JPH1092781A5 - - Google Patents

Info

Publication number
JPH1092781A5
JPH1092781A5 JP1997160595A JP16059597A JPH1092781A5 JP H1092781 A5 JPH1092781 A5 JP H1092781A5 JP 1997160595 A JP1997160595 A JP 1997160595A JP 16059597 A JP16059597 A JP 16059597A JP H1092781 A5 JPH1092781 A5 JP H1092781A5
Authority
JP
Japan
Prior art keywords
substrate
liquid removal
transporting
mechanical polishing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997160595A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1092781A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP16059597A priority Critical patent/JPH1092781A/ja
Priority claimed from JP16059597A external-priority patent/JPH1092781A/ja
Publication of JPH1092781A publication Critical patent/JPH1092781A/ja
Publication of JPH1092781A5 publication Critical patent/JPH1092781A5/ja
Pending legal-status Critical Current

Links

JP16059597A 1996-06-04 1997-06-03 基板の搬送方法及び装置 Pending JPH1092781A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16059597A JPH1092781A (ja) 1996-06-04 1997-06-03 基板の搬送方法及び装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-163942 1996-06-04
JP16394296 1996-06-04
JP16059597A JPH1092781A (ja) 1996-06-04 1997-06-03 基板の搬送方法及び装置

Publications (2)

Publication Number Publication Date
JPH1092781A JPH1092781A (ja) 1998-04-10
JPH1092781A5 true JPH1092781A5 (enExample) 2004-12-16

Family

ID=26487057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16059597A Pending JPH1092781A (ja) 1996-06-04 1997-06-03 基板の搬送方法及び装置

Country Status (1)

Country Link
JP (1) JPH1092781A (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040684A (ja) * 1998-07-23 2000-02-08 Ebara Corp 洗浄装置
JP2000040679A (ja) 1998-07-24 2000-02-08 Hitachi Ltd 半導体集積回路装置の製造方法
JP2000133623A (ja) * 1998-10-28 2000-05-12 Toshiba Corp 平坦化方法及び平坦化装置
JP3616725B2 (ja) * 1998-12-07 2005-02-02 信越半導体株式会社 基板の処理方法及び処理装置
US6354922B1 (en) * 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
JP3990073B2 (ja) * 1999-06-17 2007-10-10 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP3510177B2 (ja) * 2000-03-23 2004-03-22 株式会社東京精密 ウェハ研磨装置
JP2001274123A (ja) * 2000-03-27 2001-10-05 Matsushita Electric Ind Co Ltd 基板研磨装置及び基板研磨方法
JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP4764604B2 (ja) * 2004-01-30 2011-09-07 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2006263414A (ja) * 2005-03-23 2006-10-05 Takeshi Kobayashi ジンギスカン鍋用清掃方法およびその装置
JP4413882B2 (ja) * 2006-03-20 2010-02-10 株式会社荏原製作所 ポリッシング装置
JP2007043183A (ja) * 2006-09-05 2007-02-15 Renesas Technology Corp 半導体集積回路装置の製造方法
JP5389478B2 (ja) * 2009-03-06 2014-01-15 オリンパス株式会社 洗浄乾燥方法及び洗浄乾燥装置
JP5446584B2 (ja) 2009-08-20 2014-03-19 富士通株式会社 洗浄システム及び洗浄方法
JP6914062B2 (ja) * 2017-03-03 2021-08-04 東京エレクトロン株式会社 基板処理装置および基板処理方法
TWI831656B (zh) * 2018-01-04 2024-02-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7137941B2 (ja) * 2018-03-15 2022-09-15 株式会社荏原製作所 基板洗浄装置、及び基板洗浄方法
JP2020017618A (ja) * 2018-07-25 2020-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7504563B2 (ja) * 2019-02-26 2024-06-24 株式会社荏原製作所 研磨されるウェーハの上面から液体を除去する方法
JP7080766B2 (ja) * 2018-08-07 2022-06-06 株式会社荏原製作所 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置
JP2023003507A (ja) * 2021-06-24 2023-01-17 株式会社ディスコ 加工装置
KR20230021193A (ko) * 2021-08-03 2023-02-14 삼성전자주식회사 기판 처리 챔버, 이를 포함한 기판 처리 장치 및 이들을 이용한 기판 처리 방법

Similar Documents

Publication Publication Date Title
JPH1092781A5 (enExample)
EP1091388A3 (en) Method and apparatus for cleaning a substrate
CA2306242A1 (en) Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
ITBS970064V0 (it) Macchina per trattamenti di asciugatura lucidatura e rigenerazione di posate ed oggetti metallici da tavola
DE69816219D1 (de) Reinigungsnachbehandlung
AU4691800A (en) Method and system for cleaning a chemical mechanical polishing pad
KR930008983A (ko) 반도체 웨이퍼의 기계적인 평탄화 작용후 폴리싱 슬러리를 제거하는 방법
EP0680078A3 (en) Surface treatment for semiconductor substrate.
EP0878831A3 (en) Double side cleaning apparatus for semiconductor substrate
WO2000000560A3 (en) Chemical mechanical polishing slurry and method for using same
TW429462B (en) Manufacturing method and processing device for semiconductor device
DE60006504D1 (de) Aufbringung von substanzen auf feste gegenstände im in-line verfahren
WO2003003428A3 (en) Apparatus, process and method for mounting and treating a substrate
EP0856874A3 (en) Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
JP2000294524A5 (enExample)
EP1453084A3 (en) Post-etch cleaning treatment
SG99280A1 (en) Chemical mechanical abrasive composition for use in semiconductor processing
JP2001096245A (ja) 洗浄方法および洗浄装置
EP0877418A3 (en) Edge-polishing apparatus and method
TW200501198A (en) Method of cleaning surface of semiconductor wafer
DeJule Trends in wafer cleaning.
CA2389659A1 (en) Machine for localised cleaning with electrolytic and/or ultrasound cell, for pickling and/or polishing
EP0845329A3 (en) Method and apparatus for polishing a thin plate
PT1084771E (pt) Maquina para o tratamento de fachadas
EP0934801A3 (en) Method and apparatus for polishing work