JPH0553072B2 - - Google Patents
Info
- Publication number
- JPH0553072B2 JPH0553072B2 JP61082704A JP8270486A JPH0553072B2 JP H0553072 B2 JPH0553072 B2 JP H0553072B2 JP 61082704 A JP61082704 A JP 61082704A JP 8270486 A JP8270486 A JP 8270486A JP H0553072 B2 JPH0553072 B2 JP H0553072B2
- Authority
- JP
- Japan
- Prior art keywords
- polysilicon
- layer
- silicide layer
- polysilicon layer
- fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8270486A JPS62238658A (ja) | 1986-04-09 | 1986-04-09 | 半導体集積回路装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8270486A JPS62238658A (ja) | 1986-04-09 | 1986-04-09 | 半導体集積回路装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62238658A JPS62238658A (ja) | 1987-10-19 |
| JPH0553072B2 true JPH0553072B2 (enExample) | 1993-08-09 |
Family
ID=13781786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8270486A Granted JPS62238658A (ja) | 1986-04-09 | 1986-04-09 | 半導体集積回路装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62238658A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04365351A (ja) * | 1991-06-13 | 1992-12-17 | Nec Corp | 半導体集積回路装置 |
| US5708291A (en) * | 1995-09-29 | 1998-01-13 | Intel Corporation | Silicide agglomeration fuse device |
| KR100718614B1 (ko) | 2003-10-24 | 2007-05-16 | 야마하 가부시키가이샤 | 용량 소자와 퓨즈 소자를 구비한 반도체 장치 및 그 제조방법 |
| JP5581520B2 (ja) * | 2010-04-08 | 2014-09-03 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US10229878B2 (en) | 2014-08-08 | 2019-03-12 | Renesas Electronics Corporation | Semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5860560A (ja) * | 1981-10-07 | 1983-04-11 | Toshiba Corp | 半導体装置の冗長回路およびそのフユ−ズ部切断方法 |
| JPS6015966A (ja) * | 1983-07-07 | 1985-01-26 | Fujitsu Ltd | 半導体記憶装置 |
-
1986
- 1986-04-09 JP JP8270486A patent/JPS62238658A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62238658A (ja) | 1987-10-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |