JPH10242102A5 - - Google Patents

Info

Publication number
JPH10242102A5
JPH10242102A5 JP1997038079A JP3807997A JPH10242102A5 JP H10242102 A5 JPH10242102 A5 JP H10242102A5 JP 1997038079 A JP1997038079 A JP 1997038079A JP 3807997 A JP3807997 A JP 3807997A JP H10242102 A5 JPH10242102 A5 JP H10242102A5
Authority
JP
Japan
Prior art keywords
substrate
porous layer
manufacturing
etching
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997038079A
Other languages
English (en)
Japanese (ja)
Other versions
JP3831877B2 (ja
JPH10242102A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP03807997A external-priority patent/JP3831877B2/ja
Priority to JP03807997A priority Critical patent/JP3831877B2/ja
Priority to SG1998000290A priority patent/SG63810A1/en
Priority to TW090218651U priority patent/TW504041U/zh
Priority to AU55370/98A priority patent/AU742258B2/en
Priority to CA002229975A priority patent/CA2229975C/en
Priority to US09/025,409 priority patent/US6199563B1/en
Priority to EP98102897A priority patent/EP0860860A3/en
Priority to KR1019980005354A priority patent/KR100306054B1/ko
Priority to CN98105320A priority patent/CN1111900C/zh
Publication of JPH10242102A publication Critical patent/JPH10242102A/ja
Priority to US09/664,715 priority patent/US6767840B1/en
Priority to KR1020000065431A priority patent/KR100347824B1/ko
Publication of JPH10242102A5 publication Critical patent/JPH10242102A5/ja
Publication of JP3831877B2 publication Critical patent/JP3831877B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP03807997A 1997-02-21 1997-02-21 半導体基体の製造方法 Expired - Fee Related JP3831877B2 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP03807997A JP3831877B2 (ja) 1997-02-21 1997-02-21 半導体基体の製造方法
SG1998000290A SG63810A1 (en) 1997-02-21 1998-02-10 Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method
TW090218651U TW504041U (en) 1997-02-21 1998-02-10 Wafer processing apparatus
AU55370/98A AU742258B2 (en) 1997-02-21 1998-02-18 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
CA002229975A CA2229975C (en) 1997-02-21 1998-02-18 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
US09/025,409 US6199563B1 (en) 1997-02-21 1998-02-18 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
EP98102897A EP0860860A3 (en) 1997-02-21 1998-02-19 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
KR1019980005354A KR100306054B1 (ko) 1997-02-21 1998-02-20 웨이퍼처리장치,웨이퍼처리방법및반도체기체의제조방법
CN98105320A CN1111900C (zh) 1997-02-21 1998-02-20 晶片处理装置、晶片处理方法、和半导体衬底制备方法
US09/664,715 US6767840B1 (en) 1997-02-21 2000-09-19 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
KR1020000065431A KR100347824B1 (ko) 1997-02-21 2000-11-04 웨이퍼 처리장치, 웨이퍼 처리방법 및 반도체기체의제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03807997A JP3831877B2 (ja) 1997-02-21 1997-02-21 半導体基体の製造方法

Publications (3)

Publication Number Publication Date
JPH10242102A JPH10242102A (ja) 1998-09-11
JPH10242102A5 true JPH10242102A5 (enExample) 2005-01-20
JP3831877B2 JP3831877B2 (ja) 2006-10-11

Family

ID=12515490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03807997A Expired - Fee Related JP3831877B2 (ja) 1997-02-21 1997-02-21 半導体基体の製造方法

Country Status (1)

Country Link
JP (1) JP3831877B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091132B2 (en) * 2003-07-24 2006-08-15 Applied Materials, Inc. Ultrasonic assisted etch using corrosive liquids
JP5312662B1 (ja) * 2012-11-02 2013-10-09 倉敷紡績株式会社 ウエハ回転装置及びウエハ回転方法

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