JPH05136304A - 半導体モジユール及びそれを用いたパワー制御装置 - Google Patents

半導体モジユール及びそれを用いたパワー制御装置

Info

Publication number
JPH05136304A
JPH05136304A JP3298895A JP29889591A JPH05136304A JP H05136304 A JPH05136304 A JP H05136304A JP 3298895 A JP3298895 A JP 3298895A JP 29889591 A JP29889591 A JP 29889591A JP H05136304 A JPH05136304 A JP H05136304A
Authority
JP
Japan
Prior art keywords
copper foil
semiconductor module
foil pattern
control device
power control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3298895A
Other languages
English (en)
Japanese (ja)
Inventor
Takaaki Yamashita
孝陽 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3298895A priority Critical patent/JPH05136304A/ja
Priority to GB9223021A priority patent/GB2261549A/en
Priority to DE4238417A priority patent/DE4238417A1/de
Publication of JPH05136304A publication Critical patent/JPH05136304A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP3298895A 1991-11-14 1991-11-14 半導体モジユール及びそれを用いたパワー制御装置 Pending JPH05136304A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3298895A JPH05136304A (ja) 1991-11-14 1991-11-14 半導体モジユール及びそれを用いたパワー制御装置
GB9223021A GB2261549A (en) 1991-11-14 1992-11-03 Cooling arrangement for a semiconductor module and manufacturing method thereof
DE4238417A DE4238417A1 (https=) 1991-11-14 1992-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3298895A JPH05136304A (ja) 1991-11-14 1991-11-14 半導体モジユール及びそれを用いたパワー制御装置

Publications (1)

Publication Number Publication Date
JPH05136304A true JPH05136304A (ja) 1993-06-01

Family

ID=17865549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3298895A Pending JPH05136304A (ja) 1991-11-14 1991-11-14 半導体モジユール及びそれを用いたパワー制御装置

Country Status (3)

Country Link
JP (1) JPH05136304A (https=)
DE (1) DE4238417A1 (https=)
GB (1) GB2261549A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004048013A (ja) * 2002-07-08 2004-02-12 Siemens Ag エレクトロニクスユニット及びその製造方法
JP2005259880A (ja) * 2004-03-10 2005-09-22 Fuji Electric Holdings Co Ltd 半導体装置
JP2013073957A (ja) * 2011-09-26 2013-04-22 Diamond Electric Mfg Co Ltd 電動パワーステアリングコントロールユニット

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29510335U1 (de) * 1995-06-26 1995-08-24 Siemens AG, 80333 München Elektronisches kombiniertes Logik-Leistungsmodul
FR2753848B1 (fr) * 1996-09-26 1998-12-11 Moteur electrique a commande electronique integree
DE19832710A1 (de) * 1998-07-14 2000-01-27 Siemens Ag Elektrooptische Baugruppe
DE19904279B4 (de) * 1999-02-03 2005-09-01 Sew-Eurodrive Gmbh & Co. Kg Halbleitervorrichtung
DE19922176C2 (de) 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
DE10042839B4 (de) * 2000-08-30 2009-01-29 Infineon Technologies Ag Elektronisches Bauteil mit Wärmesenke und Verfahren zu seiner Herstellung
DE10100679A1 (de) 2001-01-09 2002-07-11 Abb Research Ltd Träger für Bauelemente der Mikrosystemtechnik
DE10102621B4 (de) * 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh Leistungsmodul
DE10204200A1 (de) 2002-02-01 2003-08-21 Conti Temic Microelectronic Leistungsmodul
DE102005049872B4 (de) * 2005-10-18 2010-09-23 Continental Automotive Gmbh IC-Bauelement mit Kühlanordnung
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
DE102019215793A1 (de) 2019-10-14 2021-04-15 Vitesco Technologies GmbH Verdrahtungssubstrat für ein Halbleiterbauteil und Verfahren zur Herstellung eines Verdrahtungssubstrats
FR3164341A1 (fr) * 2024-07-03 2026-01-09 Valeo Eautomotive Germany Gmbh Circuit imprimé à substrat métallique isolé avec dispositif de refroidissement intégré

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180414A (en) * 1978-07-10 1979-12-25 Optical Coating Laboratory, Inc. Concentrator solar cell array module
JPS5899172A (ja) * 1981-12-07 1983-06-13 株式会社日立製作所 電気絶縁基板
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
DE3777324D1 (de) * 1986-10-15 1992-04-16 Sanyo Electric Co Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann.
JP2609724B2 (ja) * 1989-06-28 1997-05-14 株式会社日立製作所 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004048013A (ja) * 2002-07-08 2004-02-12 Siemens Ag エレクトロニクスユニット及びその製造方法
JP2005259880A (ja) * 2004-03-10 2005-09-22 Fuji Electric Holdings Co Ltd 半導体装置
JP2013073957A (ja) * 2011-09-26 2013-04-22 Diamond Electric Mfg Co Ltd 電動パワーステアリングコントロールユニット

Also Published As

Publication number Publication date
DE4238417A1 (https=) 1993-05-19
GB2261549A (en) 1993-05-19
GB9223021D0 (en) 1992-12-16

Similar Documents

Publication Publication Date Title
JPH05136304A (ja) 半導体モジユール及びそれを用いたパワー制御装置
JPH11204700A (ja) 放熱フィン一体型パワーモジュール
JP2002057258A (ja) 熱伝導基板とその製造方法、およびパワーモジュール
JP4421081B2 (ja) パワーモジュールとその製造方法
JP2636602B2 (ja) 半導体装置
JPH0529490A (ja) 半導体搭載用回路基板
JPS622587A (ja) ハイパワ−用混成集積回路
JPH10178243A (ja) 放熱板付きプリント回路基板およびその製造方法
JP2726515B2 (ja) 半導体塔載用回路基板及びその製造方法
JPH05218606A (ja) 回路装置
CN224054780U (zh) 一种芯片封装结构及通信设备
CN203690284U (zh) 半导体装置
JPH11186479A (ja) 放熱板付き表面実装部品
TWI576930B (zh) Circuit package of circuit component module and its product
JP2019204869A (ja) 放熱回路基板とその製造方法及び半導体装置
JPH07326708A (ja) マルチチップモジュール半導体装置
WO2023085073A1 (ja) 実装基板、及び実装基板を搭載した電気機器
JPH0610717Y2 (ja) 混成集積回路
CN205211735U (zh) 电源管理集成电路的封装元件
JPH06314707A (ja) 混成集積回路
JP2004014896A (ja) 樹脂封止型半導体装置およびその製造方法
JP3933519B2 (ja) プリント配線板の製造方法
JPH01137690A (ja) 電気回路基板
JP2001024310A (ja) プリント基板の製造方法
JPS62106651A (ja) 電子部品の実装構造