JPH05152723A - 厚膜ペーストの乾燥方法 - Google Patents

厚膜ペーストの乾燥方法

Info

Publication number
JPH05152723A
JPH05152723A JP166692A JP166692A JPH05152723A JP H05152723 A JPH05152723 A JP H05152723A JP 166692 A JP166692 A JP 166692A JP 166692 A JP166692 A JP 166692A JP H05152723 A JPH05152723 A JP H05152723A
Authority
JP
Japan
Prior art keywords
circuit board
thick film
magnetic field
film paste
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP166692A
Other languages
English (en)
Japanese (ja)
Inventor
Der Lippe Norbert Von
フオン デア リツペ ノルベルト
Rudolf Graener
グラエナー ルドルフ
Peter Sommer
ゾマー ペーター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rheinmetall Industrie AG
Original Assignee
Rheinmetall GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rheinmetall GmbH filed Critical Rheinmetall GmbH
Publication of JPH05152723A publication Critical patent/JPH05152723A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/32—Drying solid materials or objects by processes involving the application of heat by development of heat within the materials or objects to be dried, e.g. by fermentation or other microbiological action
    • F26B3/34—Drying solid materials or objects by processes involving the application of heat by development of heat within the materials or objects to be dried, e.g. by fermentation or other microbiological action by using electrical effects
    • F26B3/347—Electromagnetic heating, e.g. induction heating or heating using microwave energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Biotechnology (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Drying Of Solid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP166692A 1991-01-09 1992-01-08 厚膜ペーストの乾燥方法 Pending JPH05152723A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19914100392 DE4100392A1 (de) 1991-01-09 1991-01-09 Verfahren zur trocknung von dickschichtpasten
DE41003926 1991-01-09

Publications (1)

Publication Number Publication Date
JPH05152723A true JPH05152723A (ja) 1993-06-18

Family

ID=6422707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP166692A Pending JPH05152723A (ja) 1991-01-09 1992-01-08 厚膜ペーストの乾燥方法

Country Status (4)

Country Link
JP (1) JPH05152723A (de)
DE (1) DE4100392A1 (de)
FR (1) FR2672182A1 (de)
GB (1) GB2251677A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027487A (ja) * 2005-07-19 2007-02-01 Dowa Holdings Co Ltd 導電膜または配線の形成法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB653794A (en) * 1946-04-25 1951-05-23 Igranic Electric Co Ltd High frequency dielectric heating of sheet material
GB705294A (en) * 1950-06-01 1954-03-10 Daimler Benz Ag Improvements relating to the drying by induction heating of colours, lacquers, and the like on metal bodies
US3576664A (en) * 1968-09-10 1971-04-27 Cornwells Metal Finishing Co I Method for coating metal strips
GB1378520A (en) * 1971-05-10 1974-12-27 Atomic Energy Authority Uk Metallising pastes
FR2435883A1 (fr) * 1978-06-29 1980-04-04 Materiel Telephonique Circuit integre hybride et son procede de fabrication
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
DE3423533A1 (de) * 1984-06-26 1986-01-02 Siemens AG, 1000 Berlin und 8000 München Verfahren zur trocknung von leiterplatten
US4680871A (en) * 1985-05-17 1987-07-21 David Reznik Apparatus and method for drying and curing coated substrates
CA1309755C (en) * 1987-03-30 1992-11-03 Hiroyoshi Nozaki Method of and apparatus for baking coating layer
CA1306903C (en) * 1987-09-24 1992-09-01 Edward A. Hayduk, Jr. Process for the manufacture of copper thick-film conductors using aninfrared furnace

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027487A (ja) * 2005-07-19 2007-02-01 Dowa Holdings Co Ltd 導電膜または配線の形成法

Also Published As

Publication number Publication date
GB9127253D0 (en) 1992-02-19
FR2672182A1 (fr) 1992-07-31
GB2251677A (en) 1992-07-15
DE4100392A1 (de) 1992-07-16

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