GB9127253D0 - Method for drying thick-layer pastes - Google Patents

Method for drying thick-layer pastes

Info

Publication number
GB9127253D0
GB9127253D0 GB919127253A GB9127253A GB9127253D0 GB 9127253 D0 GB9127253 D0 GB 9127253D0 GB 919127253 A GB919127253 A GB 919127253A GB 9127253 A GB9127253 A GB 9127253A GB 9127253 D0 GB9127253 D0 GB 9127253D0
Authority
GB
United Kingdom
Prior art keywords
layer pastes
drying thick
thick
drying
pastes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB919127253A
Other versions
GB2251677A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rheinmetall Industrie AG
Original Assignee
Rheinmetall GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rheinmetall GmbH filed Critical Rheinmetall GmbH
Publication of GB9127253D0 publication Critical patent/GB9127253D0/en
Publication of GB2251677A publication Critical patent/GB2251677A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/32—Drying solid materials or objects by processes involving the application of heat by development of heat within the materials or objects to be dried, e.g. by fermentation or other microbiological action
    • F26B3/34—Drying solid materials or objects by processes involving the application of heat by development of heat within the materials or objects to be dried, e.g. by fermentation or other microbiological action by using electrical effects
    • F26B3/347—Electromagnetic heating, e.g. induction heating or heating using microwave energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Biotechnology (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drying Of Solid Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB9127253A 1991-01-09 1991-12-23 Drying thick-layer printed circuit boards Withdrawn GB2251677A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19914100392 DE4100392A1 (en) 1991-01-09 1991-01-09 METHOD FOR DRYING THICK FILM PASTE

Publications (2)

Publication Number Publication Date
GB9127253D0 true GB9127253D0 (en) 1992-02-19
GB2251677A GB2251677A (en) 1992-07-15

Family

ID=6422707

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9127253A Withdrawn GB2251677A (en) 1991-01-09 1991-12-23 Drying thick-layer printed circuit boards

Country Status (4)

Country Link
JP (1) JPH05152723A (en)
DE (1) DE4100392A1 (en)
FR (1) FR2672182A1 (en)
GB (1) GB2251677A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027487A (en) * 2005-07-19 2007-02-01 Dowa Holdings Co Ltd Method for forming conductive film or wiring

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB653794A (en) * 1946-04-25 1951-05-23 Igranic Electric Co Ltd High frequency dielectric heating of sheet material
GB705294A (en) * 1950-06-01 1954-03-10 Daimler Benz Ag Improvements relating to the drying by induction heating of colours, lacquers, and the like on metal bodies
US3576664A (en) * 1968-09-10 1971-04-27 Cornwells Metal Finishing Co I Method for coating metal strips
GB1378520A (en) * 1971-05-10 1974-12-27 Atomic Energy Authority Uk Metallising pastes
FR2435883A1 (en) * 1978-06-29 1980-04-04 Materiel Telephonique HYBRID INTEGRATED CIRCUIT AND ITS MANUFACTURING PROCESS
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
DE3423533A1 (en) * 1984-06-26 1986-01-02 Siemens AG, 1000 Berlin und 8000 München Method for drying printed-circuit boards
US4680871A (en) * 1985-05-17 1987-07-21 David Reznik Apparatus and method for drying and curing coated substrates
CA1309755C (en) * 1987-03-30 1992-11-03 Hiroyoshi Nozaki Method of and apparatus for baking coating layer
CA1306903C (en) * 1987-09-24 1992-09-01 Edward A. Hayduk, Jr. Process for the manufacture of copper thick-film conductors using aninfrared furnace

Also Published As

Publication number Publication date
GB2251677A (en) 1992-07-15
FR2672182A1 (en) 1992-07-31
DE4100392A1 (en) 1992-07-16
JPH05152723A (en) 1993-06-18

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)