JPS6154755B2 - - Google Patents
Info
- Publication number
- JPS6154755B2 JPS6154755B2 JP23292082A JP23292082A JPS6154755B2 JP S6154755 B2 JPS6154755 B2 JP S6154755B2 JP 23292082 A JP23292082 A JP 23292082A JP 23292082 A JP23292082 A JP 23292082A JP S6154755 B2 JPS6154755 B2 JP S6154755B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- workpiece
- processing
- laser beam
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 7
- 238000003486 chemical etching Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000003672 processing method Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 description 38
- 239000000919 ceramic Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002585 base Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23292082A JPS59121174A (ja) | 1982-12-24 | 1982-12-24 | 脆性材料の複合加工法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23292082A JPS59121174A (ja) | 1982-12-24 | 1982-12-24 | 脆性材料の複合加工法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59121174A JPS59121174A (ja) | 1984-07-13 |
| JPS6154755B2 true JPS6154755B2 (enExample) | 1986-11-25 |
Family
ID=16946902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23292082A Granted JPS59121174A (ja) | 1982-12-24 | 1982-12-24 | 脆性材料の複合加工法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121174A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0733255U (ja) * | 1993-11-30 | 1995-06-20 | 株式会社東陽鉄工 | 切断用ナイフ |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6060995A (ja) * | 1983-09-09 | 1985-04-08 | 日本電信電話株式会社 | セラミツクステンシルの製造方法およびその装置 |
| JPS61238986A (ja) * | 1985-04-17 | 1986-10-24 | Nec Corp | レ−ザ加工装置 |
-
1982
- 1982-12-24 JP JP23292082A patent/JPS59121174A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0733255U (ja) * | 1993-11-30 | 1995-06-20 | 株式会社東陽鉄工 | 切断用ナイフ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59121174A (ja) | 1984-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7500261B2 (ja) | ウエーハの生成方法 | |
| CN111889896B (zh) | 一种超声协同激光的晶锭剥离方法 | |
| CN110640337A (zh) | 一种液态流动涂层辅助激光背向湿刻加工低锥度玻璃深孔的装置及方法 | |
| JPH0334852B2 (enExample) | ||
| CN109158775A (zh) | 一种改善孔锥度和孔壁质量的激光打孔装置及方法 | |
| JP2022025566A (ja) | Ｓｉ基板生成方法 | |
| CN115570271A (zh) | 一种基于高重频飞秒激光倾斜抛光碳化硅陶瓷的方法 | |
| CN111571043B (zh) | 晶片的加工方法 | |
| JPH10291084A (ja) | 脆性材料のレーザ加工方法及び装置 | |
| JPS6154755B2 (enExample) | ||
| JP2002113587A (ja) | レーザ加工方法及びレーザ加工装置 | |
| CN222873621U (zh) | 一种激光辅助湿法刻蚀加工金刚石微孔装置 | |
| JP2002184724A (ja) | シリコンインゴット切断装置、シリコンインゴットの切断方法、及びシリコンウェハ | |
| JP7258419B2 (ja) | 成形品の製造方法 | |
| JPH09141480A (ja) | アブレーション加工方法 | |
| JPH04203618A (ja) | セラミックス製動圧軸受の溝加工方法 | |
| CN115121888B (zh) | 一种叠层陶瓷基板表面微结构的加工方法 | |
| JPS6394657A (ja) | レ−ザ加工方法およびレ−ザ加工装置 | |
| JP2003010991A (ja) | レーザ加工方法 | |
| JPH0399790A (ja) | レーザ加工装置 | |
| CN114289412A (zh) | 一种激光清洗-微织构复合加工装备及工艺 | |
| CN113681155A (zh) | 一种激光辅助电化学处理孔质量的方法及装置 | |
| JPS61206587A (ja) | レ−ザ加工方法 | |
| CN118664131A (zh) | 一种激光辅助湿法刻蚀加工金刚石微孔装置及方法 | |
| JPH06333910A (ja) | レーザによるエッチング方法 |