JPS62136831A - ワイヤボンデイング用ボ−ルの形成方法 - Google Patents

ワイヤボンデイング用ボ−ルの形成方法

Info

Publication number
JPS62136831A
JPS62136831A JP60278641A JP27864185A JPS62136831A JP S62136831 A JPS62136831 A JP S62136831A JP 60278641 A JP60278641 A JP 60278641A JP 27864185 A JP27864185 A JP 27864185A JP S62136831 A JPS62136831 A JP S62136831A
Authority
JP
Japan
Prior art keywords
wire
ball
discharge
discharge electrode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60278641A
Other languages
English (en)
Inventor
Saneyasu Hirota
弘田　実保
Kazumichi Machida
一道 町田
Masaaki Shimotomai
下斗米　将昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60278641A priority Critical patent/JPS62136831A/ja
Priority to DE19863642221 priority patent/DE3642221A1/de
Priority to US06/939,962 priority patent/US4739142A/en
Publication of JPS62136831A publication Critical patent/JPS62136831A/ja
Pending legal-status Critical Current

Links

Classifications

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ＩＣやトランジスタなどの製造工程におい
て、金属ワイヤを接続するワイヤボンディング方法、特
にボールボンディング方法に関し、金属ワイヤをボール
ボンディングするためのボールの形成方法に関するもの
である。
〔従来の技術〕
従来ボンディング用金属ワイヤとしては、金ワイヤが使
用されているが、この場合、コストが高くつくことと、
シリコンチップ上のアルミ電極との接合部の長期信頼性
が低いという欠点を有するため、金に代えて、銅、アル
ミニウム、パラジウム又はそれらの合金からなるワイヤ
を用いることが考えられる。
またボンディング工程においては、方向性をなくすため
、ワイヤ先端を球状化することが要求され、従来の金ワ
イヤにおいては、ワイヤ先端と可動電極（放電電極）と
、の間に高電圧を印加し、放電させることによってワイ
ヤの先端に入熱を与え、溶融球状化している。この場合
、従来の全ての例において、絶縁破壊の容易さから、電
極をプラス。
ワイヤ側をマイナスとしている。
〔発明が解決しようとする問題点〕
ここで表面に数１０人程度の自然酸化被膜を有している
銅ワイヤに対して、従来の金ワイヤに対するものと同様
の方法でボール形成を行なった場合の状況を第３図に模
式的に示す。図において、１は銅ワイヤ、２は放電電極
、３はアーク、４は電源、５はボンディングツールであ
るキャピラリチップ、６は電極が形成され、熱が投与さ
れる部分、７はアルゴン等の不活性ガス雰囲気、８は溶
融履歴を経て形成された部分である。
この方法では、放電時、マイナス極側おいては、熱電子
放出がより安定な仕事関数の小さい点（即ち、わずかな
金属酸化膜）を求めてその電橋領域を広げようとする物
理的性質がある。従って、ワイヤ１がマイナスの場合に
は、第３図（ａ）に示すようにワイヤ１の上方までアー
ク３が形成され、ワイヤ１の表皮部から熱が投与される
。その結果、第３図（ｂ）に示すように、先端に芯、即
ちワイヤｌの未溶融部１ａを残した欠陥ボール８を発生
しがちである。この欠陥ボール８は形状的には球状化し
ていても、その内部に未溶融部１ａを残し、シリコンチ
ップ上のアルミ電極への接合の際に、ボールが変形しに
くく、シリコンチップ損傷の要因となる。
ただし、従来の金ワイヤの場合では、その表面に酸化物
を形成しないので、このような問題は全くなく、放電の
容易さから、専ら上述のごときワイヤをマイナスにして
用いていた。
この発明は上記のような問題点を解決するためになされ
たもので、銅ワイヤ等を用いる場合において、接合の際
にシリコンチップに損傷を与えることのないボールを形
成できるワイヤボンディング用ボールの形成方法を提供
することを目的としている。
〔問題点を解決するための手段〕
この発明に係るワイヤボンディング用ボールの形成方法
は、不活性ガス雰囲気中で金属ワイヤをプラス、放電電
極をマイナスとして両者間に高電圧を印加して、この金
属ワイヤの先端部を放電によって溶融させてボールを形
成し、その際放電後期は金属ワイヤをマイナス、放電電
極をプラスとしたものである。
〔作用〕
この発明においては、金属ワイヤをプラスとしたことか
ら、放電領域が広がるという現象は起こらず、放電電極
との距離が最も短いワイヤ先端部にのみ電極が形成され
、ワイヤ先端に集中的に熱、　が投与されてワイヤ先端
部が完全溶融され、又放電後期は不活性ガス雰囲気中で
、金属ワイヤをマンナスとしたことから、マイナス極側
におけるアークのクリーニング作用によってボール表面
が清浄化されるものである。
〔実施例〕
以下、本発明の実施例を図について説明する。
第１図及び第２図は本発明の一実施例によるワイヤボン
ディング用ボールの形成方法を模式的に示したものであ
る。図において、第３図と同一符号は同図と同一のもの
を示し、１４は交流電源、１８は溶融履歴を経て形成さ
れたボールである。
本実施例の方法では、まず銅ワイヤ１をプラス。
放電電極２をマイナスにして両者間に高電圧を印加する
（第２図Ａ参照）、すると銅ワイヤ１の先端部と放電電
極２との間で放電が起こってアーク３が形成され、銅ワ
イヤ１の先端部のみに熱が投与されて該先端部が溶融さ
れ、ワイヤ１の溶融部分はワイヤ１の先端部のみに限定
され、その溶融部は完全な球状を保ちながらその体積を
増加させていく。
電圧を印加してから時間ｔ１が経過し、放電後期になる
と、今度は銅ワイヤ１をマイナス、放電電極２をプラス
にする（第２図参照）、するとマイナス極側におけるア
ーク３のクリーニング作用によってボール１８の表面が
清浄化され、時間ｔ２が経過すると所望のボール１８が
形成されるので、後は従来公知の方法と同様の方法によ
って銅ワイヤｌのボール１８を半導体チップのアルミ電
極にボールボンディングするとともに、銅ワイヤの他端
をリードに、ステッチボンディングする。
以上のような本実施例の方法では、銅ワイヤをプラス、
放電電極をマイナスにしてボール形成を行なうようにし
たので、ワイヤ先端部に集中的に熱を投与でき、球状を
有し、内部が完全溶融したボールを安定に得ることが可
能となり、その結果シリコンチップ上のアルミ電極への
接合の際にボールの変形が容易となり、シリコンチップ
損傷の懸念を解消できる。
また上述のように内部を完全溶融したボールが得られる
場合であっても、ボール形成時に酸化を受けると、酸素
の混入によってボールの硬度が高くなり、又ボール表面
が酸化すると形成されるボールが真球にならず、ボンデ
ィング性が劣化することとなる。これに対し本方法では
、ボール形成を不活性ガス雰囲気中で行なっているので
、ボールへの酸素の混入を防止でき、又放電後期に不活
性ガス雰囲気中で銅ワイヤの極性をマイナスとしたので
、アークの表面清浄化作用によってボール表面の酸化を
防止でき、その結果ボールの硬度上昇を防止し、かつボ
ール形状を真球にしてボンディング性を保証できる。
また上述のように銅ワイヤを用いた場合において、内部
が完全溶融されかつ表面が清浄で真球のボールが得られ
、銅ワイヤのボールボンディング性が確保できる結果、
現在用いられている金ワイヤに代えて低廉な銅ワイヤの
使用が可能となり、大幅な低コスト化を実現できるとと
もに、チップ上のアルミ電極との接合部の長期信頼性を
向上できる。
なお上記実施例では金属ワイヤとして銅ワイヤを用いる
場合について説明したが、これはアルミニウム、パラジ
ウム、銀又はこれらの低元素添加合金あるいは低元素添
加銅合金のワイヤを用いる場合についても同様に適用で
きる。
〔発明の効果〕
以上のように、本発明に係るワイヤボンディング用ボー
ルの形成方法によれば、不活性ガス雰囲気中で金属ワイ
ヤをプラス、放電電極をマイナスとして両者間に高電圧
を印加して、この金属ワイヤの先端部°を放電によって
溶融させてボールを形成し、その際放電後期は金属ワイ
ヤをマイナス。
放電電極をプラスとしたので、シリコンチップに損傷を
与えることなく、金属ワイヤを良好にチップ上の電極に
接合でき、その結果金ワイヤに代えて他の低廉な金属ワ
イヤの使用を可能とできる効果がある。
【図面の簡単な説明】
第１図（ａ）、　（ｂ）は各々本発明の一実施例による
ワイヤボンディング用ボールの形成方法Ｇこおしするア
ーク放電時及びボール形成後の状態を示す模式図、第２
図は上記方法を説明するための印加電圧のｌ存間的変化
を示す図、第３図（ａｌ、　（ｂ）は各々従来の方法に
おけるアーク放電時及びボール形成後の状態を示す模式
図である。 １・・・銅ワイヤ（金属ワイヤ）、２・・・放電電極、
７・・・不活性ガス雰囲気、１８・・・ボール。

Claims (1)

  1. 【特許請求の範囲】 １）金属ワイヤを半導体チップの電極にボールボンディ
    ングするためのボールの形成方法であって、 不活性ガス雰囲気中で金属ワイヤをプラス、放電電極を
    マイナスとして両者間に高電圧を印加して、この金属ワ
    イヤの先端部を放電によって溶融させてボールを形成し
    、 その際、放電後期は金属ワイヤをマイナス、放電電極を
    プラスとしたことを特徴とするワイヤボンディング用ボ
    ールの形成方法。
JP60278641A 1985-12-10 1985-12-10 ワイヤボンデイング用ボ−ルの形成方法 Pending JPS62136831A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60278641A JPS62136831A (ja) 1985-12-10 1985-12-10 ワイヤボンデイング用ボ−ルの形成方法
DE19863642221 DE3642221A1 (de) 1985-12-10 1986-12-10 Verfahren zur herstellung eines balles am ende eines metalldrahtes
US06/939,962 US4739142A (en) 1985-12-10 1986-12-10 Method of producing a wire bonding ball

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60278641A JPS62136831A (ja) 1985-12-10 1985-12-10 ワイヤボンデイング用ボ−ルの形成方法

Publications (1)

Publication Number Publication Date
JPS62136831A true JPS62136831A (ja) 1987-06-19

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ID=17600106

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Application Number Title Priority Date Filing Date
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JP (1) JPS62136831A (ja)
DE (1) DE3642221A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097100A (en) * 1991-01-25 1992-03-17 Sundstrand Data Control, Inc. Noble metal plated wire and terminal assembly, and method of making the same
DE10038510C2 (de) * 2000-08-08 2002-11-07 Bosch Gmbh Robert Verfahren zur Kontaktierung elektronischer Schaltungen und elektronische Schaltung
AT507228B1 (de) * 2008-07-30 2010-08-15 Fronius Int Gmbh Verfahren und vorrichtung zur formung des schweissdrahtendes
DE102008060862B4 (de) 2008-12-09 2010-10-28 Werthschützky, Roland, Prof. Dr.-Ing.habil. Verfahren zur miniaturisierbaren Kontaktierung isolierter Drähte

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58118122A (ja) * 1982-01-06 1983-07-14 Hitachi Ltd 金属ワイヤのボ−ル形成法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3598954A (en) * 1969-05-12 1971-08-10 North American Rockwell Control for reverse-polarity welding
JPS53123663A (en) * 1977-04-04 1978-10-28 Mitsubishi Electric Corp Cutting device of metal thin wire
US4388512A (en) * 1981-03-09 1983-06-14 Raytheon Company Aluminum wire ball bonding apparatus and method
DD221310A1 (de) * 1983-11-29 1985-04-17 Mikroelektronik Zt Forsch Tech Anordnung zum anschmelzen von kugelaehnlichen verdickungen
DE3606244A1 (de) * 1986-02-26 1987-08-27 Ruhrtal Gmbh Kontaktsystem fuer ein elektrisches schaltgeraet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58118122A (ja) * 1982-01-06 1983-07-14 Hitachi Ltd 金属ワイヤのボ−ル形成法

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DE3642221C2 (ja) 1991-11-28
DE3642221A1 (de) 1987-06-11
US4739142A (en) 1988-04-19

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