CN1096744C - 电子元件及其制作方法 - Google Patents

电子元件及其制作方法 Download PDF

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Publication number
CN1096744C
CN1096744C CN95102061A CN95102061A CN1096744C CN 1096744 C CN1096744 C CN 1096744C CN 95102061 A CN95102061 A CN 95102061A CN 95102061 A CN95102061 A CN 95102061A CN 1096744 C CN1096744 C CN 1096744C
Authority
CN
China
Prior art keywords
resin film
substrate
layer
conductive material
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN95102061A
Other languages
English (en)
Chinese (zh)
Other versions
CN1117666A (zh
Inventor
西村仁
藤桥考
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN1117666A publication Critical patent/CN1117666A/zh
Application granted granted Critical
Publication of CN1096744C publication Critical patent/CN1096744C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
CN95102061A 1994-03-10 1995-03-06 电子元件及其制作方法 Expired - Lifetime CN1096744C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6040051A JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品
JP040051/94 1994-03-10
JP6040051 1994-03-10

Publications (2)

Publication Number Publication Date
CN1117666A CN1117666A (zh) 1996-02-28
CN1096744C true CN1096744C (zh) 2002-12-18

Family

ID=12570121

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95102061A Expired - Lifetime CN1096744C (zh) 1994-03-10 1995-03-06 电子元件及其制作方法

Country Status (5)

Country Link
JP (1) JPH07249877A (enFirst)
KR (1) KR100294145B1 (enFirst)
CN (1) CN1096744C (enFirst)
DE (1) DE19507124A1 (enFirst)
TW (1) TW274162B (enFirst)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19548062A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung
DE59703635D1 (de) * 1996-04-04 2001-07-05 Langer Guenter Anordnung zur Reduzierung der elektromagnetischen Abstrahlung bei Leiterkarten und anderen Trägern elektronischer Schaltungen
DE19613587C2 (de) * 1996-04-04 2000-02-17 Langer Guenter Anordnung zur Blockierung der elektromagnetischen Abstrahlung bei Leiterkarten und integrierten Schaltkreisen
DE19818824B4 (de) * 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
DE19854396C2 (de) * 1998-11-25 2002-02-07 Freudenberg Carl Kg Sensormodul
DE10049288B4 (de) 2000-10-04 2004-07-15 Infineon Technologies Ag Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren
DE10125744A1 (de) * 2001-05-21 2002-12-05 Siemens Ag Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung
JP3770210B2 (ja) * 2002-06-20 2006-04-26 株式会社村田製作所 圧電部品の製造方法
JP5086835B2 (ja) * 2008-02-20 2012-11-28 パナソニック株式会社 電動工具

Also Published As

Publication number Publication date
KR950035554A (ko) 1995-12-30
TW274162B (enFirst) 1996-04-11
JPH07249877A (ja) 1995-09-26
CN1117666A (zh) 1996-02-28
KR100294145B1 (ko) 2001-09-17
DE19507124A1 (de) 1995-09-14

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20150306

Granted publication date: 20021218