8890297A JP H10270592 A JPH10270592 A JP H10270592A
Authority
JP
Japan
Prior art keywords
integrated circuit
pattern
circuit chip
insulating substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9088902A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10270592A5 (enExample
Inventor
Kazuaki Ano
一章 阿野
Kenshiyou Murata
堅昇 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Japan Ltd
Original Assignee
Texas Instruments Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Japan Ltd filed Critical Texas Instruments Japan Ltd
Priority to JP9088902A priority Critical patent/JPH10270592A/ja
Priority to US09/046,299 priority patent/US6087717A/en
Publication of JPH10270592A publication Critical patent/JPH10270592A/ja
Publication of JPH10270592A5 publication Critical patent/JPH10270592A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W72/013—
    • H10W72/0113—
    • H10W74/114—
    • H10W70/656—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/07353—
    • H10W72/075—
    • H10W72/334—
    • H10W72/354—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/884—
    • H10W72/931—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—
    • H10W99/00—

Landscapes

  • Wire Bonding (AREA)
JP9088902A 1997-03-24 1997-03-24 半導体装置及びその製造方法 Withdrawn JPH10270592A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9088902A JPH10270592A (ja) 1997-03-24 1997-03-24 半導体装置及びその製造方法
US09/046,299 US6087717A (en) 1997-03-24 1998-03-23 Semiconductor device and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9088902A JPH10270592A (ja) 1997-03-24 1997-03-24 半導体装置及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007059152A Division JP4484891B2 (ja) 2007-03-08 2007-03-08 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH10270592A true JPH10270592A (ja) 1998-10-09
JPH10270592A5 JPH10270592A5 (enExample) 2004-07-22

Family

ID=13955893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9088902A Withdrawn JPH10270592A (ja) 1997-03-24 1997-03-24 半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US6087717A (enExample)
JP (1) JPH10270592A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076160A (ja) * 2000-09-01 2002-03-15 Rohm Co Ltd 半導体装置および基板

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JP2000208698A (ja) 1999-01-18 2000-07-28 Toshiba Corp 半導体装置
EP1114457B1 (de) * 1998-08-21 2010-05-12 Infineon Technologies AG Verfahren zur herstellung von integrierten schaltkreisen
JP3874062B2 (ja) * 2000-09-05 2007-01-31 セイコーエプソン株式会社 半導体装置
US6429390B1 (en) 2001-03-12 2002-08-06 International Business Machines Corporation Structure and method for forming the same of a printed wiring board having built-in inspection aids
US20020127771A1 (en) * 2001-03-12 2002-09-12 Salman Akram Multiple die package
SG95637A1 (en) 2001-03-15 2003-04-23 Micron Technology Inc Semiconductor/printed circuit board assembly, and computer system
US6441483B1 (en) 2001-03-30 2002-08-27 Micron Technology, Inc. Die stacking scheme
US6657311B1 (en) 2002-05-16 2003-12-02 Texas Instruments Incorporated Heat dissipating flip-chip ball grid array
US20050230821A1 (en) * 2004-04-15 2005-10-20 Kheng Lee T Semiconductor packages, and methods of forming semiconductor packages
US7217597B2 (en) 2004-06-22 2007-05-15 Micron Technology, Inc. Die stacking scheme
US7323968B2 (en) * 2005-12-09 2008-01-29 Sony Corporation Cross-phase adapter for powerline communications (PLC) network
KR100673765B1 (ko) * 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100635514B1 (ko) * 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4456092B2 (ja) 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688796B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100671641B1 (ko) * 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100671639B1 (ko) * 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
TWI360207B (en) 2007-10-22 2012-03-11 Advanced Semiconductor Eng Chip package structure and method of manufacturing
US20100193920A1 (en) * 2009-01-30 2010-08-05 Infineon Technologies Ag Semiconductor device, leadframe and method of encapsulating
US8288869B2 (en) * 2009-05-13 2012-10-16 Advanced Semiconductor Engineering, Inc. Semiconductor package with substrate having single metal layer and manufacturing methods thereof
US8367473B2 (en) * 2009-05-13 2013-02-05 Advanced Semiconductor Engineering, Inc. Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
TW201041105A (en) * 2009-05-13 2010-11-16 Advanced Semiconductor Eng Substrate having single patterned metal layer, and package applied with the same, and methods of manufacturing the substrate and package
US20100289132A1 (en) * 2009-05-13 2010-11-18 Shih-Fu Huang Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and package
TWI425603B (zh) * 2009-09-08 2014-02-01 日月光半導體製造股份有限公司 晶片封裝體
US20110084372A1 (en) 2009-10-14 2011-04-14 Advanced Semiconductor Engineering, Inc. Package carrier, semiconductor package, and process for fabricating same
US8786062B2 (en) * 2009-10-14 2014-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package and process for fabricating same
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 日月光半導體製造股份有限公司 半導體封裝件及其製造方法
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
JP6029873B2 (ja) * 2012-06-29 2016-11-24 新光電気工業株式会社 配線基板、配線基板の製造方法及び半導体装置の製造方法
KR102437245B1 (ko) 2017-10-24 2022-08-30 삼성전자주식회사 인쇄회로기판 및 그를 포함하는 반도체 패키지

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US5592025A (en) * 1992-08-06 1997-01-07 Motorola, Inc. Pad array semiconductor device
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076160A (ja) * 2000-09-01 2002-03-15 Rohm Co Ltd 半導体装置および基板

Also Published As

Publication number Publication date
US6087717A (en) 2000-07-11

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