GB2261549A - Cooling arrangement for a semiconductor module and manufacturing method thereof - Google Patents

Cooling arrangement for a semiconductor module and manufacturing method thereof Download PDF

Info

Publication number
GB2261549A
GB2261549A GB9223021A GB9223021A GB2261549A GB 2261549 A GB2261549 A GB 2261549A GB 9223021 A GB9223021 A GB 9223021A GB 9223021 A GB9223021 A GB 9223021A GB 2261549 A GB2261549 A GB 2261549A
Authority
GB
United Kingdom
Prior art keywords
copper foil
semiconductor module
control device
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9223021A
Other languages
English (en)
Other versions
GB9223021D0 (en
Inventor
Koyo Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9223021D0 publication Critical patent/GB9223021D0/en
Publication of GB2261549A publication Critical patent/GB2261549A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9223021A 1991-11-14 1992-11-03 Cooling arrangement for a semiconductor module and manufacturing method thereof Withdrawn GB2261549A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3298895A JPH05136304A (ja) 1991-11-14 1991-11-14 半導体モジユール及びそれを用いたパワー制御装置

Publications (2)

Publication Number Publication Date
GB9223021D0 GB9223021D0 (en) 1992-12-16
GB2261549A true GB2261549A (en) 1993-05-19

Family

ID=17865549

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9223021A Withdrawn GB2261549A (en) 1991-11-14 1992-11-03 Cooling arrangement for a semiconductor module and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JPH05136304A (https=)
DE (1) DE4238417A1 (https=)
GB (1) GB2261549A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848819B1 (en) 1999-05-12 2005-02-01 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement
US6952347B2 (en) 2001-01-20 2005-10-04 Conti Temic Microelectronic Gmbh Power module
US7215023B2 (en) 2002-02-01 2007-05-08 Conti Temic Microelectronic Gmbh Power module
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
FR3164341A1 (fr) * 2024-07-03 2026-01-09 Valeo Eautomotive Germany Gmbh Circuit imprimé à substrat métallique isolé avec dispositif de refroidissement intégré

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29510335U1 (de) * 1995-06-26 1995-08-24 Siemens AG, 80333 München Elektronisches kombiniertes Logik-Leistungsmodul
FR2753848B1 (fr) * 1996-09-26 1998-12-11 Moteur electrique a commande electronique integree
DE19832710A1 (de) * 1998-07-14 2000-01-27 Siemens Ag Elektrooptische Baugruppe
DE19904279B4 (de) * 1999-02-03 2005-09-01 Sew-Eurodrive Gmbh & Co. Kg Halbleitervorrichtung
DE10042839B4 (de) * 2000-08-30 2009-01-29 Infineon Technologies Ag Elektronisches Bauteil mit Wärmesenke und Verfahren zu seiner Herstellung
DE10100679A1 (de) 2001-01-09 2002-07-11 Abb Research Ltd Träger für Bauelemente der Mikrosystemtechnik
DE10230712B4 (de) * 2002-07-08 2006-03-23 Siemens Ag Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger
JP4524570B2 (ja) * 2004-03-10 2010-08-18 富士電機システムズ株式会社 半導体装置
DE102005049872B4 (de) * 2005-10-18 2010-09-23 Continental Automotive Gmbh IC-Bauelement mit Kühlanordnung
JP5846824B2 (ja) * 2011-09-26 2016-01-20 ダイヤモンド電機株式会社 電動パワーステアリングコントロールユニット
DE102019215793A1 (de) 2019-10-14 2021-04-15 Vitesco Technologies GmbH Verdrahtungssubstrat für ein Halbleiterbauteil und Verfahren zur Herstellung eines Verdrahtungssubstrats

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2026767A (en) * 1978-07-10 1980-02-06 Optical Coating Laboratory Inc Concentrator solar cell array module
EP0081365A1 (en) * 1981-12-07 1983-06-15 Hitachi, Ltd. Electrically insulating silicon carbide sintered body
US4965660A (en) * 1983-09-22 1990-10-23 Hitachi, Ltd. Integrated circuit package having heat sink bonded with resinous adhesive

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3777324D1 (de) * 1986-10-15 1992-04-16 Sanyo Electric Co Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann.
JP2609724B2 (ja) * 1989-06-28 1997-05-14 株式会社日立製作所 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2026767A (en) * 1978-07-10 1980-02-06 Optical Coating Laboratory Inc Concentrator solar cell array module
EP0081365A1 (en) * 1981-12-07 1983-06-15 Hitachi, Ltd. Electrically insulating silicon carbide sintered body
US4965660A (en) * 1983-09-22 1990-10-23 Hitachi, Ltd. Integrated circuit package having heat sink bonded with resinous adhesive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848819B1 (en) 1999-05-12 2005-02-01 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement
US6952347B2 (en) 2001-01-20 2005-10-04 Conti Temic Microelectronic Gmbh Power module
US7215023B2 (en) 2002-02-01 2007-05-08 Conti Temic Microelectronic Gmbh Power module
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
FR3164341A1 (fr) * 2024-07-03 2026-01-09 Valeo Eautomotive Germany Gmbh Circuit imprimé à substrat métallique isolé avec dispositif de refroidissement intégré

Also Published As

Publication number Publication date
DE4238417A1 (https=) 1993-05-19
JPH05136304A (ja) 1993-06-01
GB9223021D0 (en) 1992-12-16

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)