JPH07249877A - 電子部品 - Google Patents

電子部品

Info

Publication number
JPH07249877A
JPH07249877A JP6040051A JP4005194A JPH07249877A JP H07249877 A JPH07249877 A JP H07249877A JP 6040051 A JP6040051 A JP 6040051A JP 4005194 A JP4005194 A JP 4005194A JP H07249877 A JPH07249877 A JP H07249877A
Authority
JP
Japan
Prior art keywords
resin film
electronic component
conductor
substrate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6040051A
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Nishimura
仁 西村
Takashi Fujihashi
考 藤橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP6040051A priority Critical patent/JPH07249877A/ja
Priority to TW084101091A priority patent/TW274162B/zh
Priority to DE19507124A priority patent/DE19507124A1/de
Priority to CN95102061A priority patent/CN1096744C/zh
Priority to KR1019950004875A priority patent/KR100294145B1/ko
Publication of JPH07249877A publication Critical patent/JPH07249877A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
JP6040051A 1994-03-10 1994-03-10 電子部品 Pending JPH07249877A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP6040051A JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品
TW084101091A TW274162B (enFirst) 1994-03-10 1995-02-09
DE19507124A DE19507124A1 (de) 1994-03-10 1995-03-01 Elektronische Bauteile und Verfahren zu deren Herstellung
CN95102061A CN1096744C (zh) 1994-03-10 1995-03-06 电子元件及其制作方法
KR1019950004875A KR100294145B1 (ko) 1994-03-10 1995-03-10 전자부품및그제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6040051A JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品

Publications (1)

Publication Number Publication Date
JPH07249877A true JPH07249877A (ja) 1995-09-26

Family

ID=12570121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6040051A Pending JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品

Country Status (5)

Country Link
JP (1) JPH07249877A (enFirst)
KR (1) KR100294145B1 (enFirst)
CN (1) CN1096744C (enFirst)
DE (1) DE19507124A1 (enFirst)
TW (1) TW274162B (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196024A (ja) * 2008-02-20 2009-09-03 Panasonic Electric Works Co Ltd 電動工具

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19548062A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung
DE59703635D1 (de) * 1996-04-04 2001-07-05 Langer Guenter Anordnung zur Reduzierung der elektromagnetischen Abstrahlung bei Leiterkarten und anderen Trägern elektronischer Schaltungen
DE19613587C2 (de) * 1996-04-04 2000-02-17 Langer Guenter Anordnung zur Blockierung der elektromagnetischen Abstrahlung bei Leiterkarten und integrierten Schaltkreisen
DE19818824B4 (de) * 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
DE19854396C2 (de) * 1998-11-25 2002-02-07 Freudenberg Carl Kg Sensormodul
DE10049288B4 (de) 2000-10-04 2004-07-15 Infineon Technologies Ag Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren
DE10125744A1 (de) * 2001-05-21 2002-12-05 Siemens Ag Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung
JP3770210B2 (ja) * 2002-06-20 2006-04-26 株式会社村田製作所 圧電部品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196024A (ja) * 2008-02-20 2009-09-03 Panasonic Electric Works Co Ltd 電動工具

Also Published As

Publication number Publication date
KR950035554A (ko) 1995-12-30
TW274162B (enFirst) 1996-04-11
CN1117666A (zh) 1996-02-28
KR100294145B1 (ko) 2001-09-17
DE19507124A1 (de) 1995-09-14
CN1096744C (zh) 2002-12-18

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