JPH0543476B2 - - Google Patents
Info
- Publication number
- JPH0543476B2 JPH0543476B2 JP1193988A JP1193988A JPH0543476B2 JP H0543476 B2 JPH0543476 B2 JP H0543476B2 JP 1193988 A JP1193988 A JP 1193988A JP 1193988 A JP1193988 A JP 1193988A JP H0543476 B2 JPH0543476 B2 JP H0543476B2
- Authority
- JP
- Japan
- Prior art keywords
- drilling
- pin
- piezoelectric element
- drilling pin
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005553 drilling Methods 0.000 claims description 39
- 239000000919 ceramic Substances 0.000 description 16
- 239000004033 plastic Substances 0.000 description 6
- 238000004080 punching Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193988A JPH01188298A (ja) | 1988-01-21 | 1988-01-21 | 穴明け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193988A JPH01188298A (ja) | 1988-01-21 | 1988-01-21 | 穴明け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01188298A JPH01188298A (ja) | 1989-07-27 |
| JPH0543476B2 true JPH0543476B2 (OSRAM) | 1993-07-01 |
Family
ID=11791618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1193988A Granted JPH01188298A (ja) | 1988-01-21 | 1988-01-21 | 穴明け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01188298A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4311908B2 (ja) * | 2002-03-15 | 2009-08-12 | 株式会社堀鐵工所 | 穿孔装置 |
| JP4844710B2 (ja) * | 2005-03-28 | 2011-12-28 | セイコーエプソン株式会社 | フィルタの製造方法、フィルタ、及び液体噴射ヘッド |
-
1988
- 1988-01-21 JP JP1193988A patent/JPH01188298A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01188298A (ja) | 1989-07-27 |
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