JPH10242362A5 - - Google Patents

Info

Publication number
JPH10242362A5
JPH10242362A5 JP1997040402A JP4040297A JPH10242362A5 JP H10242362 A5 JPH10242362 A5 JP H10242362A5 JP 1997040402 A JP1997040402 A JP 1997040402A JP 4040297 A JP4040297 A JP 4040297A JP H10242362 A5 JPH10242362 A5 JP H10242362A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
lead
inner leads
support
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997040402A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10242362A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9040402A priority Critical patent/JPH10242362A/ja
Priority claimed from JP9040402A external-priority patent/JPH10242362A/ja
Priority to KR1019970013268A priority patent/KR19980069737A/ko
Priority to CN97110843A priority patent/CN1192046A/zh
Publication of JPH10242362A publication Critical patent/JPH10242362A/ja
Publication of JPH10242362A5 publication Critical patent/JPH10242362A5/ja
Pending legal-status Critical Current

Links

JP9040402A 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法 Pending JPH10242362A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9040402A JPH10242362A (ja) 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法
KR1019970013268A KR19980069737A (ko) 1997-02-25 1997-04-10 리이드프레임, 반도체장치 및 그 제조방법
CN97110843A CN1192046A (zh) 1997-02-25 1997-04-30 引线框、半导体器件及该半导体器件的制造工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9040402A JPH10242362A (ja) 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH10242362A JPH10242362A (ja) 1998-09-11
JPH10242362A5 true JPH10242362A5 (OSRAM) 2004-11-04

Family

ID=12579680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9040402A Pending JPH10242362A (ja) 1997-02-25 1997-02-25 リードフレーム、半導体装置及び半導体装置の製造方法

Country Status (3)

Country Link
JP (1) JPH10242362A (OSRAM)
KR (1) KR19980069737A (OSRAM)
CN (1) CN1192046A (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4534675B2 (ja) * 2004-08-31 2010-09-01 株式会社デンソー 集積回路装置
CN100377346C (zh) * 2004-12-23 2008-03-26 旺宏电子股份有限公司 封装件
JP2011247792A (ja) * 2010-05-28 2011-12-08 Advantest Corp プローブ構造体、プローブ装置、プローブ構造体の製造方法、および試験装置
CN118471938B (zh) * 2024-06-26 2025-02-11 池州昀钐半导体材料有限公司 一种导线框架和封装组件

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