JPH073577Y2 - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPH073577Y2 JPH073577Y2 JP1990115992U JP11599290U JPH073577Y2 JP H073577 Y2 JPH073577 Y2 JP H073577Y2 JP 1990115992 U JP1990115992 U JP 1990115992U JP 11599290 U JP11599290 U JP 11599290U JP H073577 Y2 JPH073577 Y2 JP H073577Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- circuit board
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115992U JPH073577Y2 (ja) | 1990-11-06 | 1990-11-06 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990115992U JPH073577Y2 (ja) | 1990-11-06 | 1990-11-06 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0472563U JPH0472563U (en, 2012) | 1992-06-25 |
| JPH073577Y2 true JPH073577Y2 (ja) | 1995-01-30 |
Family
ID=31863801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990115992U Expired - Lifetime JPH073577Y2 (ja) | 1990-11-06 | 1990-11-06 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073577Y2 (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260736A (ja) * | 1993-03-08 | 1994-09-16 | Nippon Cement Co Ltd | Ｉｃモジュ−ルの組立体及びｉｃモジュ−ルの取付け方法 |
| JPWO2006093155A1 (ja) * | 2005-03-01 | 2008-08-07 | 松下電器産業株式会社 | 基板間接続コネクタ及び基板間接続コネクタを用いた回路基板装置 |
-
1990
- 1990-11-06 JP JP1990115992U patent/JPH073577Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472563U (en, 2012) | 1992-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment |
Free format text: PAYMENT UNTIL: 20080209 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment |
Year of fee payment: 8 Free format text: PAYMENT UNTIL: 20090209 |
|
| FPAY | Renewal fee payment |
Free format text: PAYMENT UNTIL: 20100209 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |