JPH05192816A - シームレス帯ループ及びワイヤループの製造方法及び装置、そして帯鋸及びワイヤ鋸内で切断工具として用いるその用途 - Google Patents
シームレス帯ループ及びワイヤループの製造方法及び装置、そして帯鋸及びワイヤ鋸内で切断工具として用いるその用途Info
- Publication number
- JPH05192816A JPH05192816A JP4145043A JP14504392A JPH05192816A JP H05192816 A JPH05192816 A JP H05192816A JP 4145043 A JP4145043 A JP 4145043A JP 14504392 A JP14504392 A JP 14504392A JP H05192816 A JPH05192816 A JP H05192816A
- Authority
- JP
- Japan
- Prior art keywords
- loop
- band
- wire
- loops
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B5/00—Extending closed shapes of metal bands by rolling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S76/00—Metal tools and implements, making
- Y10S76/12—Diamond tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4123095A DE4123095A1 (de) | 1991-07-12 | 1991-07-12 | Verfahren und vorrichtung zur herstellung von nahtlosen band- und drahtschlaufen, und deren verwendung als trennwerkzeuge in band- und drahtsaegen |
| DE41-23-095-7 | 1991-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05192816A true JPH05192816A (ja) | 1993-08-03 |
Family
ID=6435988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4145043A Pending JPH05192816A (ja) | 1991-07-12 | 1992-05-12 | シームレス帯ループ及びワイヤループの製造方法及び装置、そして帯鋸及びワイヤ鋸内で切断工具として用いるその用途 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5287774A (enExample) |
| EP (1) | EP0522542B1 (enExample) |
| JP (1) | JPH05192816A (enExample) |
| KR (1) | KR950015116B1 (enExample) |
| DE (2) | DE4123095A1 (enExample) |
| FI (1) | FI923185A7 (enExample) |
| TW (1) | TW235931B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19510625A1 (de) * | 1995-03-23 | 1996-09-26 | Wacker Siltronic Halbleitermat | Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück |
| DE19519460A1 (de) * | 1995-05-26 | 1996-11-28 | Wacker Siltronic Halbleitermat | Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück |
| DE10122628B4 (de) | 2001-05-10 | 2007-10-11 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück |
| JP4991229B2 (ja) * | 2006-09-22 | 2012-08-01 | 信越半導体株式会社 | 切断方法およびエピタキシャルウエーハの製造方法 |
| DE102009038941B4 (de) | 2009-08-26 | 2013-03-21 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
| DE102009051008B4 (de) * | 2009-10-28 | 2013-05-23 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
| DE102010005904B4 (de) | 2010-01-27 | 2012-11-22 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
| DE102010013520B4 (de) | 2010-03-31 | 2013-02-07 | Siltronic Ag | Verfahren zur beidseitigen Politur einer Halbleiterscheibe |
| DE102010014874A1 (de) | 2010-04-14 | 2011-10-20 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
| DE102011008400B4 (de) | 2011-01-12 | 2014-07-10 | Siltronic Ag | Verfahren zur Kühlung eines Werkstückes aus Halbleitermaterial beim Drahtsägen |
| DE102011005512A1 (de) | 2011-03-14 | 2012-01-19 | Siltronic Ag | Verfahren zur beidseitigen Politur einer Halbleiterscheibe |
| DE102011082366B3 (de) * | 2011-09-08 | 2013-02-28 | Siltronic Ag | Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
| DE102012221904B4 (de) | 2012-11-29 | 2018-05-30 | Siltronic Ag | Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung |
| JP6289492B2 (ja) | 2012-12-04 | 2018-03-07 | マイヤー ブルガー (スイッツァランド) アーゲー | ワイヤソー及びワイヤソーのワイヤ管理システム並びにワイヤソーにより材料を切断する切断方法 |
| DE102013219900B3 (de) * | 2013-10-01 | 2015-02-26 | Siltronic Ag | Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück |
| DE102013223344B3 (de) * | 2013-11-15 | 2015-05-07 | Siltronic Ag | Verfahren zum Zersägen eines temperierten Werkstückes mit einer Drahtsäge |
| DE102013225104B4 (de) | 2013-12-06 | 2019-11-28 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge |
| DE102015204275B3 (de) * | 2015-03-10 | 2016-05-12 | Siltronic Ag | Verfahren zur Wiederaufnahme eines Drahttrennläppvorgangs mit strukturiertem Sägedraht nach Unterbrechung |
| DE102016222899A1 (de) | 2016-11-21 | 2018-05-24 | Siltronic Ag | Vorrichtung und Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge |
| DE102016224640B4 (de) | 2016-12-09 | 2024-03-28 | Siltronic Ag | Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge |
| JP6578412B1 (ja) * | 2018-06-08 | 2019-09-18 | 株式会社アマダホールディングス | 環状帯鋸刃の製造方法及び製造装置 |
| CN110695270B (zh) * | 2019-09-20 | 2020-09-29 | 太原科技大学 | 一种立式小辊径工作辊辗环装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158902A (ja) * | 1984-01-30 | 1985-08-20 | Amada Co Ltd | バンドソ−マシンにおける極薄肉のエンドレスバンドの製造方法 |
| JPS61284317A (ja) * | 1985-06-07 | 1986-12-15 | Sanwa Daiyamondo Kogyo Kk | 硬質物切断用無端帯鋸 |
| JPH0311841A (ja) * | 1989-06-09 | 1991-01-21 | Nec Corp | ローカルエリアネットワーク |
| JP4089620B2 (ja) * | 2004-01-15 | 2008-05-28 | 株式会社デンソー | 車両制御システム |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE201166C (enExample) * | ||||
| DE372377C (de) * | 1920-10-01 | 1923-03-27 | Siegfried Gumpel | Verfahren zur Herstellung endloser Saegebaender ohne Naht |
| US2029751A (en) * | 1933-06-07 | 1936-02-04 | Jr James L Adams | Metal rolling mill |
| NL169428C (nl) * | 1977-06-28 | 1983-11-16 | Volvo Car Bv | Trekwalsinrichting voor het uitwalsen van eindloze metalen banden. |
| GB2055643B (en) * | 1979-08-13 | 1982-11-24 | Gersan Ets | Method of and apparatus for manufacturing a saw blade of a band saw |
| US4568617A (en) * | 1983-08-08 | 1986-02-04 | Wilkes Donald F | Thin bands and method and apparatus for production thereof |
| SE446380B (sv) * | 1984-04-18 | 1986-09-08 | Bror Elofson | Sett att tillverka bandsagblad utan skarv |
| JPS61132206A (ja) * | 1984-11-30 | 1986-06-19 | Aisin Warner Ltd | 金属製無端バンドの圧延装置 |
| SE453222B (sv) * | 1985-08-15 | 1988-01-18 | Tri Innovations Ab | Vermebehandlingsugn |
| JPS6348603A (ja) * | 1986-08-15 | 1988-03-01 | Hitachi Ltd | 光磁気デイスク装置用電磁コイル |
-
1991
- 1991-07-12 DE DE4123095A patent/DE4123095A1/de not_active Withdrawn
-
1992
- 1992-03-23 TW TW081102166A patent/TW235931B/zh active
- 1992-04-28 US US07/875,073 patent/US5287774A/en not_active Expired - Fee Related
- 1992-05-12 JP JP4145043A patent/JPH05192816A/ja active Pending
- 1992-07-06 KR KR1019920012019A patent/KR950015116B1/ko not_active Expired - Fee Related
- 1992-07-09 EP EP92111614A patent/EP0522542B1/de not_active Expired - Lifetime
- 1992-07-09 DE DE59203806T patent/DE59203806D1/de not_active Expired - Fee Related
- 1992-07-10 FI FI923185A patent/FI923185A7/fi not_active Application Discontinuation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60158902A (ja) * | 1984-01-30 | 1985-08-20 | Amada Co Ltd | バンドソ−マシンにおける極薄肉のエンドレスバンドの製造方法 |
| JPS61284317A (ja) * | 1985-06-07 | 1986-12-15 | Sanwa Daiyamondo Kogyo Kk | 硬質物切断用無端帯鋸 |
| JPH0311841A (ja) * | 1989-06-09 | 1991-01-21 | Nec Corp | ローカルエリアネットワーク |
| JP4089620B2 (ja) * | 2004-01-15 | 2008-05-28 | 株式会社デンソー | 車両制御システム |
Also Published As
| Publication number | Publication date |
|---|---|
| DE4123095A1 (de) | 1993-01-14 |
| FI923185L (fi) | 1993-01-13 |
| US5287774A (en) | 1994-02-22 |
| TW235931B (enExample) | 1994-12-11 |
| EP0522542B1 (de) | 1995-09-27 |
| EP0522542A1 (de) | 1993-01-13 |
| KR950015116B1 (ko) | 1995-12-22 |
| FI923185A7 (fi) | 1993-01-13 |
| FI923185A0 (fi) | 1992-07-10 |
| DE59203806D1 (de) | 1995-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05192816A (ja) | シームレス帯ループ及びワイヤループの製造方法及び装置、そして帯鋸及びワイヤ鋸内で切断工具として用いるその用途 | |
| US5700179A (en) | Method of manufacturing semiconductor wafers and process of and apparatus for grinding used for the same method of manufacture | |
| US9573296B2 (en) | Method for simultaneously cutting a multiplicity of slices of particularly uniform thickness from a workpiece | |
| US6543434B2 (en) | Device for simultaneously separating a multiplicity of wafers from a workpiece | |
| CN101517710B (zh) | 切断方法以及外延晶片的制造方法 | |
| JP5649692B2 (ja) | 円筒形の被加工物から多数のウェハを同時にスライスするための方法 | |
| US5931147A (en) | Method of cutting a workpiece with a wire saw | |
| TW201529225A (zh) | 固定磨粒線鋸裝置及使用其之晶圓製造方法 | |
| EP0827798B1 (en) | A multi-wire saw | |
| US6352071B1 (en) | Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw | |
| US20030181023A1 (en) | Method of processing silicon single crystal ingot | |
| US20210362373A1 (en) | Wire saw apparatus and method for manufacturing wafer | |
| JPH0970747A (ja) | ワイヤソー | |
| KR102880759B1 (ko) | 공작물로부터 복수의 디스크를 동시에 분리하기 위한 방법 및 장치 | |
| JP6850418B2 (ja) | 金属条の製造方法 | |
| JP2006021312A (ja) | 薄帯状材料のスリット加工方法及び装置 | |
| JP2005288674A (ja) | スリッター装置用カッター及びこのカッターを使用したスリッター装置 | |
| JPH09309108A (ja) | ワイヤーソー用シームレスエンドレスワイヤー | |
| JP3810125B2 (ja) | ワイヤーソー及び円柱形ワークを切断する方法 | |
| JP5355249B2 (ja) | ワイヤーソー装置 | |
| JP2720742B2 (ja) | マンドレルバーの外削方法 | |
| JPH0192039A (ja) | 線材の表面皮削り加工設備 | |
| JP3923965B2 (ja) | ソーワイヤ | |
| CN214491135U (zh) | 用作多线锯布置的润滑剂系统的设备 | |
| JPH11277325A (ja) | 金属帯のサイドトリマー用板押えリング |