IT1161808B - Saldafili per saldare fili sottili di metallo facilmente ossidabile con voncolo per termocompressori - Google Patents

Saldafili per saldare fili sottili di metallo facilmente ossidabile con voncolo per termocompressori

Info

Publication number
IT1161808B
IT1161808B IT2038283A IT2038283A IT1161808B IT 1161808 B IT1161808 B IT 1161808B IT 2038283 A IT2038283 A IT 2038283A IT 2038283 A IT2038283 A IT 2038283A IT 1161808 B IT1161808 B IT 1161808B
Authority
IT
Italy
Prior art keywords
wire
welding
bonder
thermocompressors
ball
Prior art date
Application number
IT2038283A
Other languages
English (en)
Italian (it)
Other versions
IT8320382A0 (it
Inventor
Okikawa Susumu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8320382A0 publication Critical patent/IT8320382A0/it
Application granted granted Critical
Publication of IT1161808B publication Critical patent/IT1161808B/it

Links

Classifications

    • H10P95/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/32—Accessories
    • B23K9/325—Devices for supplying or evacuating shielding gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
    • B23K28/02—Combined welding or cutting procedures or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H10W72/01551—
    • H10W72/07125—
    • H10W72/07141—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/352—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/884—
    • H10W72/934—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Wire Bonding (AREA)
  • Arc Welding In General (AREA)
IT2038283A 1982-03-31 1983-03-30 Saldafili per saldare fili sottili di metallo facilmente ossidabile con voncolo per termocompressori IT1161808B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57051237A JPS58169918A (ja) 1982-03-31 1982-03-31 ワイヤボンダ

Publications (2)

Publication Number Publication Date
IT8320382A0 IT8320382A0 (it) 1983-03-30
IT1161808B true IT1161808B (it) 1987-03-18

Family

ID=12881333

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2038283A IT1161808B (it) 1982-03-31 1983-03-30 Saldafili per saldare fili sottili di metallo facilmente ossidabile con voncolo per termocompressori

Country Status (6)

Country Link
US (1) US4564734A (enExample)
JP (1) JPS58169918A (enExample)
KR (1) KR920005630B1 (enExample)
FR (1) FR2524704B1 (enExample)
GB (2) GB2117299B (enExample)
IT (1) IT1161808B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4732313A (en) * 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
GB2165178A (en) * 1984-10-05 1986-04-09 Hitachi Ltd Method and apparatus for wire bonding
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
FR2586599B1 (fr) * 1985-09-03 1990-01-12 Thomson Csf Dispositif de soudage par thermocompression
US4976393A (en) * 1986-12-26 1990-12-11 Hitachi, Ltd. Semiconductor device and production process thereof, as well as wire bonding device used therefor
EP0276928B1 (en) * 1987-01-26 1994-10-26 Hitachi, Ltd. Wire Bonding
US5285949A (en) * 1987-01-26 1994-02-15 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
JPH0737889A (ja) * 1993-07-16 1995-02-07 Nec Corp 半導体製造装置
JP3455626B2 (ja) * 1996-03-13 2003-10-14 株式会社東芝 半導体装置の製造方法および製造装置
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
JP3407275B2 (ja) 1998-10-28 2003-05-19 インターナショナル・ビジネス・マシーンズ・コーポレーション バンプ及びその形成方法
US6337453B1 (en) * 1999-06-25 2002-01-08 West Bond, Inc. Method and apparatus for arc-forming a bonding wire ball with attenuated electro-magnetic interference
US6234376B1 (en) * 1999-07-13 2001-05-22 Kulicke & Soffa Investments, Inc. Supplying a cover gas for wire ball bonding
US6450713B2 (en) * 1999-09-10 2002-09-17 Hewlett-Packard Company Print media ejection system
TWI222388B (en) * 2002-07-19 2004-10-21 Esec Trading Sa Device with an electrode for the formation of a ball at the end of a wire
JP4749177B2 (ja) * 2006-02-15 2011-08-17 パナソニック株式会社 接続構造体および接続構造体の製造方法
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
US8357998B2 (en) * 2009-02-09 2013-01-22 Advanced Semiconductor Engineering, Inc. Wirebonded semiconductor package
US8096461B2 (en) * 2009-09-03 2012-01-17 Advanced Semiconductor Engineering, Inc. Wire-bonding machine with cover-gas supply device
JP5916814B2 (ja) * 2014-08-06 2016-05-11 株式会社カイジョー ボンディング方法及びボンディング装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL259859A (enExample) * 1960-01-14 1900-01-01
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
JPS55123198A (en) * 1979-03-16 1980-09-22 Tokyo Shibaura Electric Co Method of forming ball of aluminum wire end
DE2923440A1 (de) * 1979-06-09 1980-12-11 Itt Ind Gmbh Deutsche Verfahren zum befestigen und/oder elektrischen verbinden von halbleiterkoerpern und/oder von deren elektrisch leitenden metallteilen
JPS5623750A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Ultrasonic wire bonding apparatus
DE3037735A1 (de) * 1980-10-06 1982-05-13 TS-Electronic Vertriebs-GmbH, 8000 München Kontaktierverfahren und kontaktiermaschine zur durchfuehrung des verfahrens
US4388512A (en) * 1981-03-09 1983-06-14 Raytheon Company Aluminum wire ball bonding apparatus and method
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
JPS58154241A (ja) * 1982-03-10 1983-09-13 Hitachi Ltd 半導体装置及びその製法
US4476365A (en) * 1982-10-08 1984-10-09 Fairchild Camera & Instrument Corp. Cover gas control of bonding ball formation

Also Published As

Publication number Publication date
GB2117299A (en) 1983-10-12
FR2524704A1 (fr) 1983-10-07
KR920005630B1 (ko) 1992-07-10
GB8308622D0 (en) 1983-05-05
FR2524704B1 (fr) 1987-03-06
GB2137914A (en) 1984-10-17
GB2117299B (en) 1986-05-21
IT8320382A0 (it) 1983-03-30
KR840004306A (ko) 1984-10-10
GB8412000D0 (en) 1984-06-13
US4564734A (en) 1986-01-14
JPS58169918A (ja) 1983-10-06
JPH0474859B2 (enExample) 1992-11-27

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940325