KR100417338B1 - 칩 실장시 플라즈마를 이용한 표면세정 및 개질방법 - Google Patents
칩 실장시 플라즈마를 이용한 표면세정 및 개질방법 Download PDFInfo
- Publication number
- KR100417338B1 KR100417338B1 KR10-2000-0074044A KR20000074044A KR100417338B1 KR 100417338 B1 KR100417338 B1 KR 100417338B1 KR 20000074044 A KR20000074044 A KR 20000074044A KR 100417338 B1 KR100417338 B1 KR 100417338B1
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning
- plasma
- vacuum chamber
- chip
- workpiece
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning In General (AREA)
Abstract
Description
세정방법 | 밀착력 |
초순수를 이용한 세정 | 평균 3.80 gf(gram force) |
플라즈마 세정 | 평균 6.81 gf |
Claims (2)
- 피처리물을 진공챔버(10) 내의 적치대(20)에 배치하는 세정준비단계와;세정이 준비되면 진공설비를 이용하여 상기 진공챔버(10) 내부를 진공시키는 단계와;진공이 완료되면 전원공급부(40)를 통해 전극(30)에 1kHz~800kHz 혹은 고주파 마이크로펄스를 인가하여 상기 진공챔버(10) 내에 플라즈마를 발생시키는 단계와;상기 플라즈마 발생과 동시에 피처리물의 세정 혹은 표면개질 특성에 맞추어 불활성가스와 산화성가스 혹은 불활성가스와 환원성가스가 혼합된 반응가스를 상기 진공챔버(10) 내부로 공급시켜 플라즈마를 안정화시키는 단계와;상기 단계를 거쳐 세정 및 표면개질된 피처리물을 실장하는 단계를 포함하여 구성되는 것을 특징으로 하는 칩 실장시 플라즈마를 이용한 표면세정 및 개질방법.
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2000-0074044A KR100417338B1 (ko) | 2000-12-07 | 2000-12-07 | 칩 실장시 플라즈마를 이용한 표면세정 및 개질방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2000-0074044A KR100417338B1 (ko) | 2000-12-07 | 2000-12-07 | 칩 실장시 플라즈마를 이용한 표면세정 및 개질방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020044834A KR20020044834A (ko) | 2002-06-19 |
KR100417338B1 true KR100417338B1 (ko) | 2004-02-05 |
Family
ID=27680148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0074044A KR100417338B1 (ko) | 2000-12-07 | 2000-12-07 | 칩 실장시 플라즈마를 이용한 표면세정 및 개질방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100417338B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100454818B1 (ko) * | 2001-07-31 | 2004-11-08 | 주식회사제4기한국 | 고밀도 플라즈마를 이용한 살균 및 멸균 장치와 그 방법 |
KR100864855B1 (ko) * | 2007-03-08 | 2008-10-23 | (주)창조엔지니어링 | 반도체 소자의 실장을 위한 세정 및 본딩의 인라인 처리장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10189632A (ja) * | 1996-12-23 | 1998-07-21 | Lsi Logic Corp | 回路上のソルダ・バンプを清浄するためのプラズマ活性化nf3の使用 |
JPH11204828A (ja) * | 1998-01-09 | 1999-07-30 | Matsushita Electron Corp | 発光ダイオードの製造方法 |
US6015722A (en) * | 1997-10-14 | 2000-01-18 | Gore Enterprise Holdings, Inc. | Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate |
JP2000138255A (ja) * | 1998-10-29 | 2000-05-16 | Nec Corp | 半導体装置の製造方法と製造装置 |
US6074895A (en) * | 1997-09-23 | 2000-06-13 | International Business Machines Corporation | Method of forming a flip chip assembly |
-
2000
- 2000-12-07 KR KR10-2000-0074044A patent/KR100417338B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10189632A (ja) * | 1996-12-23 | 1998-07-21 | Lsi Logic Corp | 回路上のソルダ・バンプを清浄するためのプラズマ活性化nf3の使用 |
US6074895A (en) * | 1997-09-23 | 2000-06-13 | International Business Machines Corporation | Method of forming a flip chip assembly |
US6015722A (en) * | 1997-10-14 | 2000-01-18 | Gore Enterprise Holdings, Inc. | Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate |
JPH11204828A (ja) * | 1998-01-09 | 1999-07-30 | Matsushita Electron Corp | 発光ダイオードの製造方法 |
JP2000138255A (ja) * | 1998-10-29 | 2000-05-16 | Nec Corp | 半導体装置の製造方法と製造装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20020044834A (ko) | 2002-06-19 |
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