JPH0564992B2 - - Google Patents
Info
- Publication number
- JPH0564992B2 JPH0564992B2 JP63072887A JP7288788A JPH0564992B2 JP H0564992 B2 JPH0564992 B2 JP H0564992B2 JP 63072887 A JP63072887 A JP 63072887A JP 7288788 A JP7288788 A JP 7288788A JP H0564992 B2 JPH0564992 B2 JP H0564992B2
- Authority
- JP
- Japan
- Prior art keywords
- composite oxide
- impregnation
- dispersed
- particle size
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Graft Or Block Polymers (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7288788A JPH01245038A (ja) | 1988-03-27 | 1988-03-27 | 無機物粒子分散樹脂の含浸方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7288788A JPH01245038A (ja) | 1988-03-27 | 1988-03-27 | 無機物粒子分散樹脂の含浸方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01245038A JPH01245038A (ja) | 1989-09-29 |
JPH0564992B2 true JPH0564992B2 (enrdf_load_stackoverflow) | 1993-09-16 |
Family
ID=13502301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7288788A Granted JPH01245038A (ja) | 1988-03-27 | 1988-03-27 | 無機物粒子分散樹脂の含浸方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01245038A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003018675A1 (en) * | 2001-08-31 | 2003-03-06 | Sumitomo Bakelite Company Limited | Resin composition, prepreg, laminated sheet and semiconductor package |
JP5288581B2 (ja) * | 2006-03-03 | 2013-09-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US8173519B2 (en) | 2006-03-03 | 2012-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5894449A (ja) * | 1981-12-01 | 1983-06-04 | 松下電工株式会社 | 難燃性積層板 |
JPS5894461A (ja) * | 1981-12-01 | 1983-06-04 | 松下電工株式会社 | 白色エポキシ樹脂積層板 |
JPS63165446A (ja) * | 1986-12-27 | 1988-07-08 | Toyo Electric Mfg Co Ltd | 樹脂硬化促進剤 |
JPH01115965A (ja) * | 1987-10-28 | 1989-05-09 | Chuo Hatsumei Kenkyusho:Kk | モノマー・無機コロイドゾル含浸剤およびその製造方法 |
-
1988
- 1988-03-27 JP JP7288788A patent/JPH01245038A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01245038A (ja) | 1989-09-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080916 Year of fee payment: 15 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080916 Year of fee payment: 15 |