JPH0565077B2 - - Google Patents

Info

Publication number
JPH0565077B2
JPH0565077B2 JP62120752A JP12075287A JPH0565077B2 JP H0565077 B2 JPH0565077 B2 JP H0565077B2 JP 62120752 A JP62120752 A JP 62120752A JP 12075287 A JP12075287 A JP 12075287A JP H0565077 B2 JPH0565077 B2 JP H0565077B2
Authority
JP
Japan
Prior art keywords
manufacturing
sides
adhesive
prepreg
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62120752A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63285998A (ja
Inventor
Kazuo Myoshi
Hideki Chidai
Hiroyuki Nakajima
Toshifumi Kimura
Susumu Hoshinochi
Shozo Nakada
Yasushi Yamamoto
Yoshihiro Maruyama
Isamu Yano
Michio Futakuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12075287A priority Critical patent/JPS63285998A/ja
Publication of JPS63285998A publication Critical patent/JPS63285998A/ja
Publication of JPH0565077B2 publication Critical patent/JPH0565077B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP12075287A 1987-05-18 1987-05-18 多層基板の製造方法および装置 Granted JPS63285998A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12075287A JPS63285998A (ja) 1987-05-18 1987-05-18 多層基板の製造方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12075287A JPS63285998A (ja) 1987-05-18 1987-05-18 多層基板の製造方法および装置

Publications (2)

Publication Number Publication Date
JPS63285998A JPS63285998A (ja) 1988-11-22
JPH0565077B2 true JPH0565077B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-16

Family

ID=14794112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12075287A Granted JPS63285998A (ja) 1987-05-18 1987-05-18 多層基板の製造方法および装置

Country Status (1)

Country Link
JP (1) JPS63285998A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236761A (en) * 1975-09-18 1977-03-22 Koito Mfg Co Ltd Method of producing printed circuit board conductor circuit
DE3028052C2 (de) * 1980-07-24 1983-11-10 Held, Kurt, 7218 Trossingen Vorrichtung zum kontinuierlichen Einsiegeln von Einlegeteilen
JPS5850797A (ja) * 1981-09-21 1983-03-25 株式会社井上ジャパックス研究所 プリント配線板の製造方法
JPS5989494A (ja) * 1982-11-15 1984-05-23 松下電工株式会社 プリント配線板用多層銅張積層板の製造法
JPS6186257A (ja) * 1984-10-05 1986-05-01 松下電工株式会社 積層板の製法
DE3515629A1 (de) * 1985-05-02 1986-11-06 Held, Kurt, 7218 Trossingen Verfahren und vorrichtung zur herstellung kupferkaschierter laminate

Also Published As

Publication number Publication date
JPS63285998A (ja) 1988-11-22

Similar Documents

Publication Publication Date Title
JP2012015562A (ja) 回路基板の製造方法
JP2004327510A (ja) 多層プリント配線板用銅張り積層板、多層プリント配線板、多層プリント配線板の製造方法
CN100469215C (zh) 多层电路基板及其制造方法
JP2004349654A (ja) 絶縁層付き銅箔およびその製造方法並びにそれを用いた多層プリント配線板
JP2768236B2 (ja) 多層基板の製造方法
JP2991032B2 (ja) 多層基板の製造方法
JPH0565076B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3705370B2 (ja) 多層プリント配線板の製造方法
JPH0565077B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH01272416A (ja) プリプレグの製造方法
JPH0565075B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS63136696A (ja) シ−ルド板の製造方法および装置
JPS63136689A (ja) 両面回路形成方法および装置
JPH10163603A (ja) 回路基板の製造方法および回路基板の製造装置
JP2000151116A (ja) 多層プリント基板の製造方法とその製造装置
JPH0320917B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP4058218B2 (ja) プリント配線基板の製造方法
JPH07202426A (ja) 多層プリント配線板の製造方法
JPH10126058A (ja) 多層プリント配線板の製造方法
JP2004066702A (ja) 樹脂フィルムへの銅箔貼り付け方法およびプリント基板の製造方法
JPH07336049A (ja) 多層プリント配線板の製造方法
JPH11238958A (ja) 回路基板の製造方法及び製造装置
JP3944987B2 (ja) 多層板の製造方法
JPS61120736A (ja) 多層プリント配線板の製法
JPH08125333A (ja) 多層プリント配線板の製造方法