JPH10242103A5 - - Google Patents

Info

Publication number
JPH10242103A5
JPH10242103A5 JP1997038080A JP3808097A JPH10242103A5 JP H10242103 A5 JPH10242103 A5 JP H10242103A5 JP 1997038080 A JP1997038080 A JP 1997038080A JP 3808097 A JP3808097 A JP 3808097A JP H10242103 A5 JPH10242103 A5 JP H10242103A5
Authority
JP
Japan
Prior art keywords
wafer
processing apparatus
ultrasonic
driving force
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997038080A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10242103A (ja
JP3831878B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP03808097A external-priority patent/JP3831878B2/ja
Priority to JP03808097A priority Critical patent/JP3831878B2/ja
Priority to TW090218651U priority patent/TW504041U/zh
Priority to SG1998000290A priority patent/SG63810A1/en
Priority to AU55370/98A priority patent/AU742258B2/en
Priority to US09/025,409 priority patent/US6199563B1/en
Priority to CA002229975A priority patent/CA2229975C/en
Priority to EP98102897A priority patent/EP0860860A3/en
Priority to CN98105320A priority patent/CN1111900C/zh
Priority to KR1019980005354A priority patent/KR100306054B1/ko
Publication of JPH10242103A publication Critical patent/JPH10242103A/ja
Priority to US09/664,715 priority patent/US6767840B1/en
Priority to KR1020000065431A priority patent/KR100347824B1/ko
Publication of JPH10242103A5 publication Critical patent/JPH10242103A5/ja
Publication of JP3831878B2 publication Critical patent/JP3831878B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP03808097A 1997-02-21 1997-02-21 ウェハ処理装置 Expired - Fee Related JP3831878B2 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP03808097A JP3831878B2 (ja) 1997-02-21 1997-02-21 ウェハ処理装置
TW090218651U TW504041U (en) 1997-02-21 1998-02-10 Wafer processing apparatus
SG1998000290A SG63810A1 (en) 1997-02-21 1998-02-10 Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method
AU55370/98A AU742258B2 (en) 1997-02-21 1998-02-18 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
US09/025,409 US6199563B1 (en) 1997-02-21 1998-02-18 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
CA002229975A CA2229975C (en) 1997-02-21 1998-02-18 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
EP98102897A EP0860860A3 (en) 1997-02-21 1998-02-19 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
CN98105320A CN1111900C (zh) 1997-02-21 1998-02-20 晶片处理装置、晶片处理方法、和半导体衬底制备方法
KR1019980005354A KR100306054B1 (ko) 1997-02-21 1998-02-20 웨이퍼처리장치,웨이퍼처리방법및반도체기체의제조방법
US09/664,715 US6767840B1 (en) 1997-02-21 2000-09-19 Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
KR1020000065431A KR100347824B1 (ko) 1997-02-21 2000-11-04 웨이퍼 처리장치, 웨이퍼 처리방법 및 반도체기체의제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03808097A JP3831878B2 (ja) 1997-02-21 1997-02-21 ウェハ処理装置

Publications (3)

Publication Number Publication Date
JPH10242103A JPH10242103A (ja) 1998-09-11
JPH10242103A5 true JPH10242103A5 (enExample) 2005-01-20
JP3831878B2 JP3831878B2 (ja) 2006-10-11

Family

ID=12515515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03808097A Expired - Fee Related JP3831878B2 (ja) 1997-02-21 1997-02-21 ウェハ処理装置

Country Status (1)

Country Link
JP (1) JP3831878B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526374B2 (ja) * 2004-03-30 2010-08-18 大日本スクリーン製造株式会社 基板処理装置
JP2006181555A (ja) * 2004-12-28 2006-07-13 Mitsubishi Materials Polycrystalline Silicon Corp 多結晶シリコンの洗浄方法と洗浄装置
JP4451430B2 (ja) 2006-11-28 2010-04-14 昭和電工株式会社 磁気記録媒体用基板の洗浄装置および洗浄方法
JP5696491B2 (ja) * 2011-01-20 2015-04-08 株式会社Sumco ウェーハ洗浄装置及び洗浄方法
CN110369390A (zh) * 2019-07-05 2019-10-25 上海提牛机电设备有限公司 一种陶瓷盘360度旋装置
CN117293066B (zh) * 2023-11-24 2024-01-30 西安寰微电子科技有限公司 一种半导体硅片的清洗装置

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