AU6158199A - Method for forming transistors on a thin semiconductor wafer - Google Patents
Method for forming transistors on a thin semiconductor waferInfo
- Publication number
- AU6158199A AU6158199A AU61581/99A AU6158199A AU6158199A AU 6158199 A AU6158199 A AU 6158199A AU 61581/99 A AU61581/99 A AU 61581/99A AU 6158199 A AU6158199 A AU 6158199A AU 6158199 A AU6158199 A AU 6158199A
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor wafer
- thin semiconductor
- forming transistors
- transistors
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19604198A | 1998-11-19 | 1998-11-19 | |
US09196041 | 1998-11-19 | ||
PCT/US1999/021958 WO2000031784A1 (en) | 1998-11-19 | 1999-09-21 | Method for forming transistors on a thin semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6158199A true AU6158199A (en) | 2000-06-13 |
Family
ID=22723899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU61581/99A Abandoned AU6158199A (en) | 1998-11-19 | 1999-09-21 | Method for forming transistors on a thin semiconductor wafer |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU6158199A (en) |
WO (1) | WO2000031784A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7541203B1 (en) | 2008-05-13 | 2009-06-02 | International Business Machines Corporation | Conductive adhesive for thinned silicon wafers with through silicon vias |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61112345A (en) * | 1984-11-07 | 1986-05-30 | Toshiba Corp | Manufacture of semiconductor device |
US5071792A (en) * | 1990-11-05 | 1991-12-10 | Harris Corporation | Process for forming extremely thin integrated circuit dice |
FR2684800B1 (en) * | 1991-12-06 | 1997-01-24 | Picogiga Sa | METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS WITH ELECTROCHEMICAL SUBSTRATE RECOVERY. |
EP0573921A3 (en) * | 1992-06-12 | 1994-09-28 | Seiko Instr Inc | Semiconductor device having a semiconductor film of low oxygen concentration |
JPH076982A (en) * | 1992-07-31 | 1995-01-10 | Sharp Corp | Method of splitting thin semiconductor substrate |
-
1999
- 1999-09-21 WO PCT/US1999/021958 patent/WO2000031784A1/en active Application Filing
- 1999-09-21 AU AU61581/99A patent/AU6158199A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2000031784A1 (en) | 2000-06-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |