JPH0554262B2 - - Google Patents

Info

Publication number
JPH0554262B2
JPH0554262B2 JP59233330A JP23333084A JPH0554262B2 JP H0554262 B2 JPH0554262 B2 JP H0554262B2 JP 59233330 A JP59233330 A JP 59233330A JP 23333084 A JP23333084 A JP 23333084A JP H0554262 B2 JPH0554262 B2 JP H0554262B2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
wafer
adhesive sheet
adhesive layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59233330A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61112345A (ja
Inventor
Takashi Kimura
Toshihiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59233330A priority Critical patent/JPS61112345A/ja
Priority to EP85114207A priority patent/EP0182218B1/en
Priority to DE8585114207T priority patent/DE3583111D1/de
Publication of JPS61112345A publication Critical patent/JPS61112345A/ja
Priority to US07/015,585 priority patent/US4722130A/en
Publication of JPH0554262B2 publication Critical patent/JPH0554262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P54/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10P52/00—
    • H10P72/74—
    • H10P72/7402—
    • H10P72/7416—
    • H10P72/7422—
    • H10W72/01331—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
JP59233330A 1984-11-07 1984-11-07 半導体装置の製造方法 Granted JPS61112345A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP59233330A JPS61112345A (ja) 1984-11-07 1984-11-07 半導体装置の製造方法
EP85114207A EP0182218B1 (en) 1984-11-07 1985-11-07 Method for dicing semiconductor wafer
DE8585114207T DE3583111D1 (de) 1984-11-07 1985-11-07 Verfahren zum schneiden von halbleiterscheiben.
US07/015,585 US4722130A (en) 1984-11-07 1987-02-17 Method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59233330A JPS61112345A (ja) 1984-11-07 1984-11-07 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61112345A JPS61112345A (ja) 1986-05-30
JPH0554262B2 true JPH0554262B2 (enExample) 1993-08-12

Family

ID=16953451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59233330A Granted JPS61112345A (ja) 1984-11-07 1984-11-07 半導体装置の製造方法

Country Status (4)

Country Link
US (1) US4722130A (enExample)
EP (1) EP0182218B1 (enExample)
JP (1) JPS61112345A (enExample)
DE (1) DE3583111D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258136A (ja) * 2009-04-23 2010-11-11 Disco Abrasive Syst Ltd 粘着テープ及びウェーハの分割方法

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KR101617600B1 (ko) * 2010-06-08 2016-05-02 헨켈 아이피 앤드 홀딩 게엠베하 그라인딩 전의 다이싱 및 마이크로 제조된 웨이퍼들 상의 접착제의 코팅
JP2012089709A (ja) * 2010-10-20 2012-05-10 Disco Abrasive Syst Ltd ワークの分割方法
CN102903642B (zh) * 2011-07-29 2015-04-15 万国半导体(开曼)股份有限公司 一种将芯片底部和周边包封的芯片级封装方法
WO2014017537A1 (ja) * 2012-07-26 2014-01-30 古河電気工業株式会社 半導体ウエハ加工用テープの製造方法及び半導体ウエハ加工用テープ
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JP7183625B2 (ja) * 2018-08-13 2022-12-06 富士フイルムビジネスイノベーション株式会社 半導体素子の製造方法
JP7183624B2 (ja) * 2018-08-13 2022-12-06 富士フイルムビジネスイノベーション株式会社 半導体素子の製造方法
KR102243674B1 (ko) * 2019-10-28 2021-04-23 주식회사 루츠 세라믹칩 제조방법
KR102625710B1 (ko) * 2021-09-24 2024-01-16 주식회사 루츠 형광체의 제조방법

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Publication number Priority date Publication date Assignee Title
JP2010258136A (ja) * 2009-04-23 2010-11-11 Disco Abrasive Syst Ltd 粘着テープ及びウェーハの分割方法

Also Published As

Publication number Publication date
DE3583111D1 (de) 1991-07-11
EP0182218A2 (en) 1986-05-28
EP0182218A3 (en) 1988-06-22
JPS61112345A (ja) 1986-05-30
EP0182218B1 (en) 1991-06-05
US4722130A (en) 1988-02-02

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