JPH10229066A5 - - Google Patents

Info

Publication number
JPH10229066A5
JPH10229066A5 JP1997030887A JP3088797A JPH10229066A5 JP H10229066 A5 JPH10229066 A5 JP H10229066A5 JP 1997030887 A JP1997030887 A JP 1997030887A JP 3088797 A JP3088797 A JP 3088797A JP H10229066 A5 JPH10229066 A5 JP H10229066A5
Authority
JP
Japan
Prior art keywords
wafer
processing apparatus
wafer processing
bath
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997030887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10229066A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9030887A priority Critical patent/JPH10229066A/ja
Priority claimed from JP9030887A external-priority patent/JPH10229066A/ja
Priority to US09/015,582 priority patent/US6391067B2/en
Priority to CA002228552A priority patent/CA2228552C/en
Priority to AU52900/98A priority patent/AU714715B2/en
Priority to TW087101325A priority patent/TW394984B/zh
Priority to EP98101825A priority patent/EP0856874A3/en
Priority to CN98105640A priority patent/CN1104040C/zh
Priority to SG1998000242A priority patent/SG73498A1/en
Priority to KR1019980003021A priority patent/KR100382325B1/ko
Publication of JPH10229066A publication Critical patent/JPH10229066A/ja
Priority to KR1020000053236A priority patent/KR100355919B1/ko
Priority to US09/931,771 priority patent/US20020013065A1/en
Priority to CN02130553A priority patent/CN1420524A/zh
Publication of JPH10229066A5 publication Critical patent/JPH10229066A5/ja
Withdrawn legal-status Critical Current

Links

JP9030887A 1997-02-04 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置 Withdrawn JPH10229066A (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP9030887A JPH10229066A (ja) 1997-02-14 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置
US09/015,582 US6391067B2 (en) 1997-02-04 1998-01-29 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
CA002228552A CA2228552C (en) 1997-02-04 1998-02-02 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
AU52900/98A AU714715B2 (en) 1997-02-04 1998-02-03 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
TW087101325A TW394984B (en) 1997-02-04 1998-02-03 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
EP98101825A EP0856874A3 (en) 1997-02-04 1998-02-03 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
KR1019980003021A KR100382325B1 (ko) 1997-02-04 1998-02-04 웨이퍼처리장치및그방법,웨이퍼반송장치,그리고반도체제조장치
CN98105640A CN1104040C (zh) 1997-02-04 1998-02-04 晶片处理装置和晶片传送装置以及晶片处理方法
SG1998000242A SG73498A1 (en) 1997-02-04 1998-02-04 Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus
KR1020000053236A KR100355919B1 (ko) 1997-02-04 2000-09-07 반도체기판의 제조방법
US09/931,771 US20020013065A1 (en) 1997-02-04 2001-08-20 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
CN02130553A CN1420524A (zh) 1997-02-04 2002-08-16 半导体衬底制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9030887A JPH10229066A (ja) 1997-02-14 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004035544A Division JP2004158882A (ja) 2004-02-12 2004-02-12 半導体基体の製造方法

Publications (2)

Publication Number Publication Date
JPH10229066A JPH10229066A (ja) 1998-08-25
JPH10229066A5 true JPH10229066A5 (enExample) 2005-01-06

Family

ID=12316248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9030887A Withdrawn JPH10229066A (ja) 1997-02-04 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置

Country Status (1)

Country Link
JP (1) JPH10229066A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4934079B2 (ja) 2008-02-28 2012-05-16 信越半導体株式会社 超音波洗浄装置及び超音波洗浄方法
JP5728196B2 (ja) 2010-01-21 2015-06-03 シスメックス株式会社 試料調製装置および試料調製方法
JP5696491B2 (ja) * 2011-01-20 2015-04-08 株式会社Sumco ウェーハ洗浄装置及び洗浄方法
TWI485286B (zh) 2011-11-16 2015-05-21 荏原製作所股份有限公司 Electroless plating and electroless plating
JP5785480B2 (ja) * 2011-11-16 2015-09-30 株式会社荏原製作所 無電解めっき装置及び無電解めっき方法
JP2013222911A (ja) * 2012-04-19 2013-10-28 Shin Etsu Chem Co Ltd 基板処理装置及び基板処理方法、並びに太陽電池の製造方法
JP6985957B2 (ja) 2018-02-21 2021-12-22 キオクシア株式会社 半導体処理装置
CN108281372B (zh) * 2018-03-30 2023-04-28 上海思恩装备科技股份有限公司 均匀刻蚀基片的集成电路芯片湿处理装置及方法
CN111097917B (zh) 2018-10-26 2022-11-08 松下知识产权经营株式会社 金属微粒的制作方法及金属微粒的制作装置
CN114429920A (zh) * 2020-10-29 2022-05-03 中国科学院微电子研究所 晶片旋转驱动装置及驱动晶片旋转的方法
CN114628310A (zh) * 2020-12-10 2022-06-14 中国科学院微电子研究所 一种清洗设备

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