EP0934801A3 - Method and apparatus for polishing work - Google Patents

Method and apparatus for polishing work Download PDF

Info

Publication number
EP0934801A3
EP0934801A3 EP99300772A EP99300772A EP0934801A3 EP 0934801 A3 EP0934801 A3 EP 0934801A3 EP 99300772 A EP99300772 A EP 99300772A EP 99300772 A EP99300772 A EP 99300772A EP 0934801 A3 EP0934801 A3 EP 0934801A3
Authority
EP
European Patent Office
Prior art keywords
polishing
work
work holding
holding surface
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99300772A
Other languages
German (de)
French (fr)
Other versions
EP0934801A2 (en
EP0934801B1 (en
Inventor
Hisashi c/o Shirakawa R & D Center Masumura
Fumio c/o Shirakawa R & D Center Suzuki
Kouichi c/o Naoetsu Denshi Company Ltd. Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of EP0934801A2 publication Critical patent/EP0934801A2/en
Publication of EP0934801A3 publication Critical patent/EP0934801A3/en
Application granted granted Critical
Publication of EP0934801B1 publication Critical patent/EP0934801B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

There is disclosed a method of processing a work comprising polishing a work holding surface 4a of a work holding plate 4 by contacting and rubbing a work holding surface 4a of a work holding plate 4 with a polishing pad 2 attached on a polishing turn table 1 with providing polishing agent 5 thereto, holding a wafer W on said work holding surface 4a by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad 2 to polish the work with providing polishing agent 5 characterized in that temperature of the polishing agent 5 or the polishing turn table 1 is controlled by temperature controller 7,9 so that a temperature of said work holding surface 4a when polishing said work holding plate 4 and a temperature of said work holding surface 4a when polishing the wafer w are controlled to be the same.
Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work.
EP99300772A 1998-02-05 1999-02-02 Method for polishing work Expired - Lifetime EP0934801B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4131198 1998-02-05
JP04131198A JP3467184B2 (en) 1998-02-05 1998-02-05 Work polishing method

Publications (3)

Publication Number Publication Date
EP0934801A2 EP0934801A2 (en) 1999-08-11
EP0934801A3 true EP0934801A3 (en) 2002-07-10
EP0934801B1 EP0934801B1 (en) 2004-01-14

Family

ID=12604968

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99300772A Expired - Lifetime EP0934801B1 (en) 1998-02-05 1999-02-02 Method for polishing work

Country Status (6)

Country Link
US (1) US6399498B1 (en)
EP (1) EP0934801B1 (en)
JP (1) JP3467184B2 (en)
DE (1) DE69914113T2 (en)
MY (1) MY122322A (en)
TW (1) TW393374B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010024877A1 (en) 2000-03-17 2001-09-27 Krishna Vepa Cluster tool systems and methods for processing wafers
CN1461251A (en) 2000-11-21 2003-12-10 Memc电子材料有限公司 Semiconductor wafer, polishing apparatus and method
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
US6712673B2 (en) 2001-10-04 2004-03-30 Memc Electronic Materials, Inc. Polishing apparatus, polishing head and method
DE10154050A1 (en) * 2001-11-02 2003-05-15 Schott Glas Processing of inhomogeneous materials
JP6180873B2 (en) * 2013-08-30 2017-08-16 株式会社クラレ Fiber composite sheet, polishing pad and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634937A (en) * 1986-06-26 1988-01-09 Mitsubishi Plastics Ind Ltd Preparation of laminated plate
EP0388972A2 (en) * 1989-03-24 1990-09-26 Sumitomo Electric Industries, Ltd. Apparatus for grinding semiconductor wafer
JPH04242929A (en) * 1990-12-26 1992-08-31 Shin Etsu Handotai Co Ltd Wafer polishing method
EP0650806A1 (en) * 1993-10-28 1995-05-03 Kabushiki Kaisha Toshiba Polishing apparatus of semiconductor wafer
US5643060A (en) * 1993-08-25 1997-07-01 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including heater

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132037A (en) * 1977-02-28 1979-01-02 Siltec Corporation Apparatus for polishing semiconductor wafers
JPS58180026A (en) 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> Attracting board for grinding wafer
JPS63318260A (en) 1987-06-22 1988-12-27 Kyushu Denshi Kinzoku Kk Surface working method
JP2655975B2 (en) * 1992-09-18 1997-09-24 三菱マテリアル株式会社 Wafer polishing equipment
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US5910041A (en) * 1997-03-06 1999-06-08 Keltech Engineering Lapping apparatus and process with raised edge on platen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634937A (en) * 1986-06-26 1988-01-09 Mitsubishi Plastics Ind Ltd Preparation of laminated plate
EP0388972A2 (en) * 1989-03-24 1990-09-26 Sumitomo Electric Industries, Ltd. Apparatus for grinding semiconductor wafer
JPH04242929A (en) * 1990-12-26 1992-08-31 Shin Etsu Handotai Co Ltd Wafer polishing method
US5643060A (en) * 1993-08-25 1997-07-01 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including heater
EP0650806A1 (en) * 1993-10-28 1995-05-03 Kabushiki Kaisha Toshiba Polishing apparatus of semiconductor wafer

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 197 (M - 706) 8 June 1988 (1988-06-08) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 013 (E - 1304) 11 January 1993 (1993-01-11) *

Also Published As

Publication number Publication date
EP0934801A2 (en) 1999-08-11
TW393374B (en) 2000-06-11
DE69914113T2 (en) 2004-11-11
JPH11221753A (en) 1999-08-17
MY122322A (en) 2006-04-29
DE69914113D1 (en) 2004-02-19
US6399498B1 (en) 2002-06-04
JP3467184B2 (en) 2003-11-17
EP0934801B1 (en) 2004-01-14

Similar Documents

Publication Publication Date Title
EP1055486A3 (en) Dressing apparatus and polishing apparatus
EP0904895A3 (en) Substrate polishing method and apparatus
EP0454362A3 (en) Backing pad, method for precision surface machining thereof, and method for polishing semiconductor wafer by use of the backing pad
TW376350B (en) Process for polishing a semiconductor device substrate
TW344695B (en) Method for polishing semiconductor substrate
EP0684634A3 (en) Method of rough polishing semiconductor wafers to reduce surface roughness
EP0878269A3 (en) Apparatus for conditioning polishing pads
IL155856A0 (en) Abrasive article having a window system for polishing wafers, and methods
EP1389505A3 (en) Polishing apparatus
EP1037262A3 (en) Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer
ATE296185T1 (en) METHOD AND DEVICE FOR PLANARIZING MICROELECTRONIC SUBSTRATE STRUCTURE
EP0776030A3 (en) Apparatus and method for double-side polishing semiconductor wafers
WO2002053322A3 (en) System and method for polishing and planarization of semiconductor wafers using reduced surface area polishing pads
GB2326166B (en) Dressing tool for the surface of an abrasive cloth and its production process
MY119522A (en) Polishing apparatus
MY126569A (en) Abrasive articles comprising a fluorochemical agent for wafer surface modification
EP0894570A3 (en) Method and apparatus for polishing
CA2305106A1 (en) Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
EP1114697A3 (en) Apparatus and method for controlled delivery of slurry to a region of a polishing device
EP1080839A3 (en) Polishing apparatus and dressing method
TW377467B (en) Polishing system, polishing method, polishing pad, and method of forming polishing pad
EP1075898A3 (en) Dresser and dressing apparatus
MY133452A (en) Polishing method for wafer and holding plate
GB2329601A (en) Methods and apparatus for the chemical mechanical planarization of electronic devices
EP0860238A3 (en) Polishing apparatus

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

17P Request for examination filed

Effective date: 20020904

17Q First examination report despatched

Effective date: 20021115

AKX Designation fees paid

Designated state(s): DE GB

RTI1 Title (correction)

Free format text: METHOD FOR POLISHING WORK

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE GB

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 69914113

Country of ref document: DE

Date of ref document: 20040219

Kind code of ref document: P

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20040414

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20040414

26N No opposition filed

Effective date: 20041015

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20050127

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060901