JPH1092781A - 基板の搬送方法及び装置 - Google Patents

基板の搬送方法及び装置

Info

Publication number
JPH1092781A
JPH1092781A JP16059597A JP16059597A JPH1092781A JP H1092781 A JPH1092781 A JP H1092781A JP 16059597 A JP16059597 A JP 16059597A JP 16059597 A JP16059597 A JP 16059597A JP H1092781 A JPH1092781 A JP H1092781A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor substrate
cleaning
processing
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16059597A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1092781A5 (enExample
Inventor
Toshiro Maekawa
敏郎 前川
Toshimi Hamada
聡美 濱田
Riichiro Aoki
利一郎 青木
Shoichi Kodama
祥一 児玉
Hiromi Yajima
比呂海 矢島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Toshiba Corp
Original Assignee
Ebara Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Toshiba Corp filed Critical Ebara Corp
Priority to JP16059597A priority Critical patent/JPH1092781A/ja
Publication of JPH1092781A publication Critical patent/JPH1092781A/ja
Publication of JPH1092781A5 publication Critical patent/JPH1092781A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP16059597A 1996-06-04 1997-06-03 基板の搬送方法及び装置 Pending JPH1092781A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16059597A JPH1092781A (ja) 1996-06-04 1997-06-03 基板の搬送方法及び装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-163942 1996-06-04
JP16394296 1996-06-04
JP16059597A JPH1092781A (ja) 1996-06-04 1997-06-03 基板の搬送方法及び装置

Publications (2)

Publication Number Publication Date
JPH1092781A true JPH1092781A (ja) 1998-04-10
JPH1092781A5 JPH1092781A5 (enExample) 2004-12-16

Family

ID=26487057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16059597A Pending JPH1092781A (ja) 1996-06-04 1997-06-03 基板の搬送方法及び装置

Country Status (1)

Country Link
JP (1) JPH1092781A (enExample)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040684A (ja) * 1998-07-23 2000-02-08 Ebara Corp 洗浄装置
JP2000133623A (ja) * 1998-10-28 2000-05-12 Toshiba Corp 平坦化方法及び平坦化装置
JP2000173964A (ja) * 1998-12-07 2000-06-23 Shin Etsu Handotai Co Ltd 基板の処理方法及び処理装置
JP2001007069A (ja) * 1999-06-17 2001-01-12 Ebara Corp 基板洗浄装置
JP2001274121A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置
JP2001274123A (ja) * 2000-03-27 2001-10-05 Matsushita Electric Ind Co Ltd 基板研磨装置及び基板研磨方法
WO2003088335A1 (en) * 2002-04-15 2003-10-23 Ebara Corporation Polishing device and substrate processing device
JP2004200707A (ja) * 2004-01-30 2004-07-15 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2006179955A (ja) * 2006-03-20 2006-07-06 Ebara Corp ポリッシング装置
JP2006263414A (ja) * 2005-03-23 2006-10-05 Takeshi Kobayashi ジンギスカン鍋用清掃方法およびその装置
JP2007043183A (ja) * 2006-09-05 2007-02-15 Renesas Technology Corp 半導体集積回路装置の製造方法
KR100731895B1 (ko) * 1999-08-20 2007-06-25 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
JP2010207664A (ja) * 2009-03-06 2010-09-24 Olympus Corp 洗浄乾燥方法及び洗浄乾燥装置
JP2011044562A (ja) * 2009-08-20 2011-03-03 Fujitsu Ltd 洗浄システム及び洗浄方法
US8129275B2 (en) 1998-07-24 2012-03-06 Renesas Electronics Corporation Process for manufacturing semiconductor integrated circuit device
KR20180101218A (ko) * 2017-03-03 2018-09-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
WO2019176455A1 (ja) * 2018-03-15 2019-09-19 株式会社荏原製作所 基板洗浄装置、及び基板洗浄方法
JP2020017618A (ja) * 2018-07-25 2020-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2020024137A (ja) * 2018-08-07 2020-02-13 株式会社荏原製作所 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置
JP2023003507A (ja) * 2021-06-24 2023-01-17 株式会社ディスコ 加工装置
US20230043451A1 (en) * 2021-08-03 2023-02-09 Samsung Electronics Co., Ltd. Substrate processing chamber, substrate processing system including the same, and substrate processing method using the same
JP2023090770A (ja) * 2019-02-26 2023-06-29 株式会社荏原製作所 研磨されるウェーハの上面から液体を除去する方法
JP2023164633A (ja) * 2018-01-04 2023-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040684A (ja) * 1998-07-23 2000-02-08 Ebara Corp 洗浄装置
US8129275B2 (en) 1998-07-24 2012-03-06 Renesas Electronics Corporation Process for manufacturing semiconductor integrated circuit device
JP2000133623A (ja) * 1998-10-28 2000-05-12 Toshiba Corp 平坦化方法及び平坦化装置
JP2000173964A (ja) * 1998-12-07 2000-06-23 Shin Etsu Handotai Co Ltd 基板の処理方法及び処理装置
JP2001007069A (ja) * 1999-06-17 2001-01-12 Ebara Corp 基板洗浄装置
KR100731895B1 (ko) * 1999-08-20 2007-06-25 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
JP2001274121A (ja) * 2000-03-23 2001-10-05 Tokyo Seimitsu Co Ltd ウェハ研磨装置
JP2001274123A (ja) * 2000-03-27 2001-10-05 Matsushita Electric Ind Co Ltd 基板研磨装置及び基板研磨方法
WO2003088335A1 (en) * 2002-04-15 2003-10-23 Ebara Corporation Polishing device and substrate processing device
US7850817B2 (en) 2002-04-15 2010-12-14 Ebara Corporation Polishing device and substrate processing device
KR100964007B1 (ko) 2002-04-15 2010-06-15 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
JP2004200707A (ja) * 2004-01-30 2004-07-15 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2006263414A (ja) * 2005-03-23 2006-10-05 Takeshi Kobayashi ジンギスカン鍋用清掃方法およびその装置
JP2006179955A (ja) * 2006-03-20 2006-07-06 Ebara Corp ポリッシング装置
JP2007043183A (ja) * 2006-09-05 2007-02-15 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2010207664A (ja) * 2009-03-06 2010-09-24 Olympus Corp 洗浄乾燥方法及び洗浄乾燥装置
JP2011044562A (ja) * 2009-08-20 2011-03-03 Fujitsu Ltd 洗浄システム及び洗浄方法
US8496016B2 (en) 2009-08-20 2013-07-30 Fujitsu Limited Cleaning apparatus and cleaning method
KR20180101218A (ko) * 2017-03-03 2018-09-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP2018147994A (ja) * 2017-03-03 2018-09-20 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2023164633A (ja) * 2018-01-04 2023-11-10 東京エレクトロン株式会社 基板処理装置および基板処理方法
WO2019176455A1 (ja) * 2018-03-15 2019-09-19 株式会社荏原製作所 基板洗浄装置、及び基板洗浄方法
JP2019161107A (ja) * 2018-03-15 2019-09-19 株式会社荏原製作所 基板洗浄装置、及び基板洗浄方法
JP2020017618A (ja) * 2018-07-25 2020-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2020024137A (ja) * 2018-08-07 2020-02-13 株式会社荏原製作所 液面検出センサと組み合わせて使用されるセンサターゲットカバー、および湿式処理装置
JP2023090770A (ja) * 2019-02-26 2023-06-29 株式会社荏原製作所 研磨されるウェーハの上面から液体を除去する方法
JP2023003507A (ja) * 2021-06-24 2023-01-17 株式会社ディスコ 加工装置
US20230043451A1 (en) * 2021-08-03 2023-02-09 Samsung Electronics Co., Ltd. Substrate processing chamber, substrate processing system including the same, and substrate processing method using the same
US12191190B2 (en) * 2021-08-03 2025-01-07 Samsung Electronics Co., Ltd. Substrate processing chamber, substrate processing system including the same, and substrate processing method using the same

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