JPS57103325A - Wire bonding method - Google Patents
Wire bonding methodInfo
- Publication number
- JPS57103325A JPS57103325A JP56174582A JP17458281A JPS57103325A JP S57103325 A JPS57103325 A JP S57103325A JP 56174582 A JP56174582 A JP 56174582A JP 17458281 A JP17458281 A JP 17458281A JP S57103325 A JPS57103325 A JP S57103325A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ball
- capillary
- fine
- post
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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- H01L2224/0554—External layer
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- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To enhance the reliability of a semiconductor device by preparing a fine Au wire having a free end, forming a ball at the free end by discharge machining, performing a wire bonding with this, and avoiding the oxidation of an aluminum wire provided with the semiconductor device in case of forming the ball. CONSTITUTION:An IC chip 2 is secured to the post 5 side of a package 1 having an external lead post 5, and the end ball 8 of a fine Au wire 7 inserted into a capillary 6 is contacted on the pad 4 of an aluminum wire 3 provided at the chip 2 to be bonded. At this time a ball 8 is produced by an arc discharge between electrodes 9 and 10 at the end of the fine Au wire projected from the capillary 6 prior to the contact, the capillary 6 is thereafter lowered to contact the ball 8 with the pad 4 to be bonded. Then, the capillary 6 is moved to allow the fine wire 7 to extend to the post 5 to be secured, and the fine wire is cut. Then, the capillary 6 is pulled up, and a ball 8 is then formed in advance for next treatment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56174582A JPS57103325A (en) | 1981-11-02 | 1981-11-02 | Wire bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56174582A JPS57103325A (en) | 1981-11-02 | 1981-11-02 | Wire bonding method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50064308A Division JPS51140567A (en) | 1975-05-30 | 1975-05-30 | Method for composing semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57103325A true JPS57103325A (en) | 1982-06-26 |
Family
ID=15981070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56174582A Pending JPS57103325A (en) | 1981-11-02 | 1981-11-02 | Wire bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57103325A (en) |
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1981
- 1981-11-02 JP JP56174582A patent/JPS57103325A/en active Pending
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