JPH0535658B2 - - Google Patents

Info

Publication number
JPH0535658B2
JPH0535658B2 JP62166145A JP16614587A JPH0535658B2 JP H0535658 B2 JPH0535658 B2 JP H0535658B2 JP 62166145 A JP62166145 A JP 62166145A JP 16614587 A JP16614587 A JP 16614587A JP H0535658 B2 JPH0535658 B2 JP H0535658B2
Authority
JP
Japan
Prior art keywords
mold
unit
molds
resin
standby position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62166145A
Other languages
English (en)
Japanese (ja)
Other versions
JPS649712A (en
Inventor
Yoshinori Uemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP16614587A priority Critical patent/JPS649712A/ja
Publication of JPS649712A publication Critical patent/JPS649712A/ja
Publication of JPH0535658B2 publication Critical patent/JPH0535658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP16614587A 1987-07-02 1987-07-02 Resin molding device Granted JPS649712A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16614587A JPS649712A (en) 1987-07-02 1987-07-02 Resin molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16614587A JPS649712A (en) 1987-07-02 1987-07-02 Resin molding device

Publications (2)

Publication Number Publication Date
JPS649712A JPS649712A (en) 1989-01-13
JPH0535658B2 true JPH0535658B2 (fr) 1993-05-27

Family

ID=15825884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16614587A Granted JPS649712A (en) 1987-07-02 1987-07-02 Resin molding device

Country Status (1)

Country Link
JP (1) JPS649712A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006001588A1 (fr) 2004-04-08 2006-01-05 Lg Chem. Ltd. Tuyau de polyethylene presentant une capacite de traitement a chaud et une resistance a la contrainte superieures et procede de preparation de celui-ci a l'aide d'un catalyseur de metallocene

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0546897Y2 (fr) * 1989-01-19 1993-12-09
JPH02214629A (ja) * 1989-02-15 1990-08-27 Toshifumi Wakayama トランスファー成形機
AU3904393A (en) * 1992-04-13 1993-11-18 Apic Yamada Corporation Method of transfer mold and apparatus for transfer mold
JPH0741650B2 (ja) * 1992-04-23 1995-05-10 株式会社佐藤鉄工所 低圧射出成形法および低圧射出成形機
JP7284514B2 (ja) * 2020-05-11 2023-05-31 アピックヤマダ株式会社 樹脂モールド装置及びクリーニング方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587517A (en) * 1978-12-27 1980-07-02 Hitachi Ltd Method and apparatus for cleaning resin-molding mold

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157620U (ja) * 1982-04-16 1983-10-21 株式会社イデヤ 電子部品の自動樹脂成型ユニット

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587517A (en) * 1978-12-27 1980-07-02 Hitachi Ltd Method and apparatus for cleaning resin-molding mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006001588A1 (fr) 2004-04-08 2006-01-05 Lg Chem. Ltd. Tuyau de polyethylene presentant une capacite de traitement a chaud et une resistance a la contrainte superieures et procede de preparation de celui-ci a l'aide d'un catalyseur de metallocene

Also Published As

Publication number Publication date
JPS649712A (en) 1989-01-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees