ES2049074T3 - Procedimiento y dispositivo para la elaboracion de placas de circuito electronicas, en especial placas de circuito impreso provistas de componentes. - Google Patents
Procedimiento y dispositivo para la elaboracion de placas de circuito electronicas, en especial placas de circuito impreso provistas de componentes.Info
- Publication number
- ES2049074T3 ES2049074T3 ES91118821T ES91118821T ES2049074T3 ES 2049074 T3 ES2049074 T3 ES 2049074T3 ES 91118821 T ES91118821 T ES 91118821T ES 91118821 T ES91118821 T ES 91118821T ES 2049074 T3 ES2049074 T3 ES 2049074T3
- Authority
- ES
- Spain
- Prior art keywords
- circuit boards
- printed circuit
- defects
- auxiliary substance
- itself
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Paper (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
SEGUN LA INVENCION, EL PROCEDIMIENTO PARA SOLDAR GRUPOS CONSTRUCTIVOS ELECTRONICOS DE UNA SOLA PLANTA, EN PARTICULAR PLACAS DE CIRCUITO IMPRESO EQUIPADAS CON ELEMENTOS DE CONSTRUCCION, SE ABSORBE EN PRIMER LUGAR, DURANTE EL PROCESO DE DECAPACION, UNA MATERIA AUXILIAR CONDENSABLE, POR EJEMPLO AGUA, EN EL LUGAR DE DEFECTO DE LAS CAPAS DE OXIDO SOBRE LA SUPERFICIE DE CONTACTO DE LA SOLDADURA Y SE CONDENSA EN EL LUGAR DE DEFECTO AL MENOS EN PARTE. DESPUES SE EXPONEN LAS CAPAS DE OXIDO A UN CALENTAMIENTO RAPIDO TAL QUE LA MATERIA AUXILIAR SE VAPORIZA COMO EN UNA EXPLOSION EN EL LUGAR DE DEFECTO Y POR ELLO LA CAPA DE OXIDO SE ABRE ROMPIENDOSE Y SE DESPRENDE DEL ELEMENTO METALICO, DE TAL MANERA QUE LAS SUPERFICIES DE UNION DE SOLDADURA SE LLEVAN AL SIGUIENTE Y VERDADERO PROCESO DE SOLDADURA EN ESTADO PURO. EL CALENTAMIENTO RAPIDO TIENE LUGAR EN EL CASO DE LA SOLDADURA POR ONDAS, PREFERIBLEMENTE POR MEDIO DE LA ONDA PERPENDICULAR MISMA. EN TANTO QUE LAS CAPAS PASIVAS NO OXIDADAS SE TENGAN QUE DECAPITAR, ESTO TIENE LUGAR PREFERIBLEMENTE EN UNA FASE PRECEDENTE DEL PROCESO DE DECAPACION, MIENTRAS HIDROFILA LA CAPA DE OXIDO. PARA ESTO ES APROPIADO UN TRATAMIENTO PREVIO DEL PLASMA. SEGUN LA INVENCION, EL DISPOSITIVO PRESENTA UNA CAMARA DE HUMECTACION EN LA QUE EL MATERIAL AUXILIAR CONDENSABLE SE EXPONE A LAS CAPAS DE OXIDO HIDROFILAS Y ES ABSORBIDO POR ELLAS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4041270A DE4041270A1 (de) | 1990-12-21 | 1990-12-21 | Verfahren und vorrichtung zur verarbeitung von elektronischen flachbaugruppen, insbesondere mit bauelementen bestueckten leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2049074T3 true ES2049074T3 (es) | 1994-04-01 |
Family
ID=6421086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES91118821T Expired - Lifetime ES2049074T3 (es) | 1990-12-21 | 1991-11-04 | Procedimiento y dispositivo para la elaboracion de placas de circuito electronicas, en especial placas de circuito impreso provistas de componentes. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5193739A (es) |
EP (1) | EP0492095B1 (es) |
JP (1) | JPH0851273A (es) |
AT (1) | ATE98542T1 (es) |
DE (2) | DE4041270A1 (es) |
DK (1) | DK0492095T3 (es) |
ES (1) | ES2049074T3 (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4225378A1 (de) * | 1992-03-20 | 1993-09-23 | Linde Ag | Verfahren zum verloeten von leiterplatten unter niederdruck |
FR2697456B1 (fr) * | 1992-10-30 | 1994-12-23 | Air Liquide | Procédé et dispositif de fluxage par voie sèche. |
DE4338225A1 (de) * | 1993-11-09 | 1995-05-11 | Linde Ag | Verfahren zum Wellenlöten mit bleifreien Lotmaterialien |
US5499754A (en) * | 1993-11-19 | 1996-03-19 | Mcnc | Fluxless soldering sample pretreating system |
DE69939072D1 (de) * | 1998-02-27 | 2008-08-21 | Matsushita Electric Ind Co Ltd | Verfahren zum Trennen des Lötmaterials von der Oxidlötung |
DE10210217A1 (de) * | 2002-03-08 | 2003-10-16 | Behr Gmbh & Co | Verfahren zum Löten von Aluminium |
DE10342242A1 (de) | 2003-09-11 | 2005-04-07 | Behr Gmbh & Co. Kg | Lötwerkstück, Lötverfahren und Wärmetauscher |
US8844793B2 (en) * | 2010-11-05 | 2014-09-30 | Raytheon Company | Reducing formation of oxide on solder |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2136392A (en) * | 1936-06-08 | 1938-11-15 | Murphy Daniel Francis | Method for removing scale from boilers |
DE1546174A1 (de) * | 1965-03-19 | 1970-02-26 | Otto & Co Gmbh Dr C | Verfahren zum kontinuierlichen Beizen von strangfoermigem Material |
JPS5315010A (en) * | 1976-07-27 | 1978-02-10 | Nec Corp | Bipolar pulse polarity error detection circuit |
DE8520254U1 (de) * | 1985-07-11 | 1985-10-31 | Siemens AG, 1000 Berlin und 8000 München | Lötvorrichtung zum Löten elektronischer Flachbaugruppen in einer schutzgasgefüllten Lötkammer |
DE3824861A1 (de) * | 1988-07-21 | 1990-01-25 | Productech Gmbh | Verfahren zur herstellung von loetverbindungen |
GB8827933D0 (en) * | 1988-11-30 | 1989-01-05 | Plessey Co Plc | Improvements relating to soldering processes |
JPH02174190A (ja) * | 1988-12-26 | 1990-07-05 | Hitachi Chem Co Ltd | 電子部品の実装方法 |
DE4032328A1 (de) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern |
-
1990
- 1990-12-21 DE DE4041270A patent/DE4041270A1/de not_active Withdrawn
-
1991
- 1991-11-04 ES ES91118821T patent/ES2049074T3/es not_active Expired - Lifetime
- 1991-11-04 DK DK91118821.7T patent/DK0492095T3/da active
- 1991-11-04 EP EP91118821A patent/EP0492095B1/de not_active Expired - Lifetime
- 1991-11-04 AT AT91118821T patent/ATE98542T1/de not_active IP Right Cessation
- 1991-11-04 DE DE91118821T patent/DE59100736D1/de not_active Expired - Fee Related
- 1991-12-18 US US07/810,708 patent/US5193739A/en not_active Expired - Fee Related
- 1991-12-20 JP JP3338775A patent/JPH0851273A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH0851273A (ja) | 1996-02-20 |
ATE98542T1 (de) | 1994-01-15 |
US5193739A (en) | 1993-03-16 |
EP0492095A2 (de) | 1992-07-01 |
DK0492095T3 (da) | 1994-01-24 |
DE4041270A1 (de) | 1992-06-25 |
EP0492095B1 (de) | 1993-12-15 |
DE59100736D1 (de) | 1994-01-27 |
EP0492095A3 (en) | 1992-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5145104A (en) | Substrate soldering in a reducing atmosphere | |
US5531838A (en) | Flux composition and corresponding soldering method | |
US5499754A (en) | Fluxless soldering sample pretreating system | |
US6893530B2 (en) | Method and system of drying materials and method of manufacturing circuit boards using the same | |
ES2049074T3 (es) | Procedimiento y dispositivo para la elaboracion de placas de circuito electronicas, en especial placas de circuito impreso provistas de componentes. | |
GB2262902A (en) | Plated-through hole solder thief | |
JP3209875B2 (ja) | 基板の製造方法及び基板 | |
EP0513831B1 (en) | Method for use of preflux, printed wiring board, and method for production thereof | |
US20050255685A1 (en) | Void free solder arrangement for screen printing semiconductor wafers | |
US6019037A (en) | Method for screen printing patterns on a target object | |
EP0675675B1 (en) | Cleaning method | |
JP3615832B2 (ja) | 配線基板の検査方法及び装置 | |
RU2619913C2 (ru) | Способ получения заполненных переходных металлизированных сквозных отверстий печатной платы | |
JPS56165333A (en) | Mounting method for electronic parts | |
JP4333538B2 (ja) | 電子部品の実装方法 | |
ES2081356T3 (es) | Procedimiento de elaboracion de medios de conexiones electricas, en particular de sustratos de interconexion para circuitos hibridos. | |
JPH01123499A (ja) | 電子部品装着方法 | |
Geiger et al. | Development of assembly & rework processes for large and complex PCBs using lead-free solder | |
EP0389306A3 (en) | Procedure and inspecting an equipped printed circuit board, especially for inspecting the bonds on the board and apparatus for performing this procedure | |
JPH03109797A (ja) | 両面実装基板のリフロー方法 | |
JPH02303087A (ja) | 電子受動素子実装方法 | |
JPH0343179Y2 (es) | ||
US5174020A (en) | Remelting process for printed circuit boards | |
JPH01282886A (ja) | 電子回路基板の乾燥方法及び乾燥装置 | |
Clementi et al. | Reliability and analytical evaluations of no-clean flip-chip assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 492095 Country of ref document: ES |