JPH0510361Y2 - - Google Patents

Info

Publication number
JPH0510361Y2
JPH0510361Y2 JP1988110291U JP11029188U JPH0510361Y2 JP H0510361 Y2 JPH0510361 Y2 JP H0510361Y2 JP 1988110291 U JP1988110291 U JP 1988110291U JP 11029188 U JP11029188 U JP 11029188U JP H0510361 Y2 JPH0510361 Y2 JP H0510361Y2
Authority
JP
Japan
Prior art keywords
mold
lead frame
resin material
transfer passage
molten resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988110291U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231129U (enEXAMPLES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988110291U priority Critical patent/JPH0510361Y2/ja
Publication of JPH0231129U publication Critical patent/JPH0231129U/ja
Application granted granted Critical
Publication of JPH0510361Y2 publication Critical patent/JPH0510361Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Reinforced Plastic Materials (AREA)
JP1988110291U 1988-08-22 1988-08-22 Expired - Lifetime JPH0510361Y2 (enEXAMPLES)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988110291U JPH0510361Y2 (enEXAMPLES) 1988-08-22 1988-08-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988110291U JPH0510361Y2 (enEXAMPLES) 1988-08-22 1988-08-22

Publications (2)

Publication Number Publication Date
JPH0231129U JPH0231129U (enEXAMPLES) 1990-02-27
JPH0510361Y2 true JPH0510361Y2 (enEXAMPLES) 1993-03-15

Family

ID=31347317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988110291U Expired - Lifetime JPH0510361Y2 (enEXAMPLES) 1988-08-22 1988-08-22

Country Status (1)

Country Link
JP (1) JPH0510361Y2 (enEXAMPLES)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737688Y2 (ja) * 1990-10-23 1995-08-30 帝人株式会社 フィルターエレメント
JP2570157B2 (ja) * 1993-12-10 1997-01-08 日本電気株式会社 樹脂封止用金型
JP5234884B2 (ja) * 2006-12-20 2013-07-10 住友重機械工業株式会社 樹脂封止金型

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501662A (enEXAMPLES) * 1973-05-07 1975-01-09
JPS61146517A (ja) * 1984-12-20 1986-07-04 Sanyo Electric Co Ltd 半導体装置の樹脂封止用金型

Also Published As

Publication number Publication date
JPH0231129U (enEXAMPLES) 1990-02-27

Similar Documents

Publication Publication Date Title
DE69501632T2 (de) Harzformmaschine mit Trennfolie
KR100419356B1 (ko) 전자 부품, 전자 부품의 수지 밀봉 방법 및 장치
JPH0510361Y2 (enEXAMPLES)
JPH11126787A (ja) 電子部品の樹脂封止成形方法及び金型
JP2626971B2 (ja) 電子部品の樹脂封止成形方法及び金型
JPS622456B2 (enEXAMPLES)
JPH056094Y2 (enEXAMPLES)
JPH058106Y2 (enEXAMPLES)
JPH05175396A (ja) リードフレーム及びモールド方法
JPH1092856A (ja) チップサイズパッケージの樹脂封止方法及び樹脂封止装置
JP3195840B2 (ja) 樹脂モールド装置及びその制御方法
JP3214790B2 (ja) 樹脂モールド装置及び樹脂モールド方法
JP3793633B2 (ja) 電子部品の樹脂封止成形方法
JPH058253A (ja) 電子部品の樹脂封止成形装置
JP2736554B2 (ja) 樹脂封止成形方法及び樹脂注入ゲートの構成方法
JPH01297225A (ja) 電子部品の樹脂封止成形方法とその成形用金型
JPH06177192A (ja) 樹脂モールド装置
JPH01134955A (ja) 半導体類のパッケージ成形方法とその成形装置及び成形用金型
JPH06177191A (ja) 樹脂モールド装置
JP2772486B2 (ja) 電子部品の樹脂封止成形用金型
JPH0482236A (ja) 電子部品の樹脂封止成形方法及び装置
JPH1050746A (ja) 電子部品の樹脂封止成形方法及びその成形方法に用い られる樹脂材料
US6911719B1 (en) Lead frame for resin sealed semiconductor device
JPH0628250Y2 (ja) 電子部品の樹脂封止成形用金型
JPH05166866A (ja) 電子部品の樹脂封止成形方法と装置及びリードフレーム