JPH0550428B2 - - Google Patents
Info
- Publication number
- JPH0550428B2 JPH0550428B2 JP62201185A JP20118587A JPH0550428B2 JP H0550428 B2 JPH0550428 B2 JP H0550428B2 JP 62201185 A JP62201185 A JP 62201185A JP 20118587 A JP20118587 A JP 20118587A JP H0550428 B2 JPH0550428 B2 JP H0550428B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- thin plate
- cutting
- adhesive tape
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005520 cutting process Methods 0.000 claims description 56
- 239000002390 adhesive tape Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000005856 abnormality Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 79
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1317—Means feeding plural workpieces to be joined
- Y10T156/1343—Cutting indefinite length web after assembly with discrete article
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/525—Operation controlled by detector means responsive to work
- Y10T83/538—Positioning of tool controlled
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Cutting Devices (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Adhesive Tape Dispensing Devices (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201185A JPS6443458A (en) | 1987-08-11 | 1987-08-11 | Stick cutter for tacky tape with respect to thin board |
KR1019870011224A KR960009988B1 (ko) | 1987-08-11 | 1987-10-06 | 박판에 대한 점착테이프의 점착 커트장치 |
EP87114622A EP0307509B1 (en) | 1987-08-11 | 1987-10-07 | Sticking and cutoff device for adhesive tape for thin articles |
DE8787114622T DE3779640T2 (de) | 1987-08-11 | 1987-10-07 | Vorrichtung zum heranbringen und abschneiden von klebestreifen fuer duenne einzelteile. |
US07/105,775 US4865677A (en) | 1987-08-11 | 1987-10-07 | Sticking and cutoff device for adhering adhesive tape on thin articles |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62201185A JPS6443458A (en) | 1987-08-11 | 1987-08-11 | Stick cutter for tacky tape with respect to thin board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6443458A JPS6443458A (en) | 1989-02-15 |
JPH0550428B2 true JPH0550428B2 (US06534493-20030318-C00166.png) | 1993-07-29 |
Family
ID=16436756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62201185A Granted JPS6443458A (en) | 1987-08-11 | 1987-08-11 | Stick cutter for tacky tape with respect to thin board |
Country Status (5)
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04336428A (ja) * | 1991-05-13 | 1992-11-24 | Nitto Denko Corp | ウエハのテープ貼合わせ剥離装置 |
KR970002433B1 (ko) * | 1993-12-31 | 1997-03-05 | 삼성전자 주식회사 | 마스킹 필름의 부착 방법 및 이에 사용되는 마스킹 필름 부착 장치 |
JP2666788B2 (ja) * | 1995-10-19 | 1997-10-22 | 日本電気株式会社 | チップサイズ半導体装置の製造方法 |
JPH1032179A (ja) * | 1996-07-15 | 1998-02-03 | Teikoku T-Pingu Syst Kk | シリコンウエハー加工用マスキングシートの切断方法 |
US6080263A (en) * | 1997-05-30 | 2000-06-27 | Lintec Corporation | Method and apparatus for applying a protecting film to a semiconductor wafer |
US5833073A (en) * | 1997-06-02 | 1998-11-10 | Fluoroware, Inc. | Tacky film frame for electronic device |
US6139676A (en) * | 1997-08-14 | 2000-10-31 | Microchip Technology Incorporated | Apparatus and method for removing semiconductor chips from a diced semiconductor wafer |
US6202482B1 (en) * | 1998-03-23 | 2001-03-20 | Lehighton Electronics, Inc. | Method and apparatus for testing of sheet material |
JP3560823B2 (ja) * | 1998-08-18 | 2004-09-02 | リンテック株式会社 | ウェハ転写装置 |
US6336787B1 (en) * | 1999-10-07 | 2002-01-08 | Mosel Vitelic, Inc. | Method for transferring wafers in a semiconductor tape-peeling apparatus |
SG92771A1 (en) | 2000-12-19 | 2002-11-19 | Chee Peng Neo | In-process tape bur monitoring |
KR20020061228A (ko) * | 2001-01-15 | 2002-07-24 | 미크론정공 주식회사 | 반도체 패키지의 제조방법 및 테이프 라미네이션 장치 |
JP2002367931A (ja) * | 2001-06-07 | 2002-12-20 | Lintec Corp | ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法 |
JP4266106B2 (ja) | 2001-09-27 | 2009-05-20 | 株式会社東芝 | 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法 |
JP3983053B2 (ja) * | 2002-01-17 | 2007-09-26 | 日東電工株式会社 | 保護テープの切断方法およびそれを用いた保護テープ貼付装置 |
JP2004047823A (ja) * | 2002-07-12 | 2004-02-12 | Tokyo Seimitsu Co Ltd | ダイシングテープ貼付装置およびバックグラインド・ダイシングテープ貼付システム |
KR100468748B1 (ko) * | 2002-07-12 | 2005-01-29 | 삼성전자주식회사 | 프리컷 다이싱 테이프와 범용 다이싱 테이프를 웨이퍼에 마운팅할 수 있는 다이싱 테이프 부착 장비 및 이를포함하는 인라인 시스템 |
SG110108A1 (en) * | 2003-09-24 | 2005-04-28 | Nitto Denko Corp | Method and apparatus for joining adhesive tape |
TW200539357A (en) * | 2004-04-28 | 2005-12-01 | Lintec Corp | Adhering apparatus and adhering method |
US8207748B2 (en) * | 2004-08-11 | 2012-06-26 | Lehighton Electronics, Inc. | Device and handling system for measurement of mobility and sheet charge density |
JP2006100413A (ja) * | 2004-09-28 | 2006-04-13 | Tokyo Seimitsu Co Ltd | フィルム貼付方法およびフィルム貼付装置 |
JP2006272505A (ja) * | 2005-03-29 | 2006-10-12 | Nitto Denko Corp | 保護テープ切断方法およびこれを用いた装置 |
JP4795743B2 (ja) * | 2005-05-19 | 2011-10-19 | リンテック株式会社 | 貼付装置 |
WO2007059433A2 (en) * | 2005-11-14 | 2007-05-24 | Lehighton Electronics | Sheet conductance/resistance measurement system |
KR100869174B1 (ko) * | 2007-08-20 | 2008-11-21 | 김창회 | 고무판절단기 |
KR101981639B1 (ko) * | 2012-11-13 | 2019-05-27 | 삼성디스플레이 주식회사 | 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법 |
CN105128766B (zh) * | 2015-09-02 | 2018-09-18 | 宁波宏协承汽车部件有限公司 | 一种将胶带自动贴在汽车纯押密封条上的装置 |
CN111377296A (zh) * | 2018-12-29 | 2020-07-07 | 广东汉能薄膜太阳能有限公司 | 一种贴胶装置以及贴胶系统 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61296734A (ja) * | 1985-06-26 | 1986-12-27 | Hitachi Ltd | ウエハテ−プマウント方法および装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58207496A (ja) * | 1982-05-28 | 1983-12-02 | 東京電力株式会社 | 拡幅自在のシ−ルド掘進機のテ−ルシ−ル装置 |
GB2128580B (en) * | 1982-09-06 | 1986-07-02 | Kulicke & Soffa | Handling system for laminar objects |
JPS5955702A (ja) * | 1982-09-25 | 1984-03-30 | 株式会社名南製作所 | ベニヤ単板の接合装置 |
JPS6060800A (ja) * | 1983-09-13 | 1985-04-08 | 日東電工株式会社 | リングと薄板の貼着装置 |
US4603609A (en) * | 1983-10-21 | 1986-08-05 | Disco Abrasive Systems, Ltd. | Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer |
JPS60100450A (ja) * | 1983-11-07 | 1985-06-04 | Disco Abrasive Sys Ltd | 半導体ウエーハ装着及び切断装置 |
CA1243417A (en) * | 1984-03-16 | 1988-10-18 | Shoji Tanaka | Printed circuit board laminating apparatus |
GB2159763B (en) * | 1984-06-06 | 1987-11-18 | Nitto Electric Ind Co | Process for sticking adhesive tape on thin article |
JPS61249299A (ja) * | 1985-04-25 | 1986-11-06 | 日東電工株式会社 | 薄板保護用フイルムの切抜き方法ならびに装置 |
JPS628966A (ja) * | 1985-07-05 | 1987-01-16 | Nitto Electric Ind Co Ltd | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 |
-
1987
- 1987-08-11 JP JP62201185A patent/JPS6443458A/ja active Granted
- 1987-10-06 KR KR1019870011224A patent/KR960009988B1/ko not_active IP Right Cessation
- 1987-10-07 EP EP87114622A patent/EP0307509B1/en not_active Expired - Lifetime
- 1987-10-07 DE DE8787114622T patent/DE3779640T2/de not_active Expired - Fee Related
- 1987-10-07 US US07/105,775 patent/US4865677A/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61296734A (ja) * | 1985-06-26 | 1986-12-27 | Hitachi Ltd | ウエハテ−プマウント方法および装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6443458A (en) | 1989-02-15 |
DE3779640D1 (de) | 1992-07-09 |
EP0307509A2 (en) | 1989-03-22 |
KR960009988B1 (ko) | 1996-07-25 |
EP0307509A3 (en) | 1990-01-24 |
DE3779640T2 (de) | 1993-01-21 |
US4865677A (en) | 1989-09-12 |
EP0307509B1 (en) | 1992-06-03 |
KR890004388A (ko) | 1989-04-21 |
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