JPS62219650A - テープ配設方法 - Google Patents

テープ配設方法

Info

Publication number
JPS62219650A
JPS62219650A JP61060939A JP6093986A JPS62219650A JP S62219650 A JPS62219650 A JP S62219650A JP 61060939 A JP61060939 A JP 61060939A JP 6093986 A JP6093986 A JP 6093986A JP S62219650 A JPS62219650 A JP S62219650A
Authority
JP
Japan
Prior art keywords
frame
tape
adhesive tape
ultraviolet
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61060939A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0553061B2 (enrdf_load_stackoverflow
Inventor
Hisahiro Okamoto
九弘 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61060939A priority Critical patent/JPS62219650A/ja
Publication of JPS62219650A publication Critical patent/JPS62219650A/ja
Publication of JPH0553061B2 publication Critical patent/JPH0553061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61060939A 1986-03-20 1986-03-20 テープ配設方法 Granted JPS62219650A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61060939A JPS62219650A (ja) 1986-03-20 1986-03-20 テープ配設方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61060939A JPS62219650A (ja) 1986-03-20 1986-03-20 テープ配設方法

Publications (2)

Publication Number Publication Date
JPS62219650A true JPS62219650A (ja) 1987-09-26
JPH0553061B2 JPH0553061B2 (enrdf_load_stackoverflow) 1993-08-09

Family

ID=13156848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61060939A Granted JPS62219650A (ja) 1986-03-20 1986-03-20 テープ配設方法

Country Status (1)

Country Link
JP (1) JPS62219650A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135767A (ja) * 1988-11-17 1990-05-24 Hitachi Ltd パターン形成方法及びろう接方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691441A (en) * 1979-12-26 1981-07-24 Hitachi Ltd Method and device for sticking sheet to carrier jig
JPS58208470A (ja) * 1982-05-26 1983-12-05 日本合成化学工業株式会社 布帛の表面コ−テイング法
JPS5956745U (ja) * 1982-10-08 1984-04-13 株式会社東京精密 ウエハのテ−プマウンタ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691441A (en) * 1979-12-26 1981-07-24 Hitachi Ltd Method and device for sticking sheet to carrier jig
JPS58208470A (ja) * 1982-05-26 1983-12-05 日本合成化学工業株式会社 布帛の表面コ−テイング法
JPS5956745U (ja) * 1982-10-08 1984-04-13 株式会社東京精密 ウエハのテ−プマウンタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135767A (ja) * 1988-11-17 1990-05-24 Hitachi Ltd パターン形成方法及びろう接方法

Also Published As

Publication number Publication date
JPH0553061B2 (enrdf_load_stackoverflow) 1993-08-09

Similar Documents

Publication Publication Date Title
US5476566A (en) Method for thinning a semiconductor wafer
CN108987325B (zh) 保护带的粘贴方法和保护带粘贴装置
JP2000223446A (ja) 半導体装置およびその製造方法
JP2010062356A (ja) マウント装置及びマウント方法
CN101840855B (zh) 紫外线照射装置
DE112006001346T5 (de) Vorrichtung und Verfahren zum Bestrahlen mit einem Energiestrahl
JP4817805B2 (ja) フィルム剥離方法およびフィルム剥離装置
JPS62219650A (ja) テープ配設方法
JPH02265258A (ja) ダイシング装置
JP2000331963A (ja) ウェーハフレームへのウェーハ取付方法と装置及びそれを組込んだ平面加工装置
JP4131027B2 (ja) 半導体ウェーハの表面保護テープ剥離方法
JPS63137449A (ja) 半導体ウエハマウンタ装置の製造方法
JP2005243700A (ja) 粘着シート貼付け方法およびこれを用いた装置
JP4789701B2 (ja) テープの供給装置、テープの貼着装置
JPH07235583A (ja) 粘着シート
DE102004058876B3 (de) Verfahren zum Aufbringen einer Klebstoffschicht auf dünngeschliffene Halbleiterchips eines Halbleiterwafers
JP2782662B2 (ja) ダイシング方法
JPH04249343A (ja) 基板分断方法
DE10029399A1 (de) Vorrichtung und Verfahren zum Beschichten eines optisch lesbaren Datenträgers
JPS62218359A (ja) テ−プ配設装置
JP2711135B2 (ja) 半導体製造装置
KR200177254Y1 (ko) 다이 본드 장비의 다이 픽업장치
CN117621168A (zh) 预胶膜切割制程方法
JPH062269Y2 (ja) 粘着シート処理装置
JP2007088038A (ja) 貼替装置及び貼替方法