JPH0553061B2 - - Google Patents
Info
- Publication number
- JPH0553061B2 JPH0553061B2 JP61060939A JP6093986A JPH0553061B2 JP H0553061 B2 JPH0553061 B2 JP H0553061B2 JP 61060939 A JP61060939 A JP 61060939A JP 6093986 A JP6093986 A JP 6093986A JP H0553061 B2 JPH0553061 B2 JP H0553061B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- frame
- adhesive tape
- ultraviolet
- irradiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61060939A JPS62219650A (ja) | 1986-03-20 | 1986-03-20 | テープ配設方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61060939A JPS62219650A (ja) | 1986-03-20 | 1986-03-20 | テープ配設方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62219650A JPS62219650A (ja) | 1987-09-26 |
JPH0553061B2 true JPH0553061B2 (enrdf_load_stackoverflow) | 1993-08-09 |
Family
ID=13156848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61060939A Granted JPS62219650A (ja) | 1986-03-20 | 1986-03-20 | テープ配設方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62219650A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2628725B2 (ja) * | 1988-11-17 | 1997-07-09 | 株式会社日立製作所 | パターン形成方法及びろう接方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5691441A (en) * | 1979-12-26 | 1981-07-24 | Hitachi Ltd | Method and device for sticking sheet to carrier jig |
JPS58208470A (ja) * | 1982-05-26 | 1983-12-05 | 日本合成化学工業株式会社 | 布帛の表面コ−テイング法 |
JPS5956745U (ja) * | 1982-10-08 | 1984-04-13 | 株式会社東京精密 | ウエハのテ−プマウンタ |
-
1986
- 1986-03-20 JP JP61060939A patent/JPS62219650A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62219650A (ja) | 1987-09-26 |
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