DK0492095T3 - Fremgangsmåde og apparat til lodning af elektroniske, flade sammensætninger, især med komponenter bestykkede kredsløbsplader - Google Patents

Fremgangsmåde og apparat til lodning af elektroniske, flade sammensætninger, især med komponenter bestykkede kredsløbsplader

Info

Publication number
DK0492095T3
DK0492095T3 DK91118821.7T DK91118821T DK0492095T3 DK 0492095 T3 DK0492095 T3 DK 0492095T3 DK 91118821 T DK91118821 T DK 91118821T DK 0492095 T3 DK0492095 T3 DK 0492095T3
Authority
DK
Denmark
Prior art keywords
circuit boards
defects
auxiliary substance
soldering
itself
Prior art date
Application number
DK91118821.7T
Other languages
English (en)
Inventor
Hans-Juergen Albrecht
Wilfred John
Harald Wittrich
Wolfgang Scheel
Volker Liedke
Karl-Heinz Grasmann
Original Assignee
Grasmann Karl Heinz Wls
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grasmann Karl Heinz Wls filed Critical Grasmann Karl Heinz Wls
Application granted granted Critical
Publication of DK0492095T3 publication Critical patent/DK0492095T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paper (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DK91118821.7T 1990-12-21 1991-11-04 Fremgangsmåde og apparat til lodning af elektroniske, flade sammensætninger, især med komponenter bestykkede kredsløbsplader DK0492095T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4041270A DE4041270A1 (de) 1990-12-21 1990-12-21 Verfahren und vorrichtung zur verarbeitung von elektronischen flachbaugruppen, insbesondere mit bauelementen bestueckten leiterplatten

Publications (1)

Publication Number Publication Date
DK0492095T3 true DK0492095T3 (da) 1994-01-24

Family

ID=6421086

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91118821.7T DK0492095T3 (da) 1990-12-21 1991-11-04 Fremgangsmåde og apparat til lodning af elektroniske, flade sammensætninger, især med komponenter bestykkede kredsløbsplader

Country Status (7)

Country Link
US (1) US5193739A (da)
EP (1) EP0492095B1 (da)
JP (1) JPH0851273A (da)
AT (1) ATE98542T1 (da)
DE (2) DE4041270A1 (da)
DK (1) DK0492095T3 (da)
ES (1) ES2049074T3 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4225378A1 (de) * 1992-03-20 1993-09-23 Linde Ag Verfahren zum verloeten von leiterplatten unter niederdruck
FR2697456B1 (fr) * 1992-10-30 1994-12-23 Air Liquide Procédé et dispositif de fluxage par voie sèche.
DE4338225A1 (de) * 1993-11-09 1995-05-11 Linde Ag Verfahren zum Wellenlöten mit bleifreien Lotmaterialien
US5499754A (en) * 1993-11-19 1996-03-19 Mcnc Fluxless soldering sample pretreating system
DE69939072D1 (de) * 1998-02-27 2008-08-21 Matsushita Electric Ind Co Ltd Verfahren zum Trennen des Lötmaterials von der Oxidlötung
DE10210217A1 (de) * 2002-03-08 2003-10-16 Behr Gmbh & Co Verfahren zum Löten von Aluminium
DE10342242A1 (de) 2003-09-11 2005-04-07 Behr Gmbh & Co. Kg Lötwerkstück, Lötverfahren und Wärmetauscher
US8844793B2 (en) * 2010-11-05 2014-09-30 Raytheon Company Reducing formation of oxide on solder

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2136392A (en) * 1936-06-08 1938-11-15 Murphy Daniel Francis Method for removing scale from boilers
DE1546174A1 (de) * 1965-03-19 1970-02-26 Otto & Co Gmbh Dr C Verfahren zum kontinuierlichen Beizen von strangfoermigem Material
JPS5315010A (en) * 1976-07-27 1978-02-10 Nec Corp Bipolar pulse polarity error detection circuit
DE8520254U1 (de) * 1985-07-11 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Lötvorrichtung zum Löten elektronischer Flachbaugruppen in einer schutzgasgefüllten Lötkammer
DE3824861A1 (de) * 1988-07-21 1990-01-25 Productech Gmbh Verfahren zur herstellung von loetverbindungen
GB8827933D0 (en) * 1988-11-30 1989-01-05 Plessey Co Plc Improvements relating to soldering processes
JPH02174190A (ja) * 1988-12-26 1990-07-05 Hitachi Chem Co Ltd 電子部品の実装方法
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern

Also Published As

Publication number Publication date
ES2049074T3 (es) 1994-04-01
JPH0851273A (ja) 1996-02-20
ATE98542T1 (de) 1994-01-15
US5193739A (en) 1993-03-16
EP0492095A2 (de) 1992-07-01
DE4041270A1 (de) 1992-06-25
EP0492095B1 (de) 1993-12-15
DE59100736D1 (de) 1994-01-27
EP0492095A3 (en) 1992-08-26

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