JPH01188298A - 穴明け装置 - Google Patents

穴明け装置

Info

Publication number
JPH01188298A
JPH01188298A JP1193988A JP1193988A JPH01188298A JP H01188298 A JPH01188298 A JP H01188298A JP 1193988 A JP1193988 A JP 1193988A JP 1193988 A JP1193988 A JP 1193988A JP H01188298 A JPH01188298 A JP H01188298A
Authority
JP
Japan
Prior art keywords
drilling
pin
plate
ceramic green
green sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1193988A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543476B2 (OSRAM
Inventor
Kimitoku Yoshida
公徳 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1193988A priority Critical patent/JPH01188298A/ja
Publication of JPH01188298A publication Critical patent/JPH01188298A/ja
Publication of JPH0543476B2 publication Critical patent/JPH0543476B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP1193988A 1988-01-21 1988-01-21 穴明け装置 Granted JPH01188298A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1193988A JPH01188298A (ja) 1988-01-21 1988-01-21 穴明け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1193988A JPH01188298A (ja) 1988-01-21 1988-01-21 穴明け装置

Publications (2)

Publication Number Publication Date
JPH01188298A true JPH01188298A (ja) 1989-07-27
JPH0543476B2 JPH0543476B2 (OSRAM) 1993-07-01

Family

ID=11791618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1193988A Granted JPH01188298A (ja) 1988-01-21 1988-01-21 穴明け装置

Country Status (1)

Country Link
JP (1) JPH01188298A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003078114A1 (fr) * 2002-03-15 2003-09-25 Howa Machinery, Ltd. Poinçonneuse
JP2006272631A (ja) * 2005-03-28 2006-10-12 Seiko Epson Corp 金型装置、穴付き被加工板の製造方法、穴付き被加工板、及び液体噴射ヘッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003078114A1 (fr) * 2002-03-15 2003-09-25 Howa Machinery, Ltd. Poinçonneuse
JP2006272631A (ja) * 2005-03-28 2006-10-12 Seiko Epson Corp 金型装置、穴付き被加工板の製造方法、穴付き被加工板、及び液体噴射ヘッド

Also Published As

Publication number Publication date
JPH0543476B2 (OSRAM) 1993-07-01

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