JPH0625959Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0625959Y2 JPH0625959Y2 JP12679787U JP12679787U JPH0625959Y2 JP H0625959 Y2 JPH0625959 Y2 JP H0625959Y2 JP 12679787 U JP12679787 U JP 12679787U JP 12679787 U JP12679787 U JP 12679787U JP H0625959 Y2 JPH0625959 Y2 JP H0625959Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- wire
- force
- resin
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/5449—
-
- H10W90/754—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679787U JPH0625959Y2 (ja) | 1987-08-19 | 1987-08-19 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679787U JPH0625959Y2 (ja) | 1987-08-19 | 1987-08-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6430834U JPS6430834U (cg-RX-API-DMAC10.html) | 1989-02-27 |
| JPH0625959Y2 true JPH0625959Y2 (ja) | 1994-07-06 |
Family
ID=31378640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12679787U Expired - Lifetime JPH0625959Y2 (ja) | 1987-08-19 | 1987-08-19 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625959Y2 (cg-RX-API-DMAC10.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159746A (ja) * | 1985-01-08 | 1986-07-19 | Kyodo Printing Co Ltd | Icモジユ−ルのワイヤボンデイング方法 |
-
1987
- 1987-08-19 JP JP12679787U patent/JPH0625959Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6430834U (cg-RX-API-DMAC10.html) | 1989-02-27 |
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