JPH0789578B2 - 自己整合けい素化合物化ｍｏｓ工法による精密抵抗体の製造方法 - Google Patents
自己整合けい素化合物化ｍｏｓ工法による精密抵抗体の製造方法Info
- Publication number
- JPH0789578B2 JPH0789578B2 JP3097102A JP9710291A JPH0789578B2 JP H0789578 B2 JPH0789578 B2 JP H0789578B2 JP 3097102 A JP3097102 A JP 3097102A JP 9710291 A JP9710291 A JP 9710291A JP H0789578 B2 JPH0789578 B2 JP H0789578B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- resistor
- transistor
- oxide
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 125000006850 spacer group Chemical group 0.000 claims description 13
- 150000003377 silicon compounds Chemical group 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 10
- 230000000873 masking effect Effects 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 23
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 238000002513 implantation Methods 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66166—Resistors with PN junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US515854 | 1990-04-27 | ||
| US07/515,854 US5134088A (en) | 1990-04-27 | 1990-04-27 | Precision resistor in self-aligned silicided mos process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04229647A JPH04229647A (ja) | 1992-08-19 |
| JPH0789578B2 true JPH0789578B2 (ja) | 1995-09-27 |
Family
ID=24053043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3097102A Expired - Lifetime JPH0789578B2 (ja) | 1990-04-27 | 1991-04-26 | 自己整合けい素化合物化ｍｏｓ工法による精密抵抗体の製造方法 |
Country Status (8)
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0545363A1 (en) * | 1991-12-06 | 1993-06-09 | National Semiconductor Corporation | Integrated circuit fabrication process and structure |
| US5439841A (en) * | 1994-01-12 | 1995-08-08 | Micrel, Inc. | High value gate leakage resistor |
| JPH07226504A (ja) * | 1994-02-09 | 1995-08-22 | Nec Corp | Ｍｏｓ型半導体装置及びその製造方法 |
| JP2934738B2 (ja) * | 1994-03-18 | 1999-08-16 | セイコーインスツルメンツ株式会社 | 半導体装置およびその製造方法 |
| JP3297784B2 (ja) * | 1994-09-29 | 2002-07-02 | ソニー株式会社 | 拡散層抵抗の形成方法 |
| DE19507802C1 (de) * | 1995-03-06 | 1996-05-30 | Siemens Ag | Verfahren zum Herstellen eines integrierten Widerstandes |
| JP3243151B2 (ja) * | 1995-06-01 | 2002-01-07 | 東芝マイクロエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US5712173A (en) * | 1996-01-24 | 1998-01-27 | Advanced Micro Devices, Inc. | Method of making semiconductor device with self-aligned insulator |
| US5679593A (en) * | 1996-02-01 | 1997-10-21 | Micron Technology, Inc. | Method of fabricating a high resistance integrated circuit resistor |
| KR100233557B1 (ko) * | 1996-06-29 | 1999-12-01 | 김영환 | 아날로그용 반도체 소자의 폴리레지스터 및 그의 제조방법 |
| US5728612A (en) * | 1996-07-19 | 1998-03-17 | Lsi Logic Corporation | Method for forming minimum area structures for sub-micron CMOS ESD protection in integrated circuit structures without extra implant and mask steps, and articles formed thereby |
| JP3572850B2 (ja) * | 1997-02-12 | 2004-10-06 | ヤマハ株式会社 | 半導体装置の製法 |
| DE69737947D1 (de) * | 1997-05-20 | 2007-09-06 | St Microelectronics Srl | Herstellungsverfahren für integrierten Schaltkreis mit MOS-Transistoren von hoher Durchbruchspannung und mit Präzisionswiderständen |
| US6143613A (en) * | 1997-06-30 | 2000-11-07 | Vlsi Technology, Inc. | Selective exclusion of silicide formation to make polysilicon resistors |
| JPH11330385A (ja) * | 1998-05-20 | 1999-11-30 | Mitsumi Electric Co Ltd | Ｃｍｏｓデバイス |
| DE69832162D1 (de) | 1998-07-22 | 2005-12-08 | St Microelectronics Srl | Herstellungsverfahren für ein elektronisches Bauelement, das MOS Transistoren mit salizidierten Übergängen und nicht salizidierten Widerständen enthält |
| JP2005183827A (ja) * | 2003-12-22 | 2005-07-07 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| JP2005191228A (ja) * | 2003-12-25 | 2005-07-14 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| US7052925B2 (en) * | 2004-04-08 | 2006-05-30 | International Business Machines Corporation | Method for manufacturing self-compensating resistors within an integrated circuit |
| US7084483B2 (en) * | 2004-05-25 | 2006-08-01 | International Business Machines Corporation | Trench type buried on-chip precision programmable resistor |
| EP1879229A1 (en) * | 2006-07-13 | 2008-01-16 | STMicroelectronics S.r.l. | Improved ESD protection circuit |
| US20100148262A1 (en) * | 2008-12-17 | 2010-06-17 | Knut Stahrenberg | Resistors and Methods of Manufacture Thereof |
| JP2011091188A (ja) * | 2009-10-22 | 2011-05-06 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| US10326028B1 (en) | 2018-01-08 | 2019-06-18 | Qualcomm Incorporated | Complementary metal-oxide-semiconductor (CMOS) voltage-controlled resistor |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4416049A (en) * | 1970-05-30 | 1983-11-22 | Texas Instruments Incorporated | Semiconductor integrated circuit with vertical implanted polycrystalline silicon resistor |
| US3865649A (en) * | 1972-10-16 | 1975-02-11 | Harris Intertype Corp | Fabrication of MOS devices and complementary bipolar transistor devices in a monolithic substrate |
| US4057894A (en) * | 1976-02-09 | 1977-11-15 | Rca Corporation | Controllably valued resistor |
| US4246692A (en) * | 1976-05-28 | 1981-01-27 | Texas Instruments Incorporated | MOS Integrated circuits with implanted resistor elements |
| US4212083A (en) * | 1976-05-28 | 1980-07-08 | Texas Instruments Incorporated | MOS Integrated with implanted resistor elements |
| US4110776A (en) * | 1976-09-27 | 1978-08-29 | Texas Instruments Incorporated | Semiconductor integrated circuit with implanted resistor element in polycrystalline silicon layer |
| US4208781A (en) * | 1976-09-27 | 1980-06-24 | Texas Instruments Incorporated | Semiconductor integrated circuit with implanted resistor element in polycrystalline silicon layer |
| US4455737A (en) * | 1978-05-26 | 1984-06-26 | Rockwell International Corporation | Process for and structure of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines |
| US4408385A (en) * | 1978-06-15 | 1983-10-11 | Texas Instruments Incorporated | Semiconductor integrated circuit with implanted resistor element in polycrystalline silicon layer |
| US4225877A (en) * | 1978-09-05 | 1980-09-30 | Sprague Electric Company | Integrated circuit with C-Mos logic, and a bipolar driver with polysilicon resistors |
| US4370798A (en) * | 1979-06-15 | 1983-02-01 | Texas Instruments Incorporated | Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon |
| US4291328A (en) * | 1979-06-15 | 1981-09-22 | Texas Instruments Incorporated | Interlevel insulator for integrated circuit with implanted resistor element in second-level polycrystalline silicon |
| JPS5632762A (en) * | 1979-08-27 | 1981-04-02 | Fujitsu Ltd | Semiconductor device |
| US4367580A (en) * | 1980-03-21 | 1983-01-11 | Texas Instruments Incorporated | Process for making polysilicon resistors |
| JPS60198853A (ja) * | 1984-03-23 | 1985-10-08 | Nec Corp | 高耐圧抵抗素子 |
| US4599789A (en) * | 1984-06-15 | 1986-07-15 | Harris Corporation | Process of making twin well VLSI CMOS |
| JPS6143464A (ja) * | 1984-08-08 | 1986-03-03 | Hitachi Ltd | 半導体装置 |
| US4830976A (en) * | 1984-10-01 | 1989-05-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Integrated circuit resistor |
| JPS61183967A (ja) * | 1985-02-08 | 1986-08-16 | Toshiba Corp | 半導体装置の製造方法 |
| JPS61216356A (ja) * | 1985-03-20 | 1986-09-26 | Nec Corp | 半導体抵抗 |
| EP0272433B1 (de) * | 1986-11-18 | 1993-03-31 | Siemens Aktiengesellschaft | Integrierte Halbleiterschaltung mit als Dünnschichtstege auf den die aktiven Transistorbereiche trennenden Feldoxidbereichen angeordneten Lastwiderstände und Verfahren zu ihrer Herstellung |
| EP0287195A1 (en) * | 1987-02-17 | 1988-10-19 | SILICONIX Incorporated | Power MOS transistor with integrated resistor |
| US4734382A (en) * | 1987-02-20 | 1988-03-29 | Fairchild Semiconductor Corporation | BiCMOS process having narrow bipolar emitter and implanted aluminum isolation |
| JPH029162A (ja) * | 1988-06-28 | 1990-01-12 | Toshiba Corp | バイポーラ・ｃｍｏｓ混載半導体装置及びその製造方法 |
-
1990
- 1990-04-27 US US07/515,854 patent/US5134088A/en not_active Expired - Lifetime
-
1991
- 1991-04-02 TW TW080102518A patent/TW240331B/zh active
- 1991-04-10 AU AU74262/91A patent/AU640473B2/en not_active Ceased
- 1991-04-16 DE DE69127928T patent/DE69127928T2/de not_active Expired - Fee Related
- 1991-04-16 EP EP91303388A patent/EP0455376B1/en not_active Expired - Lifetime
- 1991-04-25 KR KR1019910006663A patent/KR940002390B1/ko not_active IP Right Cessation
- 1991-04-26 JP JP3097102A patent/JPH0789578B2/ja not_active Expired - Lifetime
- 1991-04-26 CA CA002041362A patent/CA2041362C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR910019244A (ko) | 1991-11-30 |
| AU7426291A (en) | 1991-11-14 |
| EP0455376B1 (en) | 1997-10-15 |
| AU640473B2 (en) | 1993-08-26 |
| EP0455376A3 (US20020128544A1-20020912-P00008.png) | 1995-03-15 |
| KR940002390B1 (ko) | 1994-03-24 |
| CA2041362A1 (en) | 1991-10-28 |
| CA2041362C (en) | 1995-09-12 |
| JPH04229647A (ja) | 1992-08-19 |
| DE69127928T2 (de) | 1998-05-07 |
| EP0455376A2 (en) | 1991-11-06 |
| DE69127928D1 (de) | 1997-11-20 |
| US5134088A (en) | 1992-07-28 |
| TW240331B (US20020128544A1-20020912-P00008.png) | 1995-02-11 |
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