JPH10229066A - ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置 - Google Patents

ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置

Info

Publication number
JPH10229066A
JPH10229066A JP9030887A JP3088797A JPH10229066A JP H10229066 A JPH10229066 A JP H10229066A JP 9030887 A JP9030887 A JP 9030887A JP 3088797 A JP3088797 A JP 3088797A JP H10229066 A JPH10229066 A JP H10229066A
Authority
JP
Japan
Prior art keywords
wafer
substrate
processing
porous layer
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9030887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10229066A5 (enExample
Inventor
Kazutaka Yanagida
一隆 柳田
Kiyobumi Sakaguchi
清文 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP9030887A priority Critical patent/JPH10229066A/ja
Priority to US09/015,582 priority patent/US6391067B2/en
Priority to CA002228552A priority patent/CA2228552C/en
Priority to AU52900/98A priority patent/AU714715B2/en
Priority to TW087101325A priority patent/TW394984B/zh
Priority to EP98101825A priority patent/EP0856874A3/en
Priority to CN98105640A priority patent/CN1104040C/zh
Priority to KR1019980003021A priority patent/KR100382325B1/ko
Priority to SG1998000242A priority patent/SG73498A1/en
Publication of JPH10229066A publication Critical patent/JPH10229066A/ja
Priority to KR1020000053236A priority patent/KR100355919B1/ko
Priority to US09/931,771 priority patent/US20020013065A1/en
Priority to CN02130553A priority patent/CN1420524A/zh
Publication of JPH10229066A5 publication Critical patent/JPH10229066A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP9030887A 1997-02-04 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置 Withdrawn JPH10229066A (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP9030887A JPH10229066A (ja) 1997-02-14 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置
US09/015,582 US6391067B2 (en) 1997-02-04 1998-01-29 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
CA002228552A CA2228552C (en) 1997-02-04 1998-02-02 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
AU52900/98A AU714715B2 (en) 1997-02-04 1998-02-03 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
TW087101325A TW394984B (en) 1997-02-04 1998-02-03 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
EP98101825A EP0856874A3 (en) 1997-02-04 1998-02-03 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
KR1019980003021A KR100382325B1 (ko) 1997-02-04 1998-02-04 웨이퍼처리장치및그방법,웨이퍼반송장치,그리고반도체제조장치
CN98105640A CN1104040C (zh) 1997-02-04 1998-02-04 晶片处理装置和晶片传送装置以及晶片处理方法
SG1998000242A SG73498A1 (en) 1997-02-04 1998-02-04 Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus
KR1020000053236A KR100355919B1 (ko) 1997-02-04 2000-09-07 반도체기판의 제조방법
US09/931,771 US20020013065A1 (en) 1997-02-04 2001-08-20 Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
CN02130553A CN1420524A (zh) 1997-02-04 2002-08-16 半导体衬底制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9030887A JPH10229066A (ja) 1997-02-14 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004035544A Division JP2004158882A (ja) 2004-02-12 2004-02-12 半導体基体の製造方法

Publications (2)

Publication Number Publication Date
JPH10229066A true JPH10229066A (ja) 1998-08-25
JPH10229066A5 JPH10229066A5 (enExample) 2005-01-06

Family

ID=12316248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9030887A Withdrawn JPH10229066A (ja) 1997-02-04 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置

Country Status (1)

Country Link
JP (1) JPH10229066A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009107319A1 (ja) * 2008-02-28 2009-09-03 信越半導体株式会社 超音波洗浄装置及び超音波洗浄方法
JP2011169886A (ja) * 2010-01-21 2011-09-01 Sysmex Corp 試料調製装置
JP2012151320A (ja) * 2011-01-20 2012-08-09 Sumco Corp ウェーハ洗浄装置
JP2013104119A (ja) * 2011-11-16 2013-05-30 Ebara Corp 無電解めっき装置及び無電解めっき方法
JP2013222911A (ja) * 2012-04-19 2013-10-28 Shin Etsu Chem Co Ltd 基板処理装置及び基板処理方法、並びに太陽電池の製造方法
US9293364B2 (en) 2011-11-16 2016-03-22 Ebara Corporation Electroless plating apparatus and electroless plating method
CN108281372A (zh) * 2018-03-30 2018-07-13 上海思恩装备科技有限公司 均匀刻蚀基片的集成电路芯片湿处理装置及方法
US10978316B2 (en) 2018-02-21 2021-04-13 Toshiba Memory Corporation Semiconductor processing device
CN114429920A (zh) * 2020-10-29 2022-05-03 中国科学院微电子研究所 晶片旋转驱动装置及驱动晶片旋转的方法
US11318534B2 (en) 2018-10-26 2022-05-03 Panasonic Intellectual Property Management Co., Ltd. Metal microparticle production method and metal microparticle production device
CN114628310A (zh) * 2020-12-10 2022-06-14 中国科学院微电子研究所 一种清洗设备

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202111A (ja) * 2008-02-28 2009-09-10 Shin Etsu Handotai Co Ltd 超音波洗浄装置及び超音波洗浄方法
US8083856B2 (en) 2008-02-28 2011-12-27 Shin-Etsu Handotai Co., Ltd. Ultrasonic cleaning apparatus and ultrasonic cleaning method
WO2009107319A1 (ja) * 2008-02-28 2009-09-03 信越半導体株式会社 超音波洗浄装置及び超音波洗浄方法
JP2011169886A (ja) * 2010-01-21 2011-09-01 Sysmex Corp 試料調製装置
US9046505B2 (en) 2010-01-21 2015-06-02 Sysmex Corporation Sample preparation apparatus
JP2012151320A (ja) * 2011-01-20 2012-08-09 Sumco Corp ウェーハ洗浄装置
US9293364B2 (en) 2011-11-16 2016-03-22 Ebara Corporation Electroless plating apparatus and electroless plating method
JP2013104119A (ja) * 2011-11-16 2013-05-30 Ebara Corp 無電解めっき装置及び無電解めっき方法
JP2013222911A (ja) * 2012-04-19 2013-10-28 Shin Etsu Chem Co Ltd 基板処理装置及び基板処理方法、並びに太陽電池の製造方法
US10978316B2 (en) 2018-02-21 2021-04-13 Toshiba Memory Corporation Semiconductor processing device
CN108281372A (zh) * 2018-03-30 2018-07-13 上海思恩装备科技有限公司 均匀刻蚀基片的集成电路芯片湿处理装置及方法
CN108281372B (zh) * 2018-03-30 2023-04-28 上海思恩装备科技股份有限公司 均匀刻蚀基片的集成电路芯片湿处理装置及方法
US11318534B2 (en) 2018-10-26 2022-05-03 Panasonic Intellectual Property Management Co., Ltd. Metal microparticle production method and metal microparticle production device
CN114429920A (zh) * 2020-10-29 2022-05-03 中国科学院微电子研究所 晶片旋转驱动装置及驱动晶片旋转的方法
CN114628310A (zh) * 2020-12-10 2022-06-14 中国科学院微电子研究所 一种清洗设备

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