JPH0724282B2 - ダイナミックramの積層溝型キャパシタの製造方法 - Google Patents
ダイナミックramの積層溝型キャパシタの製造方法Info
- Publication number
- JPH0724282B2 JPH0724282B2 JP2110678A JP11067890A JPH0724282B2 JP H0724282 B2 JPH0724282 B2 JP H0724282B2 JP 2110678 A JP2110678 A JP 2110678A JP 11067890 A JP11067890 A JP 11067890A JP H0724282 B2 JPH0724282 B2 JP H0724282B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon layer
- groove
- transistor
- capacitor
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 29
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 12
- 239000002019 doping agent Substances 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 7
- 238000001020 plasma etching Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 238000005468 ion implantation Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 238000001039 wet etching Methods 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
- H10B12/377—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate having a storage electrode extension located over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR12019 | 1989-08-23 | ||
KR1019890012019A KR930006973B1 (ko) | 1989-08-23 | 1989-08-23 | 디램의 스택 트렌치 커패시터 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0385757A JPH0385757A (ja) | 1991-04-10 |
JPH0724282B2 true JPH0724282B2 (ja) | 1995-03-15 |
Family
ID=19289171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2110678A Expired - Fee Related JPH0724282B2 (ja) | 1989-08-23 | 1990-04-27 | ダイナミックramの積層溝型キャパシタの製造方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH0724282B2 (ko) |
KR (1) | KR930006973B1 (ko) |
DE (1) | DE4010720C2 (ko) |
FR (1) | FR2651368B1 (ko) |
GB (1) | GB2235335B (ko) |
NL (1) | NL193765C (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10964832B2 (en) | 2016-10-11 | 2021-03-30 | Power Roll Limited | Capacitors in grooves |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000058506A (ko) * | 2000-06-07 | 2000-10-05 | 이순환 | 열기관 압축링에 삽입하여 열효율을 높이는 황동핀 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62120070A (ja) * | 1985-11-20 | 1987-06-01 | Toshiba Corp | 半導体記憶装置 |
JPH01101664A (ja) * | 1987-10-15 | 1989-04-19 | Nec Corp | 半導体集積回路装置 |
JPH01179450A (ja) * | 1988-01-08 | 1989-07-17 | Oki Electric Ind Co Ltd | Mos型ダイナミックメモリ集積回路とその製造方法 |
KR900019227A (ko) * | 1988-05-18 | 1990-12-24 | 아오이 죠이치 | 적층형 캐피시터를 갖춘 반도체기억장치 및 그 제조방법 |
JPH02177359A (ja) * | 1988-12-27 | 1990-07-10 | Nec Corp | 半導体記憶装置 |
JP4093614B2 (ja) * | 1997-06-11 | 2008-06-04 | 旭化成ケミカルズ株式会社 | 固着剤組成物 |
JPH1179450A (ja) * | 1997-09-12 | 1999-03-23 | Mita Ind Co Ltd | 自動原稿搬送装置の原稿分離機構 |
-
1989
- 1989-08-23 KR KR1019890012019A patent/KR930006973B1/ko not_active IP Right Cessation
-
1990
- 1990-04-03 DE DE4010720A patent/DE4010720C2/de not_active Expired - Fee Related
- 1990-04-27 JP JP2110678A patent/JPH0724282B2/ja not_active Expired - Fee Related
- 1990-05-30 FR FR909006733A patent/FR2651368B1/fr not_active Expired - Lifetime
- 1990-08-03 GB GB9017025A patent/GB2235335B/en not_active Expired - Fee Related
- 1990-08-21 NL NL9001849A patent/NL193765C/nl not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10964832B2 (en) | 2016-10-11 | 2021-03-30 | Power Roll Limited | Capacitors in grooves |
US10978603B2 (en) | 2016-10-11 | 2021-04-13 | Power Roll Limited | Energy storage |
Also Published As
Publication number | Publication date |
---|---|
DE4010720A1 (de) | 1991-02-28 |
DE4010720C2 (de) | 1994-05-05 |
GB9017025D0 (en) | 1990-09-19 |
NL193765C (nl) | 2000-09-04 |
NL9001849A (nl) | 1991-03-18 |
GB2235335A (en) | 1991-02-27 |
FR2651368A1 (fr) | 1991-03-01 |
JPH0385757A (ja) | 1991-04-10 |
FR2651368B1 (fr) | 1991-11-29 |
GB2235335B (en) | 1994-03-02 |
KR910005297A (ko) | 1991-03-30 |
KR930006973B1 (ko) | 1993-07-24 |
NL193765B (nl) | 2000-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |