JPH0474859B2 - - Google Patents

Info

Publication number
JPH0474859B2
JPH0474859B2 JP57051237A JP5123782A JPH0474859B2 JP H0474859 B2 JPH0474859 B2 JP H0474859B2 JP 57051237 A JP57051237 A JP 57051237A JP 5123782 A JP5123782 A JP 5123782A JP H0474859 B2 JPH0474859 B2 JP H0474859B2
Authority
JP
Japan
Prior art keywords
wire
electrode
tip
ball
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57051237A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58169918A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57051237A priority Critical patent/JPS58169918A/ja
Priority to US06/476,268 priority patent/US4564734A/en
Priority to KR1019830001087A priority patent/KR920005630B1/ko
Priority to GB8308622A priority patent/GB2117299B/en
Priority to FR8305253A priority patent/FR2524704B1/fr
Priority to IT2038283A priority patent/IT1161808B/it
Publication of JPS58169918A publication Critical patent/JPS58169918A/ja
Priority to GB08412000A priority patent/GB2137914A/en
Publication of JPH0474859B2 publication Critical patent/JPH0474859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/32—Accessories
    • B23K9/325—Devices for supplying or evacuating shielding gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
    • B23K28/02—Combined welding or cutting procedures or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H10W72/01551—
    • H10W72/07125—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/352—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/934—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Wire Bonding (AREA)
  • Arc Welding In General (AREA)
JP57051237A 1982-03-31 1982-03-31 ワイヤボンダ Granted JPS58169918A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP57051237A JPS58169918A (ja) 1982-03-31 1982-03-31 ワイヤボンダ
US06/476,268 US4564734A (en) 1982-03-31 1983-03-17 Wire bonder
KR1019830001087A KR920005630B1 (ko) 1982-03-31 1983-03-17 와이어본더를 사용한 수지봉지 반도체장치의 제조방법
GB8308622A GB2117299B (en) 1982-03-31 1983-03-29 Improvements in wire bonders
FR8305253A FR2524704B1 (fr) 1982-03-31 1983-03-30 Appareil pour la fixation de fils par soudage, notamment pour composants a semi-conducteurs
IT2038283A IT1161808B (it) 1982-03-31 1983-03-30 Saldafili per saldare fili sottili di metallo facilmente ossidabile con voncolo per termocompressori
GB08412000A GB2137914A (en) 1982-03-31 1984-05-10 Wire bonders

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57051237A JPS58169918A (ja) 1982-03-31 1982-03-31 ワイヤボンダ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1078242A Division JPH01280330A (ja) 1989-03-31 1989-03-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS58169918A JPS58169918A (ja) 1983-10-06
JPH0474859B2 true JPH0474859B2 (enExample) 1992-11-27

Family

ID=12881333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57051237A Granted JPS58169918A (ja) 1982-03-31 1982-03-31 ワイヤボンダ

Country Status (6)

Country Link
US (1) US4564734A (enExample)
JP (1) JPS58169918A (enExample)
KR (1) KR920005630B1 (enExample)
FR (1) FR2524704B1 (enExample)
GB (2) GB2117299B (enExample)
IT (1) IT1161808B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4732313A (en) * 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
GB2165178A (en) * 1984-10-05 1986-04-09 Hitachi Ltd Method and apparatus for wire bonding
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
FR2586599B1 (fr) * 1985-09-03 1990-01-12 Thomson Csf Dispositif de soudage par thermocompression
US4976393A (en) * 1986-12-26 1990-12-11 Hitachi, Ltd. Semiconductor device and production process thereof, as well as wire bonding device used therefor
EP0276928B1 (en) * 1987-01-26 1994-10-26 Hitachi, Ltd. Wire Bonding
US5285949A (en) * 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
JPH0737889A (ja) * 1993-07-16 1995-02-07 Nec Corp 半導体製造装置
JP3455626B2 (ja) * 1996-03-13 2003-10-14 株式会社東芝 半導体装置の製造方法および製造装置
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
JP3407275B2 (ja) 1998-10-28 2003-05-19 インターナショナル・ビジネス・マシーンズ・コーポレーション バンプ及びその形成方法
US6337453B1 (en) * 1999-06-25 2002-01-08 West Bond, Inc. Method and apparatus for arc-forming a bonding wire ball with attenuated electro-magnetic interference
US6234376B1 (en) * 1999-07-13 2001-05-22 Kulicke & Soffa Investments, Inc. Supplying a cover gas for wire ball bonding
US6450713B2 (en) * 1999-09-10 2002-09-17 Hewlett-Packard Company Print media ejection system
TWI222388B (en) * 2002-07-19 2004-10-21 Esec Trading Sa Device with an electrode for the formation of a ball at the end of a wire
JP4749177B2 (ja) * 2006-02-15 2011-08-17 パナソニック株式会社 接続構造体および接続構造体の製造方法
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
US8357998B2 (en) * 2009-02-09 2013-01-22 Advanced Semiconductor Engineering, Inc. Wirebonded semiconductor package
US8096461B2 (en) * 2009-09-03 2012-01-17 Advanced Semiconductor Engineering, Inc. Wire-bonding machine with cover-gas supply device
JP5916814B2 (ja) * 2014-08-06 2016-05-11 株式会社カイジョー ボンディング方法及びボンディング装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL259859A (enExample) * 1960-01-14 1900-01-01
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
JPS55123198A (en) * 1979-03-16 1980-09-22 Tokyo Shibaura Electric Co Method of forming ball of aluminum wire end
DE2923440A1 (de) * 1979-06-09 1980-12-11 Itt Ind Gmbh Deutsche Verfahren zum befestigen und/oder elektrischen verbinden von halbleiterkoerpern und/oder von deren elektrisch leitenden metallteilen
JPS5623750A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Ultrasonic wire bonding apparatus
DE3037735A1 (de) * 1980-10-06 1982-05-13 TS-Electronic Vertriebs-GmbH, 8000 München Kontaktierverfahren und kontaktiermaschine zur durchfuehrung des verfahrens
US4388512A (en) * 1981-03-09 1983-06-14 Raytheon Company Aluminum wire ball bonding apparatus and method
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
JPS58154241A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置及びその製法
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation

Also Published As

Publication number Publication date
GB2117299A (en) 1983-10-12
FR2524704A1 (fr) 1983-10-07
KR920005630B1 (ko) 1992-07-10
GB8308622D0 (en) 1983-05-05
FR2524704B1 (fr) 1987-03-06
GB2137914A (en) 1984-10-17
GB2117299B (en) 1986-05-21
IT8320382A0 (it) 1983-03-30
KR840004306A (ko) 1984-10-10
GB8412000D0 (en) 1984-06-13
US4564734A (en) 1986-01-14
JPS58169918A (ja) 1983-10-06
IT1161808B (it) 1987-03-18

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